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Infineon Technologies S6E2D35G0AGE20000

Part No.:
S6E2D35G0AGE20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
120-LQFP
Datasheet:
AetrixS6E2D35G0AGE20000.pdf
Description:
IC MCU 32BIT 384KB FLASH 120LQFP
Quantity:
Payment:
Payment
Shipping:
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Inventory:1,931

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Product details

Overview

S6E2D35G0AGE20000 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M4F microcontroller with 384 KB on-chip Flash, 36 KB SRAM (32 KB + 4 KB), and integrated graphics display controller (GDC). It operates at up to 160 MHz, includes hardware FPU, MPU, and supports USB 2.0 Full-Speed device/host, 24-channel 12-bit ADC, and motor control peripherals. Used in industrial HMI and embedded display systems requiring real-time graphics acceleration and deterministic motor timing.

For engineers reviewing the S6E2D35G0AGE20000 datasheet, S6E2D35G0AGE20000 pinout, S6E2D35G0AGE20000 application, or S6E2D35G0AGE20000 equivalent, key selection criteria include GDC memory interface support (up to 512 KB VRAM), dual watchdog timers (HW/SW), RTC with leap-year handling, QPRC for encoder position tracking, and 120-pin LQFP package compatibility with external SDRAM/HyperBus expansion.

Technical Context

The S6E2D35G0AGE20000 implements an Arm Cortex-M4F core (r0p1) with hardware floating-point unit and Memory Protection Unit, enabling deterministic real-time execution in safety-aware industrial firmware. Its peripheral set integrates dedicated motor control blocks-including dead-time insertion, DTIF emergency stop interrupt, and A/D activation compare-alongside a 24-channel 12-bit ADC with 1.0 μs conversion time at 3.3 V.

Graphics capability is anchored by the GDC unit supporting 2D blit acceleration and external display interfaces including High-Speed Quad SPI, SDRAM, and Hyper Bus Interface (HBI), with up to 512 KB dedicated VRAM and optional 2 MB VFLASH. Clock management includes five sources (main/sub/CR/PLL), CSV for external oscillator failure detection, and six low-power modes with VBAT-backed RTC and 32-byte backup registers.

Key Specifications

Parameter Value and Actual Design Meaning
Core Arm Cortex-M4F (r0p1), 160 MHz max - enables DSP-intensive motor control and real-time graphics rendering without external co-processor.
Memory 384 KB Flash + 36 KB SRAM (32 KB I/D + 4 KB system) - sufficient for bootloader, RTOS, and application code with minimal external memory dependency.
GDC Support Up to 512 KB VRAM + 2 MB VFLASH - allows local storage and fast transfer of frame buffers and GUI assets for standalone display subsystems.
ADC 24-channel, 12-bit SAR, 1.0 μs @ 3.3 V - meets sampling requirements for multi-axis motor current sensing and analog sensor fusion.
USB Interface Full-Speed device/host, 6 endpoints (EP0–EP5), EP1 double-buffered at 256 B - supports HID-class HMI devices and host-side firmware updates via USB mass storage.
Package 120-pin LQFP (14 × 14 mm, 0.4 mm pitch) - provides 98 GPIOs with port relocation, 5V-tolerant pins for legacy interface bridging, and thermal performance suitable for fanless industrial enclosures.
Power Supply VCC = 3.0–3.6 V (with USB/GDC active); VBAT = 1.65–3.6 V - enables battery-backed RTC operation and brown-out resilience during main rail transients.

Pinout & Package

Package: 120-pin LQFP (14 mm × 14 mm, 0.4 mm pitch), RoHS-compliant, moisture sensitivity level 3. Thermal pad exposed on bottom for enhanced heat dissipation in continuous motor control operation.

