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Infineon Technologies S6E2D55G0AGB3000A
- Part No.:
- S6E2D55G0AGB3000A
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 161-TBGA
- Datasheet:
-
S6E2D55G0AGB3000A.pdf
- Description:
- IC MCU 32BIT 384KB FLASH 161FBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
S6E2D55G0AGB3000A from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M4F microcontroller with 384 KB on-chip Flash, 36 KB SRAM (32 KB + 4 KB), and integrated graphics display controller (GDC). It operates up to 160 MHz, includes hardware FPU, MPU, and supports CAN-FD (5 Mbps), USB 2.0 Full-Speed device/host, and 24-channel 12-bit ADC. It targets embedded HMI, motor control, and industrial automation systems requiring real-time graphics and deterministic communication.
For engineers reviewing the S6E2D55G0AGB3000A datasheet, S6E2D55G0AGB3000A pinout, S6E2D55G0AGB3000A application, or S6E2D55G0AGB3000A equivalent, key selection criteria include its non-ISO CAN-FD interface, dual USB mode (device/host), GDC-accelerated 2D blit, 160 MHz Cortex-M4F core with FPU, and 120-pin LQFP package with 98 GPIOs including 5V-tolerant pins.
Technical Context
The S6E2D55G0AGB3000A implements a full Arm v7-M architecture with Cortex-M4F core (r0p1), including DSP extensions, single-precision FPU, and Memory Protection Unit (MPU). Its interrupt subsystem features NVIC with 128 peripheral interrupts across 16 priority levels and a 24-bit SysTick timer for RTOS scheduling.
Peripheral integration centers on deterministic real-time I/O: one non-ISO CAN-FD channel (192 Rx/32 Tx message buffers), dual-mode USB 2.0 (FS/Low-Speed host + FS device), eight configurable serial interfaces (UART/CSIO/LIN/I²C), and a dedicated Graphics Display Controller with up to 512 KB VRAM and 2 MB VFLASH for external display memory management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core | Arm Cortex-M4F @ up to 160 MHz with hardware FPU and DSP instruction set - enables floating-point math and signal processing in real-time control loops. |
| Memory | 384 KB Flash (with accelerator & code protection), 32 KB + 4 KB SRAM, 512 KB VRAM, 2 MB VFLASH - supports secure boot, multi-buffered graphics rendering, and large firmware images. |
| CAN Interface | 1 × non-ISO CAN-FD channel, 5 Mbps max bit rate, 192 Rx / 32 Tx message buffers - delivers high-throughput fieldbus communication for motor drives and industrial nodes. |
| USB Interface | Dual-role USB 2.0: Full-Speed device (6 endpoints, 256-byte EP1) and host (256-byte packet, auto-connect detection) - enables direct peripheral attachment and embedded USB device emulation. |
| Analog | 2 × 12-bit SAR ADCs, 1.0 μs conversion @ 3.3 V, 24 channels, FIFO-based scanning - supports simultaneous sampling of multiple sensors in closed-loop motor or power systems. |
| Package | 120-pin LQFP (14 mm × 14 mm, 0.4 mm pitch), 98 GPIOs, 5V-tolerant pins on selected I/O - provides mechanical robustness and mixed-voltage interfacing in industrial PCB layouts. |
| Power | VCC = 3.0–3.6 V (USB/GDC active), VBAT = 1.65–3.6 V, six low-power modes including Deep Standby RTC - enables battery-backed timekeeping and ultra-low-quiescent operation in edge devices. |
Pinout & Package
Package: 120-pin LQFP (14 mm × 14 mm, 0.4 mm pitch), RoHS-compliant, moisture sensitivity level (MSL) 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P00–P07, P10–P17, P20–P27, P30–P37, P40–P47, P50–P57, P60–P67, P70–P77, P80–P87, P90–P97, PA0–PA7, PB0–PB7, PC0–PC7, PD0–PD7, PE0–PE7, PF0–PF7, PG0–PG7, PH0–PH7, PJ0–PJ7, PK0–PK7 | General-purpose I/O with port relocate function | 98 total GPIOs; each pin supports configurable pull-up, direct read, and peripheral function remapping - simplifies board layout and enables flexible peripheral routing. |
| CLKIN / CLKOUT | Main system clock input/output | Accepts 4–20 MHz crystal or external clock; drives internal PLL for 160 MHz core - defines system timing base and enables precise frequency synthesis. |
| XTAL32K / EXTAL32K | 32.768 kHz RTC oscillator terminals | Connects to 32 kHz crystal for calendar/timekeeping and wake-up from Stop/Deep Standby modes - ensures accurate real-time operation during ultra-low-power states. |
| USB_DP / USB_DM | USB 2.0 differential data pair | Full-Speed (12 Mbps) signaling for device/host mode; integrated transceivers eliminate external PHY - reduces BOM count and PCB area for USB-enabled HMI. |
| CAN_H / CAN_L | CAN-FD physical layer interface | Direct connection to ISO 11898-2 compliant transceiver; supports non-ISO CAN-FD frame format at up to 5 Mbps - enables high-speed deterministic bus communication without protocol translation. |
Key Features
| Feature | Design Value |
|---|---|
