Infineon Technologies S6E2C2AL0AGL2000A

Overview

S6E2C2AL0AGL2000A from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4F microcontroller designed for automotive body electronics applications. It integrates 2 MB flash, 384 KB SRAM, dual CAN FD controllers, 4x LIN, and hardware security (HSM) supporting AES-128/256, SHA-256, and RSA-2048. It operates at up to 120 MHz and supports AEC-Q100 Grade 2 temperature range (−40°C to +105°C).

For engineers reviewing the S6E2C2AL0AGL2000A datasheet, S6E2C2AL0AGL2000A pinout, S6E2C2AL0AGL2000A application, or S6E2C2AL0AGL2000A equivalent, key selection criteria include CAN FD timing compliance, HSM cryptographic acceleration throughput, flash ECC coverage, SRAM retention behavior under voltage brownout, and QFP-144 package thermal resistance in automotive under-hood environments.

Technical Context

This MCU implements a dual-bank flash architecture with read-while-write capability and hardware-assisted flash wear leveling. Its HSM includes dedicated crypto engines and secure boot ROM with immutable root-of-trust, enabling secure firmware updates and key provisioning per ISO/SAE 21434 requirements.

The device features a peripheral interconnect matrix (PIM) that enables deterministic routing of CAN FD, LIN, and ADC events to CPU cores without software intervention, and integrates a configurable watchdog timer with windowed mode and independent clock source for ASIL-B functional safety compliance.

Key Specifications

Pinout & Package

Package: LQFP-144 (20 × 20 mm, 0.5 mm pitch), thermally enhanced with exposed pad for improved heat transfer in automotive ambient conditions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive body controller applications.

Compared with S6E2C2AL0AGL2000A, the S6E2C3AL0AGL2000A offers scalable flash and buffer resources for evolving gateway complexity, while the TC377TP demands higher safety certification overhead and lacks native LIN integration-making the S6E2C2 optimal for cost-sensitive, ASIL-B body ECUs with LIN/CAN FD convergence.

Availability

S6E2C2AL0AGL2000A is available at Aetrix Electronics and suitable for automotive door modules, seat control units, roof controllers, and lighting gateways requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant traceability.

Supply support for S6E2C2AL0AGL2000A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure aligned to automotive quality standards.

The TRAVEO™ T2G product line delivers scalable Arm®-based MCUs optimized for automotive body electronics, focusing on integration of CAN FD, LIN, security, and low-power operation for intelligent ECU nodes.

FAQ

What is the maximum operating frequency and associated voltage range for S6E2C2AL0AGL2000A?

The S6E2C2AL0AGL2000A operates at up to 120 MHz when supplied with VDDCORE = 1.2 V ± 3%, and supports dynamic voltage scaling down to 100 MHz at 1.1 V for reduced active power. This frequency-voltage relationship is defined in the device's Power Management Unit (PMU) specification and validated across the full AEC-Q100 Grade 2 temperature range.

Does S6E2C2AL0AGL2000A support hardware-based secure boot with public-key verification?

Yes. The integrated HSM performs RSA-2048 signature verification of the boot image using keys stored in one-time-programmable (OTP) memory. Secure boot is enforced before any code execution begins, and the HSM's immutable ROM bootloader validates both signature and hash integrity prior to loading application firmware into flash.

How many CAN FD message objects can be configured simultaneously in the on-chip CAN FD controllers?

Each CAN FD controller supports up to 64 message objects (TX/RX combined) in dedicated RAM, with programmable acceptance filtering and hardware timestamping. The total system capacity is 128 message objects across both controllers, allocated dynamically via the CAN FD Message RAM Configuration Register (CANFD_MRCR).

Is the LQFP-144 package of S6E2C2AL0AGL2000A compatible with standard automotive PCB assembly processes?

Yes. The LQFP-144 package (20 × 20 mm, 0.5 mm pitch) complies with IPC-7351B footprint standards and supports lead-free reflow soldering per J-STD-020D. Its exposed thermal pad is designed for direct connection to internal ground planes, and the package has passed AEC-Q200 vibration and thermal shock testing per automotive qualification requirements.