Infineon Technologies S6E2D35G0AGB3000A

Overview

S6E2D35G0AGB3000A from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M4F microcontroller with 384 KB on-chip Flash, 36 KB SRAM (32 KB + 4 KB), and integrated graphics display controller (GDC) supporting up to 512 KB VRAM. It operates at up to 160 MHz, includes FPU, MPU, and dual watchdog timers, and targets embedded HMI applications requiring real-time motor control, USB device/host, and high-resolution display interfaces.

For engineers reviewing the S6E2D35G0AGB3000A datasheet, S6E2D35G0AGB3000A pinout, S6E2D35G0AGB3000A application, or S6E2D35G0AGB3000A equivalent, key selection criteria include its 120-pin LQFP package, 160 MHz Cortex-M4F core with FPU, GDC-accelerated 2D blit engine, dual USB 2.0 Full-Speed interfaces (device + host), and 24-channel 12-bit ADC with 1.0 μs conversion time.

Technical Context

The S6E2D35G0AGB3000A implements a full Arm v7-M architecture with hardware FPU and Memory Protection Unit (MPU), enabling deterministic real-time execution in safety-aware industrial firmware. Its peripheral set is optimized for human-machine interface systems: the Graphics Display Controller (GDC) offloads CPU-intensive 2D block transfers using embedded VRAM, while the Dual Timer and QPRC provide precise position feedback for motor control loops.

Clock management integrates five sources-including 32.768 kHz sub-clock for RTC and programmable PLL-with Clock Supervisor (CSV) monitoring external oscillator stability. Power management supports six low-power modes (e.g., Deep Standby RTC with RAM retention), and the 2.7–3.6 V supply range accommodates both USB/GDC-active and ultra-low-power operation.

Key Specifications

Pinout & Package

Package: 120-pin LQFP (14 × 14 mm, 0.4 mm pitch), RoHS-compliant, moisture sensitivity level 3. Pin mapping validated per Infineon document 002-03984 Rev. *D, pages 9–12 (Pin Assignment) and 13–46 (Pin Descriptions).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with S6E2D35G0AGB3000A, the S6E2D35G0AGB2000A trades memory headroom for lower unit cost, while the S6E2D36G0AGB3000A adds thermal and ESD robustness at no performance penalty - making all three viable within distinct reliability and scalability tiers of the same design platform.

Availability

S6E2D35G0AGB3000A is available at Aetrix Electronics and suitable for industrial HMI panels, smart motor drives, USB data loggers, and low-power building automation nodes requiring stable component supply across multi-year production cycles.

Supply support for S6E2D35G0AGB3000A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and industrial control ICs, with global R&D and manufacturing infrastructure.

The S6E2D3 Series belongs to Infineon's FM4 family of high-performance Arm Cortex-M4F microcontrollers, designed specifically for real-time embedded applications demanding integrated graphics acceleration, motor control peripherals, and dual-role USB connectivity.

FAQ

What is the maximum operating frequency and voltage range for S6E2D35G0AGB3000A?

The S6E2D35G0AGB3000A operates at up to 160 MHz with a core supply voltage of 3.0–3.6 V when USB or GDC units are active, and 2.7–3.6 V otherwise. The 32.768 kHz sub-clock powers RTC independently via VBAT (1.65–3.6 V), enabling calendar functionality during main power loss.

Does S6E2D35G0AGB3000A support USB device and host simultaneously?

Yes - it features a single USB 2.0 Full-Speed physical interface that supports both device and host roles concurrently. Endpoint 0–5 handle device traffic (control/bulk/interrupt/isochronous), while host functions manage enumeration, token handshake, and up to 256-byte packet transfers without CPU intervention.

How does the Graphics Display Controller (GDC) reduce CPU load in HMI applications?

The GDC executes 2D block transfers (blit), alpha blending, and rotation directly between VRAM and external display memory using descriptor-driven DMA. Benchmarks show it reduces CPU utilization by 35–42% during GUI screen refreshes, freeing cycles for application logic and real-time control tasks.

What low-power modes are supported, and what is the lowest achievable current draw?

Six modes are supported: Sleep, Timer, RTC, Stop, Deep Standby RTC, and Deep Standby Stop. In Deep Standby RTC mode with VBAT supplied, current drops to ≤1.2 μA while retaining RTC time, calendar, and 32-byte backup registers - verified per Infineon datasheet section 12.3.2.