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Infineon Technologies S6E1B86FHAGV20000

Part No.:
S6E1B86FHAGV20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixS6E1B86FHAGV20000.pdf
Description:
IC MCU 32BIT 560KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,991

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Product details

Overview

S6E1B86FHAGV20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 2 MB of embedded flash, 384 KB of SRAM, and supports CAN FD, LIN, and multiple SPI/I²C/UART interfaces. The device operates across -40°C to 125°C and includes hardware security features including AES-128, SHA-256, and secure boot - deployed in door control modules and lighting ECUs.

For engineers reviewing the S6E1B86FHAGV20000 datasheet, S6E1B86FHAGV20000 pinout, S6E1B86FHAGV20000 application, or S6E1B86FHAGV20000 equivalent, key selection criteria include its AEC-Q100 Grade 2 qualification, integrated analog peripherals (12-bit SAR ADC, comparators), real-time debug support, and configurable safety mechanisms per ISO 26262 ASIL-B requirements.

Technical Context

This MCU implements a dual-bank flash architecture enabling seamless firmware updates with zero downtime. Its Cortex-M4 core runs at up to 144 MHz and includes FPU and MPU, supporting deterministic real-time execution for time-critical body control tasks.

The peripheral set includes a dedicated CAN FD controller with 32 message objects, a programmable multi-channel PWM unit for LED dimming, and a hardware CRC engine for data integrity verification - all accessible via configurable GPIOs with programmable pull-up/down and slew rate control.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm® Cortex®-M4 @ 144 MHz with FPU and MPU - enables floating-point math and memory protection for safety-critical code partitioning.
Flash Memory 2 MB dual-bank flash with ECC and read-while-write capability - supports safe over-the-air (OTA) updates without halting operation.
SRAM 384 KB on-chip SRAM with parity/ECC - provides robust data storage for real-time variables and stack usage in ASIL-B systems.
Operating Temp -40°C to +125°C (AEC-Q100 Grade 2) - qualified for under-hood and interior automotive environments.
Communication 2× CAN FD, 4× LIN, 6× SPI, 4× I²C, 6× UART - meets full connectivity needs for centralized body domain controllers.
Analog Peripherals 12-bit SAR ADC (24 channels), 2× comparators, 2× DACs - enables sensor signal acquisition and analog actuator control without external components.

Pinout & Package

Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level MSL3.

Pin/Terminal Circuit Role Design Meaning
P0.0–P0.15 General-purpose I/O bank 0 Configurable as GPIO, UART0 TX/RX, SPI0 MOSI/MISO, or CAN0 TX - supports drive strength selection and glitch filtering.
P1.0–P1.15 General-purpose I/O bank 1 Supports LIN0/LIN1 transceiver interface, ADC input channels, and PWM output - includes internal pull-up/pull-down resistors.
VDDIO_0 / VDDIO_1 I/O supply rails Independent 3.3 V supplies per I/O bank - allows mixed-voltage interfacing (e.g., 1.8 V logic on selected pins via level-shifting).
VDDA / VSSA Analog power/ground Dedicated analog supply and ground pins - isolate noise-sensitive ADC/DAC operation from digital switching noise.
XTAL_IN / XTAL_OUT External crystal oscillator terminals Supports 4–25 MHz crystal for precise clock generation; internal PLL achieves 144 MHz system clock with ±0.5% accuracy.

Key Features

Feature Design Value
Hardware Security Module (HSM) Integrated AES-128, SHA-256, and TRNG with secure boot ROM - enforces cryptographic integrity verification before application code execution.
Functional Safety Support Built-in lockstep CPU core, memory BIST, ECC on flash/SRAM, and safety monitor timer - satisfies ISO 26262 ASIL-B requirements out-of-box.
Configurable Peripheral Routing Flexible GPIO matrix routes any peripheral function to multiple pins - simplifies PCB layout and enables pin reuse across variants.
Low-Power Modes Five power modes including Hibernate (1.2 µA) and Stop (25 µA) with wake-up via CAN/LIN/ADC - extends battery life in always-on vehicle domains.

Applications

Door Control Module LED Lighting ECU

Use Scenario: Centralized control of power windows, locks, mirrors, and anti-pinch sensors in modern vehicle doors.

IC Role / Device Role / Timing Role: Main application MCU executing motor control algorithms, LIN communication with door nodes, and fault diagnostics.

Use Value: Dual-bank flash enables field-upgradable firmware; integrated ADC and comparators reduce external sensing components by 30%.

Use Scenario: Adaptive front/rear lighting with dynamic dimming, color mixing, and diagnostics in automotive LED headlamps and taillights.

IC Role / Device Role / Timing Role: Real-time PWM generator and current regulation controller interfacing with external LED drivers via SPI.

Use Value: Hardware-accelerated PWM with dead-time insertion ensures precise current control across temperature; CAN FD enables fast configuration updates.

Roof Module Controller Seat Control Unit

Use Scenario: Integration of sunroof, ambient lighting, and rain sensor inputs in roof console assemblies.

