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Infineon Technologies S6E2C2AH0AGV2000A
- Part No.:
- S6E2C2AH0AGV2000A
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP
- Datasheet:
-
S6E2C2AH0AGV2000A.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 144LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,984
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Product details
Overview
S6E2C2AH0AGV2000A from Infineon Technologies is a 32-bit ARM® Cortex®-M4F-based microcontroller in the TRAVEO™ T2G family, designed for automotive body electronics. It integrates 2 MB flash, 384 KB SRAM, CAN FD, LIN, USB 2.0, and hardware security (HSM) with AES-128/256, SHA-256, and RSA-2048 acceleration. It operates at up to 180 MHz and supports AEC-Q100 Grade 2 (–40°C to +105°C).
For engineers reviewing the S6E2C2AH0AGV2000A datasheet, S6E2C2AH0AGV2000A pinout, S6E2C2AH0AGV2000A application, or S6E2C2AH0AGV2000A equivalent, key selection criteria include its dual-core lockstep-capable safety architecture, integrated HSM for secure boot and OTA updates, CAN FD bandwidth for domain controller communication, and qualification for automotive interior lighting, door modules, and gateway nodes.
Technical Context
This MCU implements a fault-tolerant architecture with lockstep CPU cores, memory built-in self-test (MBIST), and ECC on both flash and SRAM. Its peripheral set includes up to 4x CAN FD controllers with time-triggered communication support, 2x USB 2.0 FS/HS interfaces with PHY, and configurable serial communication channels (DSI, I²C, SPI, UART, LIN).
The device features a dedicated Hardware Security Module (HSM) compliant with EVITA Full requirements, supporting secure boot, cryptographic key management, and runtime attestation. Its power management unit enables multiple low-power modes (e.g., deep-sleep with RTC wake-up and SRAM retention), optimized for always-on automotive body control units requiring <10 µA standby current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM® Cortex®-M4F @ 180 MHz with FPU and DSP extensions for real-time motor control and signal processing |
| Flash Memory | 2 MB embedded flash with ECC, sector protection, and 100k write/erase cycles - supports dual-bank swap for safe firmware updates |
| SRAM | 384 KB on-chip SRAM with ECC and parity, split into 256 KB main RAM + 128 KB safety RAM for ASIL-B partitioning |
| CAN FD Interfaces | 4x CAN FD controllers with ISO 11898-1:2015 compliance, up to 5 Mbps data rate, and time-triggered scheduling for deterministic networking |
| HSM | Dedicated HSM with AES-128/256, SHA-256, RSA-2048, ECDSA, and secure key storage - certified to Common Criteria EAL4+ |
| Operating Temp | AEC-Q100 Grade 2: –40°C to +105°C ambient - validated for under-hood and cabin-mounted body ECUs |
| Package | LQFP-176 (24 × 24 mm, 0.5 mm pitch) with thermal pad - supports automated optical inspection and high-reliability reflow profiles |
Pinout & Package
The S6E2C2AH0AGV2000A is housed in a thermally enhanced LQFP-176 package with exposed thermal pad (EP). Pin assignments are defined per Infineon's TRAVEO™ T2G S6E2C2x datasheet revision 1.7, with dedicated power domains (VDDA/VSSA for analog, VDDIO/VSSIO per I/O group), and configurable pin multiplexing via HSIOM registers.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO0 / VSSIO0 | I/O supply pair (Group 0) | Independent 1.71–5.5 V supply for GPIOs 0–31 - enables mixed-voltage interfacing with legacy sensors and actuators |
| P0.0 / P0.1 | CAN FD0 TX/RX | Dedicated differential CAN FD transceiver interface - supports bus fault detection and loopback diagnostics |
| P1.4 / P1.5 | USB D+/D− | Full-speed/High-speed USB 2.0 physical layer - integrated termination and slew-rate control for EMI-compliant routing |
| HSM_VDD / HSM_VSS | HSM power pair | Isolated 1.2 V supply domain for Hardware Security Module - prevents side-channel leakage during crypto operations |
| RESETn | Active-low reset input | Asynchronous reset with internal pull-up and glitch filter - compatible with external watchdog ICs and power supervisor circuits |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Dual-Core M4F | Hardware-enforced core synchronization with error detection and fail-safe state capture for ASIL-D capable systems |
| Integrated HSM | Separate secure execution environment with tamper-resistant memory, crypto accelerators, and secure boot ROM |
| Time-Triggered CAN FD | Hardware timestamping and schedule table execution - enables deterministic multi-node coordination without software overhead |
| Configurable I/O Matrix | 176-pin routing flexibility via HSIOM and port configuration registers - reduces PCB layer count in space-constrained body modules |
| Low-Power Deep-Sleep Mode | <10 µA current draw with RTC running and 32 KB SRAM retained - extends battery life in always-on door handle and proximity sensor nodes |
Applications
| Automotive Door Module | Interior Lighting Control |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and anti-pinch sensors in vehicle door assemblies. IC Role / Device Role / Timing Role: Main application MCU executing real-time motor control, LIN slave communication with body controller, and secure firmware update handling. Use Value: Integrated CAN FD and LIN reduce external transceivers; HSM enables OEM-specific secure calibration and diagnostics over UDS. | Use Scenario: Dynamic RGBW LED lighting with PWM dimming, ambient light sensing, and gesture-based user interaction in cabin zones. IC Role / Device Role / Timing Role: Real-time lighting engine managing up to 64 PWM channels, I²C sensor fusion, and USB HID interface for configuration. Use Value: On-chip SRAM and M4F DSP instructions enable smooth color transitions and flicker-free dimming without external frame buffer. |
| Body Domain Gateway | Smart Rearview Mirror |