| Graphics Display Controller (GDC) | Hardware-accelerated 2D block transfer (blit), embedded VRAM up to 512 KB, and VFLASH support for external display memory - offloads CPU from pixel manipulation and enables responsive GUI rendering. |
| Dual-Mode USB | Integrated USB 2.0 device and host controllers sharing one PHY - allows the MCU to act as either a USB peripheral (e.g., HID device) or a host (e.g., for flash drives or UART adapters) without external ICs. |
| Non-ISO CAN-FD | Native 5 Mbps CAN-FD interface with 192-message Rx buffer and flexible data-rate arbitration - delivers higher bandwidth than classical CAN for firmware updates and sensor fusion in motion control. |
| Real-Time Clock with Calendar | Full BCD-encoded Year/Month/Day/Hour/Minute/Second/Weekday counter with leap-year correction and alarm interrupt - enables timestamping, scheduled wake-up, and battery-backed logging without external RTC IC. |
| Low-Power Modes | Six distinct modes (Sleep, Timer, RTC, Stop, Deep Standby RTC, Deep Standby Stop), all retaining register state except Deep Standby Stop - extends battery life in portable HMIs while preserving context across wake events. |
Applications
| Industrial HMI Panel | Motor Drive Control Unit |
|---|---|
|
Use Scenario: Touchscreen-based operator interface for PLC-connected machinery with local graphics rendering and real-time status visualization. IC Role / Device Role / Timing Role: Primary application processor executing GUI framework, managing touch input via GPIO/ADC, driving LCD via GDC, and communicating over CAN-FD to drive inverters. Use Value: Integrated GDC eliminates external GPU, 160 MHz M4F+FPU handles multitasking and floating-point calculations, and CAN-FD ensures synchronized command delivery at 5 Mbps. |
Use Scenario: Compact servo drive controller performing field-oriented control (FOC), current sensing, position feedback decoding, and safety monitoring. IC Role / Device Role / Timing Role: Real-time control MCU running FOC algorithm, sampling three-phase currents via 24-channel ADC, reading QPRC encoder signals, and issuing PWM via Base Timers with dead-time insertion. Use Value: 1.0 μs ADC conversion enables >100 kHz current loop sampling; QPRC with 16-bit position/revolution counters supports high-resolution rotor tracking; dual watchdogs ensure fail-safe shutdown. |
| Automotive Body Control Module | Smart Energy Gateway |
|
Use Scenario: Centralized vehicle body controller managing door locks, lighting, window lifts, and LIN-connected sensors across multiple zones. IC Role / Device Role / Timing Role: System-on-chip managing LIN master/slave communication on up to eight serial channels, controlling relays via GPIO, monitoring supply voltage with LVD, and logging faults to Flash. Use Value: Eight multi-function serial interfaces allow concurrent LIN, UART, and I²C buses; 2-stage LVD (interrupt + reset) prevents erratic behavior during brown-out; unique 41-bit ID enables secure firmware binding. |
Use Scenario: DIN-rail mounted gateway aggregating Modbus RTU, CAN, and USB-connected smart meters, then forwarding data via Ethernet or cellular to cloud platforms. IC Role / Device Role / Timing Role: Protocol translation hub with USB host (for meter configuration), CAN-FD (for substation comms), UART (Modbus RTU), and CRC accelerators verifying data integrity end-to-end. Use Value: Dual CRC engines (CCITT CRC16 + IEEE CRC32) accelerate checksum generation for both legacy and modern protocols; external bus interface supports NAND/SRAM for local data buffering and OTA update storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S6E2D55G0AGB2000A | Same die, identical peripherals and memory map, but rated for -40°C to +85°C ambient (vs. -40°C to +105°C for S6E2D55G0AGB3000A) | Limited to commercial/industrial environments without extended thermal stress; unsuitable for under-hood automotive or high-temp factory floor deployments | Select when operating temperature range ≤ +85°C and cost optimization is prioritized over thermal margin. |
| S6E2D55G0AGB4000A | Same package and feature set, but includes additional security features: Secure Boot ROM, cryptographic acceleration (AES-128/256, SHA-256), and tamper detection | Required for applications needing certified firmware authenticity, encrypted OTA updates, or compliance with IEC 62443 or UL 2900 | Select when hardware-rooted trust, secure firmware lifecycle, or regulatory cybersecurity certification is mandatory. |
Compared with S6E2D55G0AGB2000A and S6E2D55G0AGB4000A, the S6E2D55G0AGB3000A offers the widest industrial temperature range without added security overhead - making it optimal for thermally demanding but non-security-critical real-time control applications like motor drives and HMIs.
