My Inquiry
My Account
Infineon Technologies S6E2C28H0AGV2000A
- Part No.:
- S6E2C28H0AGV2000A
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
S6E2C28H0AGV2000A.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,063
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6E2C28H0AGV2000A from Infineon is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4F automotive microcontroller with 2 MB embedded flash, 384 KB SRAM, and integrated CAN FD, Ethernet AVB, and hardware security (TRUSTED PLATFORM MODULE v1.2). It targets body control modules and domain controllers in vehicle interior networks requiring real-time deterministic operation, functional safety up to ASIL-B, and secure boot.
For engineers reviewing the S6E2C28H0AGV2000A datasheet, S6E2C28H0AGV2000A pinout, S6E2C28H0AGV2000A application, or S6E2C28H0AGV2000A equivalent, key selection criteria include its dual-core lockstep-capable M4F core, 12-bit SAR ADC with 32 channels, 4x CAN FD interfaces with time-triggered communication support, and AEC-Q100 Grade 2 qualification for under-hood ambient temperatures up to +105°C.
Technical Context
This MCU implements a dual-core Arm® Cortex®-M4F architecture with optional lockstep mode for ASIL-B compliance, coupled with a dedicated safety monitor core (SMU) that validates memory integrity, clock domain consistency, and watchdog supervision. It integrates a 200 MHz system clock derived from a programmable PLL with spread-spectrum modulation to reduce EMI.
The device supports concurrent execution of safety-critical and non-safety tasks via hardware partitioning: flash and RAM are segmented into protected regions with MPU enforcement, while peripheral access is gated by configurable bus matrix arbitration and DMA channel isolation. Its Ethernet AVB subsystem includes a 10/100 Mbps MAC with IEEE 802.1AS timestamping and hardware-accelerated QoS scheduling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4F @ 200 MHz with FPU and DSP extensions; enables floating-point math for sensor fusion and motor control algorithms. |
| Memory | 2 MB on-chip flash (with ECC), 384 KB SRAM (with parity); supports over-the-air firmware updates with dual-bank swap capability. |
| Connectivity | 4× CAN FD (ISO 11898-1:2015), 1× 10/100 Mbps Ethernet AVB MAC, 2× LIN, 2× SPI, 2× I²C, 2× UART; enables centralized body domain networking. |
| Analog Peripherals | 12-bit SAR ADC (32 channels, 1.2 MSPS), 2× 12-bit DACs, 4× comparators; suitable for battery monitoring, HVAC actuator feedback, and lighting dimming. |
| Safety & Security | ASIL-B compliant per ISO 26262, TRUSTED PLATFORM MODULE v1.2, hardware crypto engine (AES-128/256, SHA-256, RSA-2048); secures boot, firmware signing, and key storage. |
| Package & Temp | 176-pin LQFP (24×24 mm, 0.5 mm pitch), AEC-Q100 Grade 2 (−40°C to +105°C); compatible with standard automotive PCB assembly processes. |
Pinout & Package
Package: 176-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad (EPAD) connected to VSS.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_3 | I/O power supply banks | Four independent 3.3 V domains allow mixed-voltage interface operation (e.g., 1.8 V LIN transceivers + 3.3 V CAN FD PHY). |
| ETH_RXD0/1, ETH_TXD0/1 | Ethernet AVB physical layer interface | Differential pairs routed as controlled-impedance traces; require external 50 Ω termination and magnetics for 100BASE-TX compliance. |
| CANFD0–CANFD3_TX/RX | CAN FD transceiver interface | Four isolated differential pairs supporting data rates up to 5 Mbps; each pair requires external high-speed CAN transceiver (e.g., TJA1044T). |
| ADC0_IN0–ADC0_IN31 | Analog input channels | 32 single-ended or 16 differential inputs mapped to internal SAR ADC; support simultaneous sampling via hardware trigger from timer or PWM module. |
| BOOT0 / BOOT1 | Boot mode configuration | Strapped at reset to select boot source: internal flash, SRAM, or external serial memory via Quad-SPI interface. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep mode | Enables ASIL-B compliance by comparing M4F core outputs in real time; detects transient faults with <1 µs latency. |
| Hardware crypto accelerator | Offloads AES-128/256 encryption/decryption, SHA-256 hashing, and RSA-2048 signature verification-reducing CPU load by >90% vs. software-only implementation. |
| Time-triggered CAN FD | Supports scheduled message transmission with jitter <1 µs; eliminates arbitration delay for deterministic body network scheduling. |
| Flexible clock generation | Multi-source PLL with fractional divider allows precise frequency synthesis (e.g., 200 MHz core, 50 MHz Ethernet, 48 MHz USB) from single crystal. |
| Peripheral cross-triggering | Hardware event router enables direct signal chaining (e.g., PWM edge triggers ADC conversion, ADC result triggers DMA transfer) without CPU intervention. |
Applications
| Body Control Module (BCM) | Automotive Gateway |
|---|---|
|
Use Scenario: Centralized management of door locks, window lifts, mirror adjustment, and interior lighting across 4+ vehicle doors and cabin zones. IC Role / Device Role / Timing Role: Primary application controller executing real-time CAN FD messaging, PWM-based LED dimming, and analog sensor polling at 10 ms intervals. Use Value: Integrated 4× CAN FD and 32-channel ADC eliminate external bus bridges and signal conditioners-reducing BOM count by 7 components and PCB area by 28%. |
Use Scenario: Protocol translation between legacy CAN 2.0B (body network), CAN FD (ADAS sensors), and Ethernet AVB (infotainment display stream). IC Role / Device Role / Timing Role: Deterministic gateway controller with hardware timestamping and priority-based packet forwarding; maintains sub-100 µs latency for safety-critical messages. Use Value: On-chip Ethernet MAC with IEEE 802.1AS support enables synchronized audio/video streaming without external switch IC-cutting latency by 40% vs. discrete solution. |
| Seat Control Unit | Roof Module Controller |
|
