My Inquiry
My Account
Infineon Technologies S6E2C2AJ0AGB1000A
- Part No.:
- S6E2C2AJ0AGB1000A
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 192-LFBGA
- Datasheet:
-
S6E2C2AJ0AGB1000A.pdf
- Description:
- IC MCU 32BIT 2MB FLASH 192FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,634
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6E2C2AJ0AGB1000A from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4F automotive microcontroller with 2 MB embedded flash, 384 KB SRAM, and integrated CAN FD, LIN, and Ethernet MAC interfaces. It supports ASIL-B functional safety compliance per ISO 26262 and operates across -40°C to 125°C for body electronics control units.
For engineers reviewing the S6E2C2AJ0AGB1000A datasheet, S6E2C2AJ0AGB1000A pinout, S6E2C2AJ0AGB1000A application, or S6E2C2AJ0AGB1000A equivalent, key selection criteria include its dual-core lockstep capability, hardware security module (HSM) supporting AES-128/256 and SHA-256, and configurable peripheral routing via the Peripheral Routing Unit (PRU).
Technical Context
This MCU implements a dual-core Arm® Cortex®-M4F configuration with one core operating in lockstep mode for fault detection, enabling ASIL-B compliance without external monitoring. It integrates a dedicated HSM with secure boot ROM, cryptographic accelerators, and key management logic.
The device features a high-bandwidth AHB/APB bus matrix, configurable PRU for dynamic peripheral-to-pin mapping, and real-time debug support via SWD/JTAG. Its Ethernet MAC supports IEEE 802.3 compliant 10/100 Mbps operation with MII/RMII interface options and hardware timestamping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4F @ up to 120 MHz with FPU and DSP extensions |
| Flash Memory | 2 MB embedded flash with ECC, dual-bank architecture for safe firmware updates |
| SRAM | 384 KB on-chip SRAM with parity/ECC protection |
| Functional Safety | ASIL-B compliant per ISO 26262; includes lockstep CPU, memory BIST, and error-correcting code |
| Communication Interfaces | 2× CAN FD, 3× LIN, 1× 10/100 Mbps Ethernet MAC, 4× SPI, 4× I²C, 6× UART |
| Security | Dedicated HSM with AES-128/256, SHA-256, RSA-2048, secure boot ROM, and key provisioning |
| Operating Temp | -40°C to +125°C ambient temperature range for under-hood and body control applications |
Pinout & Package
Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA | Analog power supply | 3.3 V ±5% supply for ADC, DAC, and analog comparators |
| VSSA | Analog ground | Dedicated analog reference ground, isolated from digital ground for noise immunity |
| ETH_RXD0–ETH_RXD3 | Ethernet receive data lines | MII interface pins supporting 10/100 Mbps full-duplex operation |
| ETH_TXD0–ETH_TXD3 | Ethernet transmit data lines | MII interface pins with programmable slew rate control for EMI reduction |
| CANFD0_TX / CANFD0_RX | CAN FD channel 0 differential transceiver interface | Direct connection to external CAN FD transceiver; supports bit rates up to 5 Mbps |
| SWDIO / SWCLK | Serial Wire Debug interface | Two-pin debug port supporting real-time trace, flash programming, and boundary scan |
Key Features
| Feature | Design Value |
|---|---|
| Peripheral Routing Unit (PRU) | Runtime-configurable mapping of peripherals to GPIOs, enabling flexible board layout and reuse across variants |
| Dual-Core Lockstep Mode | Primary and checker cores execute identical instructions with cycle-by-cycle comparison for transient fault detection |
| Hardware Security Module (HSM) | Isolated secure execution environment with tamper-resistant key storage and cryptographic acceleration |
| Configurable Flash Protection | Region-based read/write/execute protection with 16 KB granularity and secure boot enforcement |
| Real-Time Debug Support | SWD interface with 4 KB debug RAM, trace buffer, and non-intrusive live register inspection |
Applications
| Body Control Module (BCM) | Door Module |
|---|---|
Use Scenario: Centralized vehicle body function management including lighting, window lift, mirror adjustment, and interior climate control. IC Role / Device Role / Timing Role: Main application processor executing AUTOSAR-compliant software stack with CAN FD communication to sub-nodes. Use Value: Dual-core lockstep ensures functional safety for critical outputs like hazard lights and door lock actuation while HSM secures OTA update authentication. | Use Scenario: Smart door electronics integrating window motor control, anti-pinch sensing, and proximity-based entry functions. IC Role / Device Role / Timing Role: Real-time controller managing PWM-driven BLDC window motors and capacitive touch sensing via SAR ADC and CAPSENSE™ IP. Use Value: Integrated PRU enables flexible GPIO assignment for sensor/motor interfaces across multiple door variants without PCB redesign. |
| Roof Module | Seat Control Unit |
Use Scenario: Sunroof, panoramic roof, and ambient lighting control with gesture recognition and LIN communication to body domain controller. IC Role / Device Role / Timing Role: Application MCU handling LIN slave protocol, motor position feedback via quadrature encoder interface, and RGB LED dimming. Use Value: On-chip 384 KB SRAM supports simultaneous execution of motor control loop (20 kHz), gesture processing, and LIN stack without external memory. | Use Scenario: Power seat control with multi-axis movement, heating/ventilation, and memory position recall using CAN FD and local sensors. IC Role / Device Role / Timing Role: Safety-aware controller running ASIL-B compliant seat position calibration and heater thermal monitoring algorithms. Use Value: Flash ECC and lockstep CPU ensure integrity of seat position profiles and prevent unsafe actuation during EEPROM write cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S6E2C3AJ0AGB1000A | Same package and pinout; adds 1 MB additional flash (3 MB total) and 128 KB extra SRAM | Better suited for complex AUTOSAR Classic/Adaptive stacks requiring larger code/data footprint | Select when firmware size exceeds 2 MB or real-time logging requires >384 KB buffer space |
| TC377TP-64F200N-DC | TriCore™ architecture, 200 MHz max clock, 4 MB flash, no integrated Ethernet MAC | Targeted at high-performance powertrain/safety domains; lacks native Ethernet but offers higher compute throughput | Choose for ASIL-D systems needing deterministic timing and legacy TriCore toolchain compatibility |
Compared with S6E2C2AJ0AGB1000A, the S6E2C3AJ0AGB1000A extends memory capacity for richer feature sets, while the TC377TP trades Ethernet integration for higher computational headroom and ASIL-D readiness-making each optimal for distinct domain-specific requirements.
