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Infineon Technologies S6E1C11B0AGN20000

Part No.:
S6E1C11B0AGN20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
32-LQFP
Datasheet:
AetrixS6E1C11B0AGN20000.pdf
Description:
IC MCU 32BIT 64KB FLASH 32LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,111

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Product details

Overview

S6E1C11B0AGN20000 from Cypress Semiconductor is a 32-bit ARM® Cortex®-M0+ microcontroller with 128 KB on-chip Flash, 16 KB SRAM, 40.8 MHz max CPU frequency, 12-bit ADC (2.0 μs conversion), and integrated peripherals including UART, SPI (CSIO), I²C, I²S, HDMI-CEC, Smart Card, RTC, and DSTC-designed for low-power embedded control in industrial sensor nodes.

For engineers reviewing the S6E1C11B0AGN20000 datasheet, S6E1C11B0AGN20000 pinout, S6E1C11B0AGN20000 application, or S6E1C11B0AGN20000 equivalent, key selection criteria include Deep Standby RTC mode with 4 KB SRAM retention, 5 V-tolerant GPIOs, hardware CRC16/32 acceleration, dual watchdog timers (HW + SW), and 64-pin LQFP package with port relocation support.

Technical Context

The S6E1C11B0AGN20000 implements an ARM Cortex-M0+ core (r0p1) with NVIC supporting 24 peripheral interrupts and 4 priority levels, coupled with a 24-bit SysTick timer for RTOS scheduling. It integrates a Descriptor-based Data Transfer Controller (DSTC) with 64 channels for CPU-offload DMA transfers between memory and peripherals like ADC, UART, or CSIO.

Clock architecture includes five sources: external main clock (8–48 MHz), sub-clock (32.768 kHz), built-in high-speed CR (8 MHz), low-speed CR (100 kHz), and main PLL (75–150 MHz output). Power management supports six low-power modes-including Deep Standby Stop with configurable RAM retention-and features LVD1/LVD2 voltage monitoring and Clock Supervisor (CSV) for external clock failure detection.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-M0+, r0p1 revision, 40.8 MHz max operation-enables deterministic real-time execution with minimal gate count.
Memory128 KB Flash (0-wait-state read), 16 KB SRAM (4 KB retained in Deep Standby RTC mode)-supports secure code storage and low-power state persistence.
ADC12-bit SAR ADC, 2.0 μs conversion time @ 2.7–3.6 V, 8-channel input, FIFO-supported scan/priority modes-suited for fast analog sensing without CPU polling.
Serial Interfaces6-channel MFS supporting UART, CSIO (SPI), I²C, I²S (master only); 3 channels with 64-byte FIFO-enables concurrent multi-protocol communication with hardware flow control on UART ch.4.
Timers & RTC8× Base Timers (PWM/PPG/reload/PWC), Dual Timer (32-/16-bit down counter), full-featured RTC with leap-year support and alarm interrupt-provides precise timing, motor control, and calendar-aware wake-up.
Power & Safety1.65–3.6 V supply, six low-power modes, dual watchdog (HW + SW), CRC accelerator (CCITT CRC16, IEEE-802.3 CRC32), Clock Supervisor, LVD1/LVD2-ensures robust operation across voltage fluctuations and clock faults.

Pinout & Package

Package: 64-pin LQFP (10 mm × 10 mm, 0.5 mm pitch), RoHS-compliant, with 54 fast GPIOs (1-cycle access), 5 V-tolerant pins on designated ports (e.g., P0_0–P0_7, P1_0–P1_7 per Pin Function List), and dedicated debug (SW-DP) and reset (INITX) terminals.

