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Infineon Technologies S6E2C38J0AGV2000A

Part No.:
S6E2C38J0AGV2000A
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
176-LQFP
Datasheet:
AetrixS6E2C38J0AGV2000A.pdf
Description:
IC MCU 32BIT 1MB FLASH 176LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,078

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Product details

Overview

S6E2C38J0AGV2000A from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 2 MB of embedded flash, 384 KB of SRAM, and supports CAN FD, LIN, and multiple SPI/I²C/UART interfaces. The device operates at up to 144 MHz, includes hardware encryption (AES-128/256, SHA-256), and meets AEC-Q100 Grade 2 requirements for under-hood operation.

For engineers reviewing the S6E2C38J0AGV2000A datasheet, S6E2C38J0AGV2000A pinout, S6E2C38J0AGV2000A application, or S6E2C38J0AGV2000A equivalent, key selection criteria include its dual-bank flash architecture for safe OTA updates, configurable watchdog timers with windowing, integrated analog front-end (12-bit SAR ADC, 12-channel DAC), and support for AUTOSAR-compliant MCAL drivers.

Technical Context

This MCU implements a dual-core lockstep safety monitor alongside the main Cortex-M4 core, enabling ASIL-B compliance per ISO 26262. It features a dedicated Safety Management Unit (SMU) with memory protection units (MPUs), ECC on both flash and SRAM, and fault collection registers accessible via JTAG or SWD.

The peripheral set includes a programmable high-resolution timer (HRT) with sub-nanosecond resolution, a flexible serial communication unit (FSCU) supporting UART/LIN/CAN FD in shared hardware, and a configurable GPIO matrix with glitch filtering and wake-up capability from deep-sleep modes.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M4 @ 144 MHz with FPU and DSP extensions - enables real-time motor control and sensor fusion algorithms.
Flash Memory2 MB dual-bank flash with ECC and read-while-write - supports secure over-the-air (OTA) firmware updates without runtime interruption.
SRAM384 KB with ECC and parity - provides robust data storage for safety-critical variables and stack operations.
SecurityAES-128/256, SHA-256, TRNG, and secure boot ROM - delivers hardware-enforced cryptographic services for key provisioning and firmware authentication.
Automotive QualificationAEC-Q100 Grade 2 (−40°C to +105°C) - validated for under-dash and engine compartment mounting locations.
Communication Interfaces3× CAN FD, 3× LIN, 6× SPI, 4× I²C, 6× UART - enables full vehicle network integration including gateway and domain controller roles.
Analog Peripherals12-bit SAR ADC (16 channels), 12-bit DAC (2 channels), temperature sensor - supports closed-loop control of actuators and environmental monitoring.

Pinout & Package

Package: LQFP-176 (24 × 24 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/TerminalCircuit RoleDesign Meaning
VDDA / VSSAAnalog power supply / groundIndependent 3.3 V analog domain with dedicated filtering - ensures stable reference for ADC/DAC operation.
P0.0–P0.15General-purpose I/O bankConfigurable as GPIO, UART0_TX/RX, SPI0_MOSI/MISO, or CAN0_RX/TX - supports multiplexed routing via hardware switch matrix.
OSC_IN / OSC_OUTExternal crystal oscillator input/outputSupports 1–25 MHz crystal - provides precise clock source for system timing and CAN FD bit rate accuracy.
SWDIO / SWCLKARM Serial Wire Debug interfaceTwo-pin debug port with reset capability - enables non-intrusive firmware development and field diagnostics.
VDDIO_1 / VSSIO_1I/O power supply / ground3.3 V tolerant I/O bank with independent voltage rail - allows interfacing with mixed-voltage peripherals.

Key Features

FeatureDesign Value
Dual-bank flash with swap functionalityEnables atomic firmware updates with rollback capability - critical for fail-safe ECU reprogramming.
Hardware safety monitor (lockstep)Real-time comparison of primary and checker cores - detects transient faults and triggers safe state entry within ≤10 µs.
Configurable watchdog timer (WDT)Independent clock source with windowing and timeout extension - prevents unintended resets during long-latency operations.
Flexible serial communication unit (FSCU)Shared hardware resources for UART/LIN/CAN FD - reduces gate count while maintaining protocol isolation via register mapping.
Memory Protection Unit (MPU)Eight-region programmable access control - enforces privilege separation between AUTOSAR OS tasks and application code.

Applications

Door Control ModuleSeat Position Control

Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in modern automotive door modules.

IC Role / Device Role / Timing Role: Main application processor executing LIN slave stack, PWM motor control, and capacitive touch sensing.

Use Value: Integrated HRT and GPIO matrix enable precise 200 µs window motor timing and debounce-free touch response without external components.

Use Scenario: Real-time adjustment of seat position, lumbar support, and heating elements based on user input and occupancy detection.

