Infineon Technologies S6E2D35G0AGV20000

Overview

S6E2D35G0AGV20000 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M4F microcontroller with 384 KB on-chip Flash, 36 KB SRAM (32 KB + 4 KB), and integrated graphics display controller (GDC) supporting up to 512 KB VRAM. It operates at up to 160 MHz, includes FPU, MPU, and hardware CRC accelerators, and targets embedded HMI applications requiring real-time motor control, USB device/host, and high-resolution display interfaces.

For engineers reviewing the S6E2D35G0AGV20000 datasheet, S6E2D35G0AGV20000 pinout, S6E2D35G0AGV20000 application, or S6E2D35G0AGV20000 equivalent, key selection criteria include its dual-bank Flash security features, 98 GPIOs in 120-pin LQFP package, GDC-accelerated 2D blit engine, and support for external SDRAM/HyperBus via EBI - critical for industrial HMI and motor-driven UI systems.

Technical Context

The S6E2D35G0AGV20000 implements a full Arm Cortex-M4F core (r0p1) with FPU and DSP extensions, enabling deterministic floating-point math and signal processing for motor control loops and audio preprocessing. Its memory subsystem integrates separate I-code/D-code SRAM0 (32 KB) and system-bus SRAM2 (4 KB), plus dedicated VRAM (up to 512 KB) and VFLASH (2 MB) for graphics assets.

Peripheral architecture centers on concurrent real-time operation: eight-channel DMA, 128-channel DSTC for descriptor-driven transfers, dual watchdogs (hardware + software), and multi-mode serial interfaces (UART/CSIO/LIN/I²C ×8) with independent FIFOs and baud rate generators - all synchronized to a flexible clock tree with five sources and CSV-based clock supervision.

Key Specifications

Pinout & Package

Package: 120-pin LQFP (14 mm × 14 mm, 0.4 mm pitch), RoHS-compliant, with thermal pad. Pin mapping validated per Infineon document 002-03984 Rev. *D, pages 9–12 (Pin Assignment) and pages 13–46 (Pin Descriptions).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with S6E2D35G0AGV20000, the S6E2D35G0AGV2000A offers identical functionality in tape-and-reel packaging for high-volume manufacturing, while the S6E2D36G0AGV20000 provides scalable memory headroom - both maintain full pin and software compatibility, enabling drop-in upgrades without PCB redesign.

Availability

S6E2D35G0AGV20000 is available at Aetrix Electronics and suitable for industrial HMI panels, smart appliance control units, medical infusion pumps, and automotive body control modules requiring stable component supply, long-term lifecycle support, and qualified automotive-grade sourcing.

Supply support for S6E2D35G0AGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and embedded controllers, with global R&D and manufacturing infrastructure.

The S6E2D3 Series belongs to Infineon's FM4 family of high-performance Arm Cortex-M4F microcontrollers, designed specifically for real-time industrial and automotive human-machine interface and motor control applications requiring graphics acceleration, robust connectivity, and functional safety readiness.

FAQ

What is the maximum operating frequency and supported voltage range for S6E2D35G0AGV20000?

The S6E2D35G0AGV20000 operates at up to 160 MHz core frequency. Its VCC supply must be 3.0–3.6 V when USB or GDC functions are active, or 2.7–3.6 V otherwise. VBAT supply ranges from 1.65–3.6 V and powers RTC and backup registers independently. These ranges are specified in the Absolute Maximum Ratings table (Section 7.1) and DC Characteristics (Section 7.2) of datasheet 002-03984 Rev. *D.

Does S6E2D35G0AGV20000 support external SDRAM, and what interface signals are required?

Yes, it supports external SDRAM via the External Bus Interface (EBI) using chip select CS8, 16-bit data bus (D0–D15), 25-bit address bus (A0–A24), and control signals including SDRAM_CLK, SDRAM_CAS, SDRAM_RAS, SDRAM_WE, and SDRAM_BA0/BA1. The EBI supports address/data multiplexing and external RDY handshake, as detailed in Section 12.3 of the Peripheral Manual (002-04856).

How many USB endpoints does S6E2D35G0AGV20000 support, and what transfer types are available?

The USB interface supports six endpoints: Endpoint 0 (control-only, 64 bytes), Endpoints 1–5 (configurable for bulk/interrupt/isochronous transfers). Endpoint 1 has a 256-byte buffer; Endpoints 0 and 2–5 have 64-byte buffers. All endpoints except EP0 support double buffering. USB host mode supports Full-Speed/Low-Speed devices with automatic connect/disconnect detection and 256-byte packet length.

Is S6E2D35G0AGV20000 qualified for automotive applications, and what safety features does it include?

S6E2D35G0AGV20000 is part of Infineon's AEC-Q100-qualified FM4 family. It includes hardware-level safety features: Memory Protection Unit (MPU), dual watchdog timers (hardware + software), Clock Supervisor (CSV) for external oscillator failure detection, Low-Voltage Detectors (LVD1/LVD2), and CRC32/CCITT accelerators for data integrity. These align with ASIL-B readiness per ISO 26262 functional safety requirements.