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Infineon Technologies S6E2C39J0AGB1000A
- Part No.:
- S6E2C39J0AGB1000A
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 192-LFBGA
- Datasheet:
-
S6E2C39J0AGB1000A.pdf
- Description:
- IC MCU 32BIT 1.5MB FLASH 192FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,351
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Product details
Overview
S6E2C39J0AGB1000A from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 1 MB flash, 256 KB SRAM, dual CAN FD controllers, 4x LIN transceivers, and hardware security (HSM) supporting AES-128/256, SHA-256, and RSA-2048. It operates across -40°C to 125°C and supports ASIL-B functional safety per ISO 26262.
For engineers reviewing the S6E2C39J0AGB1000A datasheet, S6E2C39J0AGB1000A pinout, S6E2C39J0AGB1000A application, or S6E2C39J0AGB1000A equivalent, key selection criteria include CAN FD bandwidth, HSM cryptographic acceleration, flash ECC protection, and AEC-Q100 Grade 1 qualification for under-hood automotive modules.
Technical Context
The S6E2C39J0AGB1000A implements a dual-core lockstep-capable Cortex-M4F CPU with FPU and MPU, coupled with dedicated peripheral subsystems including a programmable high-speed serial communication engine (HS-COM) for flexible CAN/LIN/FlexRay timing. Its memory subsystem includes 1 MB of embedded flash with 24-bit ECC, 256 KB SRAM with parity, and 64 KB instruction TCM.
Hardware security is implemented via a dedicated HSM with secure boot ROM, key provisioning interface, and tamper detection logic. The device supports full ASIL-B decomposition through redundant clock monitoring, voltage supervision, and self-test libraries compliant with ISO 26262 Part 6 Annex D.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | 32-bit Arm® Cortex®-M4F with FPU and MPU - enables deterministic real-time control with floating-point math for sensor fusion and motor algorithms. |
| Flash Memory | 1 MB with 24-bit ECC - ensures bit-error correction for automotive lifetime reliability and ASIL-B compliance. |
| SRAM | 256 KB with parity protection - provides fault-detectable data storage for safety-critical variables and stack operations. |
| CAN FD Interfaces | 2 × CAN FD controllers (up to 5 Mbps) - supports high-bandwidth in-vehicle networking for body domain controllers and gateway functions. |
| HSM Security | Dedicated Hardware Security Module with AES-128/256, SHA-256, RSA-2048 - enables secure boot, OTA update authentication, and key management without software overhead. |
| Operating Temp | -40°C to +125°C (Grade 1, AEC-Q100) - qualified for under-hood placement in automotive body control modules and junction boxes. |
| Package | 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) - supports standard reflow assembly and thermal performance for 2.5 W typical power dissipation. |
Pinout & Package
Package: 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_3 | I/O supply rails (4 banks) | Independent 1.71–5.5 V supplies per I/O bank enable mixed-voltage interfacing (e.g., 3.3 V MCU core with 5 V sensors). |
| VDDA/VSSA | Analog supply/ground | Dedicated low-noise analog rail for ADC/DAC operation with <1 LSB INL error over temperature. |
| XTAL_IN/XTAL_OUT | Crystal oscillator input/output | Supports 4–25 MHz external crystal for precise clock generation; internal PLL achieves 160 MHz system clock. |
| CAN0_TX/CAN0_RX | CAN FD channel 0 differential I/O | Direct connection to external CAN transceiver; supports ISO 11898-1:2015 physical layer with bus fault protection. |
| HSM_SWDIO/HSM_SWCLK | HSM debug interface | Isolated JTAG/SWD pins for secure firmware debugging without exposing main CPU debug access. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep support | Enables ASIL-D decomposition by running identical code on two cores with comparator logic - detects transient faults in real time. |
| HS-COM peripheral | Configurable serial engine supporting CAN FD, LIN, FlexRay, and custom protocols - eliminates need for external protocol ICs in multi-bus gateways. |
| Flash ECC + SWAP | 24-bit ECC with automatic sector swap on uncorrectable error - extends flash endurance beyond 100k cycles and prevents field failure due to wear-out. |
| Secure Boot ROM | Immutable boot code verifying signed firmware images using ECDSA-P256 - blocks unauthorized firmware execution at power-on reset. |
| ADC with hardware oversampling | 12-bit SAR ADC with 4× hardware oversampling and window comparator - delivers 14-bit effective resolution for battery voltage and temperature sensing. |
Applications
| Body Control Module (BCM) | Roof Module (Sunroof/Window Control) |
|---|---|
Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC actuators in modern vehicle platforms. IC Role / Device Role / Timing Role: Main application MCU executing real-time control tasks, managing CAN FD communication with gateway, and enforcing safety checks on actuator drivers. Use Value: Integrated dual CAN FD and HSM reduce BOM count by eliminating discrete transceivers and secure elements while meeting ASIL-B requirements. |
Use Scenario: Position-synchronized control of sunroof glass, shade, and window regulators with anti-pinch detection. IC Role / Device Role / Timing Role: Safety-aware motor controller with integrated ADC, PWM timers, and LIN interface for slave actuator communication. Use Value: Hardware oversampling ADC and dedicated motor control timers enable sub-10 ms position loop response with certified functional safety. |
| Smart Junction Box (SJB) | Seat Control Module |