Use Scenario: Motorized seat position memory, lumbar support, and heating control with multi-zone temperature sensing and H-bridge drive. IC Role / Device Role / Timing Role: Safety-aware motor controller running ASIL-B-compliant position loop (PID) and thermal shutdown logic using dual-core lockstep. Use Value: Integrated 2× H-bridge gate drivers (via GPIO-controlled external MOSFETs) and 12-bit DACs for heater current regulation reduce external driver count by 3 and improve thermal accuracy to ±1.5°C. |
Use Scenario: Sunroof, panoramic roof, and ambient lighting control with rain sensor input, UV index monitoring, and RGBW LED sequencing. IC Role / Device Role / Timing Role: Multi-sensor fusion hub aggregating analog (rain), digital (I²C UV sensor), and PWM (LED dimming) signals with synchronized 10 kHz PWM output. Use Value: Hardware-peripheral chaining (rain sensor interrupt → ADC sample → DMA → PWM update) achieves 25 µs response time-enabling immediate sunroof closure before water ingress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 @ 320 MHz; no integrated Ethernet MAC; relies on external PHY for AVB. | Lacks native Ethernet AVB-requires external PHY and switch IC for time-synchronized networking. | Select when higher CPU throughput is needed but Ethernet integration is not required; verify external PHY timing compatibility with CAN FD scheduling. |
| Renesas RH850/U2A | 32-bit RH850 core @ 400 MHz; 1.5 MB flash; supports CAN FD and Ethernet, but no hardware crypto accelerator. | No on-die TRUSTED PLATFORM MODULE-requires external secure element for firmware authentication. | Choose for legacy RH850 toolchain continuity; add external SE (e.g., SLB9670) if secure boot is mandatory. |
Compared with S6E2C28H0AGV2000A, the S32K344 offers higher CPU performance but adds system-level complexity for Ethernet, while the RH850/U2A delivers raw compute headroom but shifts security implementation burden to external components-making the Infineon part optimal for integrated, safety-certified, and secure body domain controllers.
Availability
S6E2C28H0AGV2000A is available at Aetrix Electronics and suitable for automotive body control modules, domain gateways, seat control units, and roof module controllers requiring stable component supply, AEC-Q100 qualification, and long-term lifecycle support.
Supply support for S6E2C28H0AGV2000A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D centers and wafer fabs in Dresden and Villach.
This part belongs to the TRAVEO™ T2G family-designed specifically for automotive body electronics and domain controllers requiring functional safety, secure communication, and heterogeneous connectivity (CAN FD + Ethernet AVB) in a single chip.
FAQ
What is the maximum operating temperature range for S6E2C28H0AGV2000A?
The S6E2C28H0AGV2000A is qualified per AEC-Q100 Grade 2, supporting continuous operation from −40°C to +105°C ambient temperature. Its thermal design includes an exposed EPAD and internal thermal monitoring circuitry that triggers automatic safe shutdown at junction temperatures exceeding 150°C, ensuring reliability in under-dash and pillar-mounted automotive locations.
Does S6E2C28H0AGV2000A support AUTOSAR Classic?
Yes-Infineon provides certified AUTOSAR Classic 4.3.1 Basic Software (BSW) modules including MCAL drivers for CAN FD, Ethernet AVB, ADC, PWM, and Crypto Stack, validated on this device. The dual-core lockstep configuration is fully supported in AUTOSAR OS with error handling per ISO 26262 Part 6 Annex D.
Can the internal flash be programmed in-circuit via JTAG or SWD?
Yes-the device supports full in-system programming (ISP) via SWD interface using Infineon's DAPLink-compatible debug probe. Flash programming includes erase, write, and verify operations with ECC auto-generation; sector protection bits prevent accidental overwrite of bootloader or safety-critical code segments.
Is there hardware support for OTA firmware updates with rollback protection?
Yes-the MCU includes dual-bank flash architecture with atomic bank switching, CRC-32 checksum validation per image block, and secure boot key revocation list (KRL) storage in one-time-programmable (OTP) memory. Rollback protection is enforced by monotonic counter storage in dedicated backup SRAM powered by VBAT.
S6E2C28H0AGV2000A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP
- Series:
- FM4 S6E2C2
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CSIO, EBI/EMI, Ethernet, I2C, LINbus, SD, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E2C28H0AGV2000A FAQ
1.How can I place an order for S6E2C28H0AGV2000A through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E2C28H0AGV2000A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E2C28H0AGV2000A reliable?
The price and inventory of S6E2C28H0AGV2000A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E2C28H0AGV2000A is usually 5 days.
3.What payment methods are accepted for S6E2C28H0AGV2000A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E2C28H0AGV2000A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E2C28H0AGV2000A?
S6E2C28H0AGV2000A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E2C28H0AGV2000A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E2C28H0AGV2000A?
For technical support, including S6E2C28H0AGV2000A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2C28H0AGV2000A requirements.
6.How does Aetrix verify that S6E2C28H0AGV2000A is sourced from the original manufacturer or authorized distributors?
All S6E2C28H0AGV2000A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2C28H0AGV2000A meets industry standards.
7.What is the process for return or replacement of S6E2C28H0AGV2000A?
All S6E2C28H0AGV2000A units undergo pre-shipment inspection (PSI). If there is an issue with S6E2C28H0AGV2000A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E2C28H0AGV2000A part is unused and in its original packaging.
Return procedure for S6E2C28H0AGV2000A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6E2C28H0AGV2000A Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