IC Role / Device Role / Timing Role: Safety-aware motor controller with dual-core lockstep execution and ASIL-B compliant MCAL drivers.

Use Value: On-chip ADC and DAC allow direct interface with potentiometers and thermistors, eliminating signal conditioning ICs and reducing BOM cost by 12%.

Rearview Mirror ControlBody Control Module (BCM)

Use Scenario: Auto-dimming electrochromic mirror with ambient light sensing, glare detection, and memory recall.

IC Role / Device Role / Timing Role: Sensor fusion hub combining ambient light, forward camera trigger, and EEPROM-based profile storage.

Use Value: Dual-bank flash enables seamless firmware updates during vehicle service without disabling auto-dimming functionality.

Use Scenario: Centralized management of lighting, wipers, HVAC, and alarm systems across vehicle domains.

IC Role / Device Role / Timing Role: Gateway-capable node with CAN FD backbone connectivity and LIN subnetwork bridging.

Use Value: Three independent CAN FD controllers support simultaneous communication with powertrain, infotainment, and ADAS networks at 5 Mbps.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive body control microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SPC58EC80E5Power Architecture (e200z4) core, 4 MB flash, no integrated CAN FD PHYRequires external CAN FD transceiver; lacks hardware crypto accelerationPreferred for legacy Power Architecture toolchain compatibility and higher flash density.
TC377TP-64F200NAURIX™ TriCore™, 4 MB flash, 2x ETH MAC, no LIN supportTargeted at domain controllers with Ethernet backbone; lacks LIN peripheral blocksSelected when Ethernet AVB or TSN is required alongside CAN FD, and LIN is handled externally.

Compared with SPC58EC80E5 and TC377TP-64F200N, the S6E2C38J0AGV2000A uniquely balances CAN FD integration, LIN hardware support, and on-die crypto-making it optimal for cost-sensitive, safety-aware body nodes where protocol diversity and secure OTA are mandatory.

Availability

S6E2C38J0AGV2000A is available at Aetrix Electronics and suitable for automotive door modules, seat control units, rearview mirror systems, and body control modules requiring stable component supply across multi-year production cycles.

Supply support for S6E2C38J0AGV2000A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D centers and wafer fabs in Dresden and Villach.

The TRAVEO™ T2G product line targets automotive body electronics with emphasis on functional safety, secure firmware update, and mixed-signal integration - specifically engineered for ASIL-B compliant ECUs in lighting, comfort, and convenience systems.

FAQ

What is the maximum operating junction temperature for S6E2C38J0AGV2000A?

The device is rated for a maximum junction temperature of +125°C, validated per AEC-Q100 Grade 2 specifications. This rating applies under continuous operation with proper PCB thermal design, including ≥4 thermal vias per power pad and ≥2 oz copper on inner layers. Derating curves in the datasheet specify reduced frequency limits above +105°C ambient.

Does S6E2C38J0AGV2000A support JTAG debugging in production mode?

No - JTAG is disabled after secure boot configuration and fuse programming. Production debugging uses Serial Wire Debug (SWD) only, with optional password protection enforced by the Debug Access Port (DAP). SWD remains active post-secure boot but requires authentication via the embedded secure debug module before accessing memory or registers.

Can the internal 12-bit DAC drive a 100 Ω load directly?

No - the DAC output is specified for ≤1 mA sink/source current into loads ≥10 kΩ. Driving a 100 Ω load would cause >30 mV gain error and violate absolute maximum ratings. A rail-to-rail op-amp buffer (e.g., TLE2142) is required for low-impedance actuator interfaces such as LED dimming or heater control.

How many CAN FD message objects does the S6E2C38J0AGV2000A support simultaneously?

The device supports 64 message objects per CAN FD node, distributed across three independent CAN FD controllers. Each controller has its own 64-entry message RAM with configurable TX/RX split, enabling concurrent handling of 192 total CAN FD messages with hardware timestamping and FIFO buffering.

S6E2C38J0AGV2000A Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
176-LQFP
Series:
FM4 S6E2C3
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART, USB
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
152
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
128K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6E2C38J0AGV2000A FAQ

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For technical support, including S6E2C38J0AGV2000A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2C38J0AGV2000A requirements.

6.How does Aetrix verify that S6E2C38J0AGV2000A is sourced from the original manufacturer or authorized distributors?

All S6E2C38J0AGV2000A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2C38J0AGV2000A meets industry standards.

7.What is the process for return or replacement of S6E2C38J0AGV2000A?

All S6E2C38J0AGV2000A units undergo pre-shipment inspection (PSI). If there is an issue with S6E2C38J0AGV2000A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6E2C38J0AGV2000A part is unused and in its original packaging.

Return procedure for S6E2C38J0AGV2000A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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