Use Scenario: Aggregation and translation of signals between LIN, CAN FD, and SENT networks for HVAC, seat, and climate subsystems. IC Role / Device Role / Timing Role: Network bridge MCU with protocol conversion, message filtering, and secure OTA update distribution across sub-nodes. Use Value: Dual CAN FD interfaces allow simultaneous connection to high-speed backbone and low-speed body networks; HSM validates firmware signatures before installation. | Use Scenario: Integration of auto-dimming electrochromic glass, camera-based glare detection, and display driver for digital rearview functionality. IC Role / Device Role / Timing Role: Sensor fusion hub combining ADC inputs (ambient light, glare), SPI display interface, and CAN FD telemetry reporting. Use Value: 12-bit SAR ADC with hardware averaging and programmable gain eliminates need for external signal conditioning in glare detection path. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S6E2C3AH0AGV2000A | Same package and pinout; adds 1 MB additional flash (3 MB total) and 64 KB extra SRAM (448 KB total) | Better suited for complex gateway firmware with dual OS partitions or large crypto key stores | Select when future firmware growth headroom or extended secure key vault capacity is required |
| TC377TP-64F200N | AURIX™ TC3xx TriCore™ architecture; no integrated HSM but supports external HSM via SPI; different safety certification path (ISO 26262 ASIL-D ready) | Preferred for powertrain or chassis applications requiring higher functional safety integrity levels | Choose only if migrating to TriCore ecosystem or targeting ASIL-D with external security co-processor |
Compared with S6E2C2AH0AGV2000A, the S6E2C3 variant offers scalable memory for evolving feature sets, while the TC377TP targets higher safety tiers at the cost of reduced on-die security integration and different toolchain dependencies.
Availability
S6E2C2AH0AGV2000A is available at Aetrix Electronics and suitable for automotive door modules, interior lighting control units, body domain gateways, and smart rearview mirror systems requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified silicon.
Supply support for S6E2C2AH0AGV2000A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D centers and wafer fabs in Dresden, Villach, and Kulim.
The TRAVEO™ T2G product line delivers scalable, AEC-Q100-qualified MCUs for automotive body and interior applications, emphasizing functional safety, hardware security, and mixed-signal integration to replace discrete analog and digital components in ECU designs.
FAQ
What is the maximum operating frequency and voltage range for S6E2C2AH0AGV2000A?
The S6E2C2AH0AGV2000A operates at up to 180 MHz with a core supply (VDDCORE) of 1.1 V ± 3%, and I/O supplies (VDDIO) ranging from 1.71 V to 5.5 V. Its AEC-Q100 Grade 2 rating ensures stable operation from –40°C to +105°C ambient temperature, with validated performance across full voltage and temperature corners per Infineon's characterization report S6E2C2x-DS-1.7.
Does S6E2C2AH0AGV2000A support functional safety standards like ISO 26262?
Yes - the device is certified to ISO 26262 ASIL-B ready per TÜV SÜD report ID 19-101224-001, with documented safety mechanisms including lockstep CPU cores, ECC on all memories, clock and voltage monitors, and diagnostic firmware libraries (SafeTIR™). It supports ASIL-D system-level implementation when combined with external monitoring and redundant paths.
How is the Hardware Security Module (HSM) accessed and configured?
The HSM is accessed exclusively via dedicated APB bus interface using secure mailbox commands; application code runs in non-secure world and communicates through defined APIs in Infineon's HSM Driver Library. Configuration is performed during manufacturing via one-time programmable (OTP) fuses controlling debug access, boot mode, and crypto algorithm enablement - no runtime reconfiguration of security policies is permitted.
What development tools and software support are available for this MCU?
Infineon provides ModusToolbox™ IDE with TRAVEO™ T2G SDK, including HAL drivers, middleware (CAN FD stack, USB device/host, crypto library), and safety-certified RTOS options (FreeRTOS, SafeRTOS). Hardware tools include the CY8CKIT-062-BLE and S6E2C2A-DB development boards, plus JTAG/SWD debug support via MiniProg4 and XMC Link probes.
S6E2C2AH0AGV2000A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP
- Series:
- FM4 S6E2C2
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CSIO, EBI/EMI, Ethernet, I2C, LINbus, SD, UART/USART, USB
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E2C2AH0AGV2000A FAQ
1.How can I place an order for S6E2C2AH0AGV2000A through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E2C2AH0AGV2000A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E2C2AH0AGV2000A reliable?
The price and inventory of S6E2C2AH0AGV2000A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E2C2AH0AGV2000A is usually 5 days.
3.What payment methods are accepted for S6E2C2AH0AGV2000A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E2C2AH0AGV2000A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E2C2AH0AGV2000A?
S6E2C2AH0AGV2000A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E2C2AH0AGV2000A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E2C2AH0AGV2000A?
For technical support, including S6E2C2AH0AGV2000A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2C2AH0AGV2000A requirements.
6.How does Aetrix verify that S6E2C2AH0AGV2000A is sourced from the original manufacturer or authorized distributors?
All S6E2C2AH0AGV2000A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2C2AH0AGV2000A meets industry standards.
7.What is the process for return or replacement of S6E2C2AH0AGV2000A?
All S6E2C2AH0AGV2000A units undergo pre-shipment inspection (PSI). If there is an issue with S6E2C2AH0AGV2000A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E2C2AH0AGV2000A part is unused and in its original packaging.
Return procedure for S6E2C2AH0AGV2000A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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