Infineon Technologies S6E2C28J0AGV2000A
- Part No.:
- S6E2C28J0AGV2000A
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP
- Datasheet:
-
S6E2C28J0AGV2000A.pdf
- Description:
- IC MCU 32BIT 1MB FLASH 176LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,176
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Product details
Overview
S6E2C28J0AGV2000A from Infineon is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 2 MB flash, 384 KB SRAM, dual CAN FD controllers, 4x LIN, 12-bit ADC with 32 channels, and operates at up to 144 MHz. It supports AEC-Q100 Grade 2 qualification and is used in door control modules, seat control units, and lighting control systems.
For engineers reviewing the S6E2C28J0AGV2000A datasheet, S6E2C28J0AGV2000A pinout, S6E2C28J0AGV2000A application, or S6E2C28J0AGV2000A equivalent, key selection criteria include CAN FD timing compliance, flash ECC implementation, SRAM retention during low-power modes, and hardware security module (HSM) support for secure boot and cryptographic acceleration.
Technical Context
This MCU implements a dual-bank flash architecture with read-while-write capability and hardware ECC for both flash and SRAM. Its peripheral set includes a programmable high-resolution PWM (HRPWM) unit with 150 ps resolution and a dedicated safety monitor (SMU) supporting ISO 26262 ASIL-B decomposition.
The device features a dedicated HSM subsystem with AES-128/256, SHA-256, RSA-2048, and true random number generation (TRNG), enabling secure firmware updates and key provisioning without exposing secrets to the main CPU core.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4 @ 144 MHz - enables real-time motor control loops and sensor fusion with FPU and DSP extensions. |
| Flash Memory | 2 MB dual-bank flash with ECC - supports safe over-the-air (OTA) updates via bank swapping without runtime interruption. |
| SRAM | 384 KB including 64 KB parity-protected RAM - accommodates large CAN FD message buffers and safety-critical data structures. |
| CAN FD Interfaces | 2 × CAN FD controllers with ISO 11898-1:2015 compliance - supports data rates up to 5 Mbps and payloads up to 64 bytes per frame. |
| ADC | 12-bit SAR ADC with 32 channels and 1.2 μs conversion time - suitable for precise battery voltage monitoring and temperature sensing in multi-sensor nodes. |
| Security | HSM with AES-128/256, SHA-256, RSA-2048, TRNG - meets UNECE R155/R156 requirements for secure boot and cryptographic key management. |
| Qualification | AEC-Q100 Grade 2 (−40 °C to +105 °C) - validated for under-hood and interior automotive environments with extended temperature reliability. |
Pinout & Package
Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch) with exposed thermal pad for enhanced thermal dissipation in automotive ambient conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_3V3 | I/O supply rail | Supplies all GPIO banks and peripheral I/Os at 3.3 V; requires local 100 nF decoupling per power domain. |
| VDDA | Analog supply | Independent 3.3 V analog supply for ADC and comparators; must be filtered separately to minimize noise coupling. |
| BOOT0 | Boot mode select | Pulled low at reset to boot from embedded flash; tied high for system memory bootloader entry. |
| CAN0_TX / CAN0_RX | CAN FD differential pair | Direct connection to external CAN transceiver; supports 5 Mbps bit rate with integrated bus-off recovery logic. |
| HSM_SWDIO / HSM_SWCLK | HSM debug interface | Dedicated SWD pins for secure HSM debugging - isolated from main CPU debug access to prevent side-channel exposure. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with RWW | Enables seamless firmware updates: one bank executes while the other is reprogrammed, eliminating downtime in safety-critical systems. |
| Hardware Security Module (HSM) | Offloads cryptographic operations from main CPU, prevents secret key leakage, and enforces secure boot chain with immutable root-of-trust. |
| Programmable HRPWM | 150 ps resolution PWM with dead-time insertion and fault protection - ideal for driving high-side/low-side MOSFETs in LED dimming and motor gate drivers. |
| Safety Monitor Unit (SMU) | Monitors clock, voltage, temperature, and memory integrity; triggers fail-safe response (e.g., safe state assertion) on violation per ISO 26262 ASIL-B requirements. |
| Multi-channel LIN controller | 4 independent LIN 2.2A/B controllers with automatic header detection and checksum verification - reduces MCU load in multi-node body networks. |
Applications
| Door Control Module | Seat Position Control |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and anti-pinch sensors in vehicle doors. IC Role / Device Role / Timing Role: Main application MCU managing LIN slave communication, PWM-driven motor drivers, and ADC-based position feedback. Use Value: Dual-bank flash enables silent OTA updates of window calibration profiles; HRPWM ensures smooth motor ramping with <1% torque ripple. | Use Scenario: Real-time adjustment of seat motors for lumbar support, recline, and fore-aft movement with position sensing. IC Role / Device Role / Timing Role: Safety-aware motion controller interfacing with Hall-effect sensors, current sense amplifiers, and dual CAN FD buses for ECU coordination. Use Value: SMU monitors motor current limits and thermal thresholds; HSM signs actuation commands to prevent unauthorized seat movement. |
| LED Headlamp Driver | Body Control Module (BCM) |
Use Scenario: Dynamic headlamp control with adaptive beam shaping, DRL, and turn signal integration. IC Role / Device Role / Timing Role: High-resolution PWM generator and CAN FD gateway coordinating with camera-based ADAS inputs. Use Value: 150 ps HRPWM achieves 10,000:1 dimming ratio for pixel-level LED control; dual CAN FD ensures latency <50 μs for beam steering commands. | Use Scenario: Centralized management of lighting, wipers, HVAC, and alarm functions across multiple LIN/CAN subnets. IC Role / Device Role / Timing Role: System orchestrator with integrated LIN masters, CAN FD interfaces, and secure firmware update engine. Use Value: 2 MB flash stores full BCM firmware plus diagnostic logs; HSM validates signed update packages before flash write. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive body control microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SPC58EC80E5 | Power Architecture (e200z4) core, 4 MB flash, no integrated HSM - relies on external secure element for crypto. | Lacks native HSM; requires additional component for UNECE R156 compliance. | Choose when legacy Power Architecture toolchain compatibility is required and external security IC is acceptable. |
| TC377TP-64F200N | AURIX™ TriCore™ TC3xx, 4 MB flash, 2x ETH, no CAN FD - supports Ethernet AVB but limited CAN FD bandwidth. | Better for gateway roles with Ethernet backbone; less optimal for CAN FD–centric body networks. | Prefer when integrating Ethernet-based diagnostics or OTA infrastructure is prioritized over CAN FD throughput. |
Compared with SPC58EC80E5 and TC377TP-64F200N, the S6E2C28J0AGV2000A delivers balanced CAN FD bandwidth, on-die HSM, and optimized flash/SRAM partitioning for cost-sensitive body ECUs - making it the most direct fit for LIN/CAN FD–based distributed control without architectural trade-offs.