Availability
S6E2D55G0AGB3000A is available at Aetrix Electronics and suitable for industrial HMI panels, motor drive control units, automotive body control modules, and smart energy gateways requiring stable component supply across long production lifecycles.
Supply support for S6E2D55G0AGB3000A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, automotive MCUs, and security solutions with vertical integration from silicon to system-level software.
The S6E2D5 series belongs to Infineon's FM4 family of high-performance 32-bit microcontrollers, designed specifically for deterministic real-time control, graphics-rich human-machine interfaces, and industrial connectivity where ARM Cortex-M4F performance, CAN-FD, USB dual-role, and GDC acceleration are essential.
FAQ
What is the maximum operating temperature rating for S6E2D55G0AGB3000A?
The S6E2D55G0AGB3000A is qualified for operation from –40 °C to +105 °C ambient temperature. This extended industrial temperature grade is verified per AEC-Q100 stress test standards and enables deployment in high-heat environments such as motor drive enclosures, under-dash automotive modules, and factory-floor control cabinets without derating.
Does S6E2D55G0AGB3000A support ISO CAN-FD or only non-ISO CAN-FD?
The S6E2D55G0AGB3000A implements non-ISO CAN-FD (also known as Bosch CAN-FD), which uses a different frame format than ISO CAN-FD (ISO 11898-1:2015). It is not interoperable with ISO CAN-FD nodes. The device supports up to 5 Mbps bit rate and includes 192 receive message buffers optimized for industrial motion control networks.
Can the GDC unit drive an RGB888 display directly without external memory?
No. The GDC requires external memory for pixel data storage. While the device integrates up to 512 KB of VRAM and 2 MB of VFLASH, these are internal SRAM/Flash resources reserved for GDC descriptor tables and command buffers-not frame buffers. An external SDRAM or HyperBus memory must be connected via the HBI or SDRAM interface to store display frame data.
Is the 41-bit Unique ID accessible via standard debug interface or only through firmware?
The 41-bit Unique ID is readable only by firmware executing on the device - accessed via the UID register (address 0x400FE000) after unlocking the system control block. It is not exposed through SWD/JTAG debug ports or boundary-scan; this design prevents cloning and supports secure provisioning in production programming workflows.
S6E2D55G0AGB3000A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 161-TBGA
- Series:
- FM4 S6E2D5
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 160MHz
- Connectivity:
- CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 98
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 36K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E2D55G0AGB3000A FAQ
1.How can I place an order for S6E2D55G0AGB3000A through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E2D55G0AGB3000A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E2D55G0AGB3000A reliable?
The price and inventory of S6E2D55G0AGB3000A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E2D55G0AGB3000A is usually 5 days.
3.What payment methods are accepted for S6E2D55G0AGB3000A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E2D55G0AGB3000A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E2D55G0AGB3000A?
S6E2D55G0AGB3000A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E2D55G0AGB3000A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E2D55G0AGB3000A?
For technical support, including S6E2D55G0AGB3000A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2D55G0AGB3000A requirements.
6.How does Aetrix verify that S6E2D55G0AGB3000A is sourced from the original manufacturer or authorized distributors?
All S6E2D55G0AGB3000A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2D55G0AGB3000A meets industry standards.
7.What is the process for return or replacement of S6E2D55G0AGB3000A?
All S6E2D55G0AGB3000A units undergo pre-shipment inspection (PSI). If there is an issue with S6E2D55G0AGB3000A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E2D55G0AGB3000A part is unused and in its original packaging.
Return procedure for S6E2D55G0AGB3000A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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