Pin/Terminal Circuit Role Design Meaning
VCC / VSS Power supply / Ground Dual VCC domains (core/analog/USB/GDC) with separate VSS returns - requires independent decoupling per domain to suppress switching noise coupling into ADC or USB PHY.
XTAL / EXTAL Main crystal oscillator input/output Supports 4–20 MHz crystals - used as primary clock source for PLL; frequency stability directly impacts USB timing compliance and motor PWM jitter.
RTC_XIN / RTC_XOUT 32.768 kHz RTC crystal interface Enables calendar-accurate timekeeping with leap-year correction; VBAT-supplied path maintains operation during main power loss.
USB_DP / USB_DM USB 2.0 Full-Speed differential pair On-die termination and internal pull-ups eliminate need for external resistors - simplifies layout and ensures USB enumeration reliability in EMI-prone environments.
GDC_A0–A23 / GDC_D0–D15 Graphics display controller address/data bus Direct parallel interface to external SDRAM or HyperBus memory - enables high-bandwidth pixel data streaming for 480×272+ displays without CPU intervention.
AIN / BIN / ZIN Quadrature encoder inputs Dedicated QPRC inputs with configurable edge detection - supports incremental encoder feedback for closed-loop servo positioning with sub-millisecond latency.

Key Features

Feature Design Value
Hardware FPU + DSP instructions Accelerates trigonometric, filter, and vector math for field-oriented motor control - eliminates software emulation overhead and improves loop timing consistency.
Dual watchdog timers (HW + SW) Hardware watchdog runs on 100 kHz CR oscillator - remains active in all low-power modes except RTC/Stop, ensuring fail-safe recovery even during deep sleep.
GDC with 2D blit engine Offloads GUI composition from CPU - reduces CPU load by >40% in static screen updates and enables smooth animation at 30+ FPS on VGA-resolution displays.
Motor control timer blocks Includes dead-time insertion, DTIF emergency stop, and A/D activation compare - enables single-chip implementation of three-phase inverter gate drive with hardware-enforced safety interlocks.
Peripheral clock gating Per-module clock enable/disable via register - cuts dynamic power by up to 35% when unused peripherals (e.g., LIN, I²S) are disabled during HMI-only operation.

Applications

Industrial HMI Display Terminal Brushless DC Motor Controller

Use Scenario: Standalone panel-mounted operator interface with TFT LCD, touch overlay, and local data logging.

IC Role / Device Role / Timing Role: Primary MCU executing GUI framework, managing USB-CDC firmware updates, and driving display via GDC + SDRAM interface.

Use Value: Integrated VRAM and blit engine reduce external memory count by one chip; 160 MHz core sustains 60 Hz UI refresh while servicing CAN/LIN comms and SD card writes.

Use Scenario: Compact 3-phase BLDC driver for HVAC blowers or pump modules with Hall-effect or encoder feedback.

IC Role / Device Role / Timing Role: Real-time motor commutation controller using QPRC for rotor position, base timers for PWM generation, and ADC for current sensing.

Use Value: Hardware dead-time insertion and DTIF interrupt ensure safe gate drive sequencing; 1.0 μs ADC enables precise current loop sampling at 100 kHz switching frequency.

Smart Energy Meter with Display Programmable Logic Controller (PLC) I/O Module

Use Scenario: DIN-rail mounted electricity meter with segmented LCD and IR/USB communication for tariff configuration.

IC Role / Device Role / Timing Role: System controller handling metrology calculations, RTC-based billing intervals, and secure firmware updates over USB.

Use Value: Dual watchdogs and MPU enforce firmware integrity; VBAT-backed RTC and 32-byte backup registers retain billing state across power cycles without supercapacitor.

Use Scenario: Modular digital I/O expansion unit with isolated inputs/outputs, Modbus RTU over RS-485, and local logic execution.

IC Role / Device Role / Timing Role: Protocol processor managing UART-to-Modbus framing, GPIO scanning, and watchdog supervision of fieldbus communication stack.

Use Value: Eight-channel DMA and DSTC offload serial protocol processing from CPU; 98 GPIOs with port relocation simplify PCB routing for mixed-voltage I/O banks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S6E2D35G0AGL20000 Same die, 100-pin LQFP package - 22 fewer GPIOs, no CS8 (SDRAM) support, reduced external bus width (16-bit only). Suitable for cost-sensitive HMI designs without SDRAM or HyperBus expansion needs. Select when board space or BOM cost constraints outweigh need for external memory bandwidth or encoder interface pins.
S6E2D36G0AGE20000 Same package, 512 KB Flash (vs. 384 KB), identical peripherals and clocking - higher code density margin for complex GUI or safety-certified stacks. Preferred for ASIL-B functional safety implementations requiring dual-core lockstep or certified RTOS footprint. Choose when future firmware growth, safety certification, or bootloader+application separation demand extra Flash headroom.