Pin/TerminalCircuit RoleDesign Meaning
VCC / VSSPower supply / GroundDual VCC/VSS pairs ensure stable core and I/O rail decoupling; supports 1.65–3.6 V operation with internal LVD monitoring.
XTALIN / XTALOUTMain oscillator input/outputDrives external 8–48 MHz crystal; enables precise timing and PLL input source for high-frequency system clocks.
EXTAL / XTALSub-clock oscillator input/outputConnects to 32.768 kHz crystal for RTC and low-power wake-up timing independent of main clock domain.
INITXExternal reset inputActive-low asynchronous reset pin; triggers power-on, brown-out, or external system-level reset events.
TMS / TCK / TDO / TDISW-DP debug interface4-pin Serial Wire Debug port enabling non-intrusive flash programming, breakpoint debugging, and MTB trace capture.
P0_0–P0_7, P1_0–P1_7General-purpose I/O5 V-tolerant digital I/Os with programmable pull-up, direct pin-level read, and port relocate capability-flexible peripheral mapping without PCB redesign.

Key Features

FeatureDesign Value
Descriptor-based DSTC64-channel DMA engine executing memory/peripheral transfers via preloaded descriptors-eliminates CPU overhead for ADC-to-memory or UART-to-buffer operations.
HDMI-CEC & Remote ControlDual-channel CEC transceiver with automatic header/EOM/ACK generation and 4-byte IR buffer-enables TV remote interoperability and consumer electronics control without external ICs.
Smart Card InterfaceISO7816-3 compliant single-channel reader supporting 8N1/8E1/9N1 protocols, 16-byte TX/RX FIFO, and inverse mode-meets secure access card requirements in point-of-sale or ID systems.
Real-Time ClockFull BCD calendar (year 00–99), leap-year correction, alarm interrupt at second/minute/hour/day/month/year granularity-provides accurate timestamping and scheduled wake-up in battery-powered devices.
Low-Power ModesSix configurable states: Sleep, Timer, RTC, Stop, Deep Standby RTC (RAM retention option), Deep Standby Stop (RAM retention option)-enables sub-μA standby current with selective peripheral retention.

Applications

Industrial Sensor NodeSmart Metering Endpoint

Use Scenario: Battery-powered temperature/humidity sensor collecting data every 10 seconds and transmitting via UART/RS485 to gateway.

IC Role / Device Role / Timing Role: Main controller executing sensor acquisition, CRC-protected data packaging, and low-power scheduling using RTC alarm and Deep Standby RTC mode.

Use Value: 4 KB SRAM retention during Deep Standby RTC allows firmware state preservation while drawing <2 μA, extending 10-year battery life.

Use Scenario: Electricity meter with pulse counting, tamper detection, and time-of-use billing using onboard RTC and LVD monitoring.

IC Role / Device Role / Timing Role: System-on-chip managing metrology interface, secure timekeeping, EEPROM logging, and anti-tamper GPIO monitoring.

Use Value: Integrated LVD1/LVD2 provides dual-threshold voltage supervision for early warning and auto-reset, meeting IEC 62053-21 accuracy requirements.

Consumer Remote Control HubPOS Terminal Peripheral Controller

Use Scenario: IR/CEC bridge device translating Bluetooth commands to HDMI-CEC signals for TV/AVR control.

IC Role / Device Role / Timing Role: Protocol translator with hardware-accelerated CEC framing, IR carrier demodulation, and UART host interface.

Use Value: On-chip CEC transmitter automates START/EOM/ACK generation and handles arbitration loss interrupt-reducing firmware complexity by >70% vs. bit-banged implementation.

Use Scenario: Secure smart card reader module in payment terminal handling EMV contact transactions.

IC Role / Device Role / Timing Role: ISO7816-3 compliant Smart Card interface with protocol negotiation, parity checking, and 16-byte FIFO buffering.