Availability
S6E2C2AJ0AGB1000A is available at Aetrix Electronics and suitable for body control modules, door modules, roof modules, and seat control units requiring stable component supply across automotive production lifecycles.
Supply support for S6E2C2AJ0AGB1000A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
This part belongs to the TRAVEO™ T2G family-designed specifically for automotive body electronics requiring functional safety, secure connectivity, and flexible peripheral integration in cost-sensitive ECUs.
FAQ
What is the maximum operating frequency of the S6E2C2AJ0AGB1000A CPU?
The Arm® Cortex®-M4F core operates at up to 120 MHz across the full temperature range (-40°C to +125°C). This frequency is guaranteed with all on-chip peripherals active and meets timing closure under worst-case voltage (3.3 V ±5%) and process corner conditions, as validated in Infineon's production test flow.
Does the S6E2C2AJ0AGB1000A support AUTOSAR OS and MCAL drivers?
Yes-it is fully supported by Infineon's AUTOSAR 4.3-compliant MCAL stack, including drivers for CAN FD, LIN, Ethernet, ADC, PWM, and GPT. The device's memory layout, interrupt controller, and safety mechanisms align with AUTOSAR OS requirements for pre-emptive scheduling and memory protection.
Can the Ethernet MAC interface operate in RMII mode?
Yes-the integrated Ethernet MAC supports both MII and RMII physical layer interfaces. RMII mode uses 9 pins (including REF_CLK, CRS_DV, RXD[1:0], TXD[1:0], TX_EN, and RX_ER) and is validated for 10/100 Mbps operation with standard PHYs such as the LAN8742A.
How is functional safety implemented for the flash memory subsystem?
Flash memory includes end-to-end ECC (SEC-DED), background CRC checking, and dual-bank architecture allowing atomic firmware updates. Each flash bank has dedicated error injection and correction logic, and flash access is monitored by the safety manager to detect and report uncorrectable errors via the FMU.
S6E2C2AJ0AGB1000A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 192-LFBGA
- Series:
- FM4 S6E2C2
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CSIO, EBI/EMI, Ethernet, I2C, LINbus, SD, SPI, UART/USART, USB
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 152
- Program Memory Size:
- 2MB (2M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 256K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 32x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E2C2AJ0AGB1000A FAQ
1.How can I place an order for S6E2C2AJ0AGB1000A through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E2C2AJ0AGB1000A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E2C2AJ0AGB1000A reliable?
The price and inventory of S6E2C2AJ0AGB1000A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E2C2AJ0AGB1000A is usually 5 days.
3.What payment methods are accepted for S6E2C2AJ0AGB1000A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E2C2AJ0AGB1000A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E2C2AJ0AGB1000A?
S6E2C2AJ0AGB1000A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E2C2AJ0AGB1000A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E2C2AJ0AGB1000A?
For technical support, including S6E2C2AJ0AGB1000A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2C2AJ0AGB1000A requirements.
6.How does Aetrix verify that S6E2C2AJ0AGB1000A is sourced from the original manufacturer or authorized distributors?
All S6E2C2AJ0AGB1000A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2C2AJ0AGB1000A meets industry standards.
7.What is the process for return or replacement of S6E2C2AJ0AGB1000A?
All S6E2C2AJ0AGB1000A units undergo pre-shipment inspection (PSI). If there is an issue with S6E2C2AJ0AGB1000A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E2C2AJ0AGB1000A part is unused and in its original packaging.
Return procedure for S6E2C2AJ0AGB1000A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6E2C2AJ0AGB1000A Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