Compared with S6E2D35G0AGE20000, the LQFP-100 variant trades pin count and memory interface capability for lower cost and smaller footprint, while the 512 KB Flash variant retains full feature parity but adds headroom for secure boot, OTA update partitions, and certified safety libraries without external Flash reliance.

Availability

S6E2D35G0AGE20000 is available at Aetrix Electronics and suitable for industrial HMI display terminals, brushless DC motor controllers, and smart energy meters requiring stable component supply, long-term lifecycle support, and qualified automotive-grade traceability.

Supply support for S6E2D35G0AGE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and industrial control solutions, with global manufacturing and quality certification to ISO/TS 16949 and IEC 61508.

The S6E2D3 Series belongs to Infineon's FM4 family of high-performance Arm Cortex-M4F microcontrollers, designed specifically for real-time industrial automation, motor control, and human-machine interface applications demanding integrated graphics, precision timing, and functional safety readiness.

FAQ

What is the maximum operating frequency of the S6E2D35G0AGE20000 core?

The Arm Cortex-M4F core operates at up to 160 MHz, enabled by the on-chip Main PLL with external crystal input (4–20 MHz). This frequency is sustained across the full VCC range (3.0–3.6 V) and ambient temperature (–40°C to +105°C), with flash accelerator eliminating wait states up to 72 MHz and maintaining equivalent access speed beyond that via trace buffer and prefetch logic.

Does the S6E2D35G0AGE20000 support USB device and host mode simultaneously?

No, the single USB interface supports device mode and host mode, but not concurrently. Device mode provides up to 6 endpoints (including 256-byte EP1) for CDC/HID classes; host mode supports up to 256-byte packets, automatic device attach/detach detection, and Low/Full-Speed enumeration. Mode selection is configured at reset via dedicated register bits and requires firmware reinitialization to switch.

How is graphics memory managed for the GDC unit?

The GDC uses dedicated VRAM (up to 512 KB) allocated from external SDRAM or HyperBus memory mapped at 0x6000_0000–0x7FFF_FFFF. Internal VFLASH (2 MB) may store compressed GUI assets. The GDC engine performs autonomous 2D blit operations using descriptor lists, freeing the CPU from pixel-level transfers while supporting alpha blending and clipping through hardware registers.

What low-power modes are available and which peripherals remain active?

Six modes are supported: Sleep (CPU stopped, peripherals active), Timer (RTC + WDT running), RTC (RTC + 32 kB backup RAM), Stop (all clocks halted except RTC), Deep Standby RTC (VBAT-powered RTC + optional RAM retention), and Deep Standby Stop (VBAT-only RTC). In Stop mode, only RTC, backup registers, and wakeup pins remain functional; in Deep Standby RTC, the 32.768 kHz oscillator and 32-byte backup registers stay powered from VBAT.

S6E2D35G0AGE20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
120-LQFP
Series:
FM4 S6E2D3
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
98
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
36K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6E2D35G0AGE20000 FAQ

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Please submit a Request for Quotation (RFQ) for S6E2D35G0AGE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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5.How can I obtain technical support or documentation for S6E2D35G0AGE20000?

For technical support, including S6E2D35G0AGE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2D35G0AGE20000 requirements.

6.How does Aetrix verify that S6E2D35G0AGE20000 is sourced from the original manufacturer or authorized distributors?

All S6E2D35G0AGE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2D35G0AGE20000 meets industry standards.

7.What is the process for return or replacement of S6E2D35G0AGE20000?

All S6E2D35G0AGE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E2D35G0AGE20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6E2D35G0AGE20000 part is unused and in its original packaging.

Return procedure for S6E2D35G0AGE20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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