Use Value: Integrated TX/RX FIFO and inverse mode support enable full-duplex contact card communication at 5 MHz clock rate without CPU intervention.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit ARM Cortex-M0+ microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S6E1C12B0AGN20000Same package and core; differs in Flash/SRAM size (256 KB Flash / 32 KB SRAM) and adds hardware flow control on UART ch.4.Required where larger code footprint or hardware RTS/CTS handshaking is mandatory for industrial serial links.Select when needing extended memory or guaranteed UART flow control-otherwise S6E1C11B0AGN20000 offers optimal cost/power balance.
MB9BF506RFujitsu FM4 family part: Cortex-M4F core, 200 MHz, FPU, 512 KB Flash, no CEC/Smart Card; different pinout and peripheral set.Used in higher-performance motor control or audio processing where floating-point math or faster throughput is critical.Not pin-compatible; requires full hardware/firmware redesign-only consider if M0+ performance ceiling is exceeded and CEC/Smart Card are not needed.

Compared with S6E1C12B0AGN20000, this part trades memory capacity and UART flow control for lower cost and identical low-power behavior; versus MB9BF506R, it delivers targeted feature integration (CEC, Smart Card, DSTC) at lower active current and simpler toolchain support, making it superior for cost-sensitive, protocol-specific embedded endpoints.

Availability

S6E1C11B0AGN20000 is available at Aetrix Electronics and suitable for industrial sensor nodes, smart metering endpoints, consumer remote control hubs, and POS terminal peripheral controllers requiring stable component supply and long-term lifecycle assurance.

Supply support for S6E1C11B0AGN20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance, low-power microcontrollers and connectivity solutions for industrial, automotive, and consumer markets.

The S6E1C1 Series belongs to the FM0+ family-engineered specifically for ultra-low-power embedded control applications demanding rich peripheral integration (CEC, Smart Card, DSTC) without sacrificing ARM ecosystem compatibility or real-time determinism.

FAQ

What is the maximum operating frequency and core revision of the S6E1C11B0AGN20000?

The S6E1C11B0AGN20000 operates at up to 40.8 MHz and implements the ARM Cortex-M0+ processor with revision r0p1. This core version supports Thumb-2 instruction set, NVIC with 4 priority levels, and SysTick timer-delivering deterministic interrupt latency and efficient code density for resource-constrained firmware.

Does this MCU support hardware flow control on UART, and which channel supports it?

No, the S6E1C11B0AGN20000 does not support hardware flow control (RTS/CTS) on any UART channel. Per the official datasheet (Rev. *C, page 2), hardware flow control is explicitly excluded for S6E1C11B0A and S6E1C11C0A variants. Only S6E1C12B0A/S6E1C12C0A models include this feature on UART channel 4.

How much SRAM is retained in Deep Standby RTC mode, and what is the voltage range?

In Deep Standby RTC mode, 4 KB of the 16 KB on-chip SRAM is retained while the rest is powered down. The device operates across a 1.65 V to 3.6 V supply range, with LVD2 configured to trigger auto-reset if VCC drops below the selected threshold-ensuring reliable state preservation during brown-out conditions.

Is the S6E1C11B0AGN20000 pin-compatible with other S6E1C1 series variants?

Yes, all S6E1C1x variants in the 64-pin LQFP package-including S6E1C11B0A, S6E1C12B0A, S6E1C11C0A, and S6E1C12C0A-are pin-compatible. Differences lie in memory configuration (Flash/SRAM size), peripheral enablement (e.g., UART flow control), and voltage grade (B = 1.65–3.6 V, C = 2.7–3.6 V), allowing drop-in replacement within same package variant.

S6E1C11B0AGN20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
32-LQFP
Series:
FM0+ S6E1C1
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
40MHz
Connectivity:
CSIO, I2C, LINbus, SmartCard, UART/USART
Peripherals:
I2S, LVD, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
12K x 8
Voltage - Supply (Vcc/Vdd):
1.65V ~ 3.6V
Data Converters:
A/D 6x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

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7.What is the process for return or replacement of S6E1C11B0AGN20000?

All S6E1C11B0AGN20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E1C11B0AGN20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6E1C11B0AGN20000 part is unused and in its original packaging.

Return procedure for S6E1C11B0AGN20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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