Availability
S6E2C28J0AGV2000A is available at Aetrix Electronics and suitable for door control modules, seat position controllers, LED headlamp drivers, and body control modules requiring stable component supply across automotive production lifecycles.
Supply support for S6E2C28J0AGV2000A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing facilities.
The TRAVEO™ T2G product line targets automotive body and interior electronics, delivering scalable Arm®-based MCUs with integrated functional safety and security features aligned with ISO 26262 and UNECE R156.
FAQ
What is the maximum operating frequency of the S6E2C28J0AGV2000A?
The S6E2C28J0AGV2000A runs its Arm® Cortex®-M4 core at up to 144 MHz under full AEC-Q100 Grade 2 conditions (−40 °C to +105 °C). This frequency is guaranteed with proper power supply regulation (VDDCORE = 1.2 V ± 3%) and thermal management. The core supports dynamic voltage and frequency scaling (DVFS) to reduce power during idle states without compromising real-time interrupt latency.
Does the S6E2C28J0AGV2000A support JTAG or SWD debugging?
The S6E2C28J0AGV2000A supports Serial Wire Debug (SWD) only - not JTAG. It provides two dedicated SWD pins (SWDIO and SWCLK) for the main CPU, plus separate HSM_SWDIO/HSM_SWCLK pins for isolated debugging of the Hardware Security Module. SWD allows full visibility into core registers, memory, and peripherals while maintaining minimal pin count and electromagnetic compatibility in automotive layouts.
How is functional safety implemented in this MCU?
Functional safety is implemented via a dedicated Safety Monitor Unit (SMU) that independently checks clock stability, supply voltage levels, temperature thresholds, and memory integrity (flash/SRAM ECC). It supports ISO 26262 ASIL-B decomposition by triggering configurable fail-safe outputs (e.g., NMI, reset, or GPIO assertion) upon fault detection. All safety-critical peripherals - including ADC, PWM, and CAN FD - include self-test capabilities and lockstep mechanisms where applicable.
Can the S6E2C28J0AGV2000A be used in non-automotive applications?
While qualified to AEC-Q100 Grade 2, the S6E2C28J0AGV2000A is engineered for automotive use cases and includes features like CAN FD, LIN, and HSM that may exceed requirements for industrial applications. Its 105 °C junction rating and robust ESD immunity (±8 kV HBM) make it viable for harsh-environment industrial controls, but design validation must confirm absence of automotive-specific dependencies (e.g., CAN FD timing constraints or safety library licensing).
S6E2C28J0AGV2000A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP
- Series:
- FM4 S6E2C2
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CSIO, EBI/EMI, Ethernet, I2C, LINbus, SD, SPI, UART/USART, USB
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 152
- Program Memory Size:
- 1MB (1M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 32x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E2C28J0AGV2000A FAQ
1.How can I place an order for S6E2C28J0AGV2000A through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E2C28J0AGV2000A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E2C28J0AGV2000A reliable?
The price and inventory of S6E2C28J0AGV2000A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E2C28J0AGV2000A is usually 5 days.
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S6E2C28J0AGV2000A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E2C28J0AGV2000A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E2C28J0AGV2000A?
For technical support, including S6E2C28J0AGV2000A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2C28J0AGV2000A requirements.
6.How does Aetrix verify that S6E2C28J0AGV2000A is sourced from the original manufacturer or authorized distributors?
All S6E2C28J0AGV2000A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2C28J0AGV2000A meets industry standards.
7.What is the process for return or replacement of S6E2C28J0AGV2000A?
All S6E2C28J0AGV2000A units undergo pre-shipment inspection (PSI). If there is an issue with S6E2C28J0AGV2000A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E2C28J0AGV2000A part is unused and in its original packaging.
Return procedure for S6E2C28J0AGV2000A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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