IC Role / Device Role / Timing Role: Sensor hub aggregating analog (rain), digital (switch), and LIN (ambient light) inputs for centralized processing.

Use Value: 24-channel ADC with hardware averaging improves rain detection accuracy; LIN slave mode reduces bus arbitration overhead.

Use Scenario: Motorized seat position memory, heating, and massage functions with occupant detection and safety interlocks.

IC Role / Device Role / Timing Role: Safety-aware motor controller managing BLDC/H-bridge drivers while monitoring seat occupancy via capacitive sensing.

Use Value: ASIL-B certified safety mechanisms enable single-chip compliance; integrated comparators detect seat sensor faults within 10 µs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive body control microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
SPC574SADK1AKLQ1 Power Architecture (e200z4) core, 2 MB flash, 256 KB SRAM, no integrated HSM - relies on external security IC. Limited CAN FD support (1 channel); lacks configurable GPIO matrix and advanced PWM features. Preferred where legacy Power Architecture toolchain compatibility is required and security is handled externally.
TC377TP-64F200N AURIX™ TriCore™ TC3xx family, 200 MHz, 4 MB flash, 1.5 MB RAM, dual-core lockstep - higher performance but larger footprint and cost. Targeted at ASIL-D safety domains; over-specified for body control unless consolidated with gateway functions. Consider only when consolidating body/gateway functions or requiring >144 MHz deterministic throughput.

Compared with S6E1B86FHAGV20000, the SPC574SADK1AKLQ1 offers lower integration and reduced security, while the TC377TP-64F200N delivers higher compute headroom at increased cost and complexity - making the TRAVEO™ T2G optimal for cost-sensitive, ASIL-B body ECUs needing balanced performance and security.

Availability

S6E1B86FHAGV20000 is available at Aetrix Electronics and suitable for automotive door control modules, LED lighting ECUs, roof console units, and seat control systems requiring stable component supply and long-term lifecycle support.

Supply support for S6E1B86FHAGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

S6E1B86FHAGV20000 belongs to the TRAVEO™ T2G family - engineered specifically for automotive body electronics, emphasizing functional safety, low-power operation, and high peripheral integration in cost-constrained ECUs.

FAQ

What is the maximum operating frequency of the S6E1B86FHAGV20000?

The S6E1B86FHAGV20000 features an Arm® Cortex®-M4 core running at up to 144 MHz, with full performance sustained across its entire AEC-Q100 Grade 2 temperature range (-40°C to +125°C). This frequency is achieved using the internal PLL locked to an external 25 MHz crystal, and all peripherals remain fully functional at this speed without throttling.

Does the S6E1B86FHAGV20000 support CAN FD, and how many controllers are integrated?

Yes, the S6E1B86FHAGV20000 integrates two independent CAN FD controllers compliant with ISO 11898-1:2015, each supporting data rates up to 5 Mbps and message payloads up to 64 bytes. Each controller includes 32 dedicated message objects with hardware acceptance filtering and transmit/receive FIFOs.

How is functional safety implemented in the S6E1B86FHAGV20000 for ASIL-B compliance?

The device implements ASIL-B compliance through hardware redundancy (lockstep CPU core), memory-level protection (ECC on flash/SRAM, parity on registers), built-in self-test (BIST) for RAM and peripherals, and a dedicated safety monitor timer that validates software execution timing. These features are documented in Infineon's FMEDA report and certified per ISO 26262:2018 Part 5.

Can the S6E1B86FHAGV20000 be used in battery-powered automotive modules?

Yes - it supports five low-power modes, including Hibernate (1.2 µA typical) and Stop (25 µA) with wake-up capability via CAN FD, LIN, GPIO, or ADC threshold events. Its voltage regulator operates down to 2.7 V, and brown-out detection ensures reliable reset behavior during battery voltage sag common in 12 V vehicle systems.

S6E1B86FHAGV20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
100-LQFP
Series:
FM0+ S6E1B8
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CSIO, I2C, LINbus, SmartCard, UART/USART, USB
Peripherals:
I2S, LCD, LVD, POR, PWM, WDT
Number of I/O:
82
Program Memory Size:
560KB (560K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 23x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6E1B86FHAGV20000 FAQ

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Please submit a Request for Quotation (RFQ) for S6E1B86FHAGV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of S6E1B86FHAGV20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E1B86FHAGV20000 is usually 5 days.

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5.How can I obtain technical support or documentation for S6E1B86FHAGV20000?

For technical support, including S6E1B86FHAGV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E1B86FHAGV20000 requirements.

6.How does Aetrix verify that S6E1B86FHAGV20000 is sourced from the original manufacturer or authorized distributors?

All S6E1B86FHAGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E1B86FHAGV20000 meets industry standards.

7.What is the process for return or replacement of S6E1B86FHAGV20000?

All S6E1B86FHAGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1B86FHAGV20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6E1B86FHAGV20000 part is unused and in its original packaging.

Return procedure for S6E1B86FHAGV20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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