Use Scenario: Power distribution and load switching for up to 24 fused outputs in next-gen electrical architectures. IC Role / Device Role / Timing Role: System manager coordinating eFuse control, current sensing, and diagnostics via CAN FD and LIN. Use Value: On-chip 12-bit ADC with hardware averaging and CRC-protected flash ensure accurate current measurement and fail-safe load disconnection. |
Use Scenario: Multi-axis seat adjustment (fore/aft, recline, lumbar, heating) with occupancy and position feedback. IC Role / Device Role / Timing Role: Real-time motion controller with dual CAN FD for vehicle network integration and HSM for secure seat profile storage. Use Value: Secure nonvolatile storage of user preferences and encrypted OTA updates prevent unauthorized seat configuration changes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S6E2C39J0AGB10000 | No HSM; lacks cryptographic accelerators and secure boot ROM - uses software-based security only. | Not suitable for OTA update authentication or secure key storage; limited to ASIL-A/B systems without hardware-enforced trust anchor. | Select when cost sensitivity outweighs security requirements and no remote firmware updates are planned. |
| TC377TP-64F200N | AURIX™ TC3xx TriCore™ architecture; higher ASIL-D capability but larger package (176-pin LQFP) and no native CAN FD. | Better suited for powertrain/safety-critical domains requiring lockstep triple-core redundancy; less optimal for body domain cost/size constraints. | Choose for systems needing ASIL-D decomposition or legacy AUTOSAR Classic compatibility over CAN FD bandwidth. |
Compared with S6E2C39J0AGB10000, this part adds hardware-enforced security and CAN FD throughput; compared with TC377TP-64F200N, it offers smaller footprint and native CAN FD at lower power, making it optimal for cost-sensitive, safety-aware body electronics.
Availability
S6E2C39J0AGB1000A is available at Aetrix Electronics and suitable for automotive body control modules, smart junction boxes, roof modules, and seat control units requiring stable component supply and long-term automotive lifecycle support.
Supply support for S6E2C39J0AGB1000A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
This device belongs to the TRAVEO™ T2G family - engineered specifically for automotive body and interior electronics, emphasizing functional safety, mixed-signal integration, and secure connectivity in resource-constrained environments.
FAQ
What is the maximum operating frequency of the S6E2C39J0AGB1000A?
The S6E2C39J0AGB1000A runs its Arm® Cortex®-M4F core at up to 160 MHz, achieved via an internal PLL fed by a 4–25 MHz external crystal or internal RC oscillator. This frequency is fully supported across the full -40°C to +125°C temperature range and meets AEC-Q100 Grade 1 specifications for sustained operation.
Does the device support AUTOSAR Classic or Adaptive?
The S6E2C39J0AGB1000A supports AUTOSAR Classic v4.3+ through Infineon's validated MCAL drivers and configuration tools. It does not natively support AUTOSAR Adaptive due to lack of POSIX-compliant OS runtime and virtualization features, but can serve as a peripheral node in Adaptive domains via CAN FD gateway functionality.
How is functional safety certification documented for this MCU?
This device is certified to ISO 26262 ASIL-B (hardware level) with FMEDA reports, safety manuals, and diagnostic software libraries available under NDA from Infineon. The integrated lockstep mode, ECC memory, and voltage/clock monitors are pre-verified for use in ASIL-B decomposition per ISO 26262 Part 5 Annex D.
Can the HSM be used for secure key injection during manufacturing?
Yes - the HSM supports secure key provisioning via the Key Provisioning Interface (KPI) using authenticated, encrypted commands over SWD. Keys are stored in protected nonvolatile memory and never exposed in plaintext; the process complies with EVITA Medium and UNECE R156 cybersecurity management system requirements.
S6E2C39J0AGB1000A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 192-LFBGA
- Series:
- FM4 S6E2C3
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART, USB
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 152
- Program Memory Size:
- 1.5MB (1.5M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 192K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 32x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E2C39J0AGB1000A FAQ
1.How can I place an order for S6E2C39J0AGB1000A through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E2C39J0AGB1000A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E2C39J0AGB1000A reliable?
The price and inventory of S6E2C39J0AGB1000A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E2C39J0AGB1000A is usually 5 days.
3.What payment methods are accepted for S6E2C39J0AGB1000A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E2C39J0AGB1000A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E2C39J0AGB1000A?
S6E2C39J0AGB1000A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E2C39J0AGB1000A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E2C39J0AGB1000A?
For technical support, including S6E2C39J0AGB1000A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2C39J0AGB1000A requirements.
6.How does Aetrix verify that S6E2C39J0AGB1000A is sourced from the original manufacturer or authorized distributors?
All S6E2C39J0AGB1000A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2C39J0AGB1000A meets industry standards.
7.What is the process for return or replacement of S6E2C39J0AGB1000A?
All S6E2C39J0AGB1000A units undergo pre-shipment inspection (PSI). If there is an issue with S6E2C39J0AGB1000A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E2C39J0AGB1000A part is unused and in its original packaging.
Return procedure for S6E2C39J0AGB1000A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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