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Infineon Technologies S6E2D55J0AGV2000A

Part No.:
S6E2D55J0AGV2000A
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
176-LQFP
Datasheet:
AetrixS6E2D55J0AGV2000A.pdf
Description:
IC MCU 32BIT 384KB FLASH 176LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,523

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Product details

Overview

S6E2D55J0AGV2000A from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M4F microcontroller with 384 KB on-chip Flash, 36 KB SRAM (32 KB SRAM0 + 4 KB SRAM2), and integrated graphics display controller (GDC). It operates up to 160 MHz, includes hardware FPU, MPU, and supports CAN-FD (5 Mbps), USB 2.0 Full-Speed device/host, and dual I²S interfaces. It targets embedded HMI and motor control applications requiring real-time graphics rendering and multi-protocol connectivity.

For engineers reviewing the S6E2D55J0AGV2000A datasheet, S6E2D55J0AGV2000A pinout, S6E2D55J0AGV2000A application, or S6E2D55J0AGV2000A equivalent, key selection considerations include its non-ISO CAN-FD interface, GDC-accelerated 2D blit capability, 160 MHz deterministic timing, dual I²S TX/RX with 66-word FIFOs, and VBAT-supported RTC with 32-byte backup registers.

Technical Context

The S6E2D55J0AGV2000A implements a full Arm Cortex-M4F core (r0p1 revision) with hardware floating-point unit and Memory Protection Unit, enabling deterministic real-time execution in safety-aware industrial firmware. Its clock system integrates five sources-including 4–20 MHz main oscillator, 32.768 kHz sub-clock, and Main PLL-with Clock Supervisor (CSV) for external oscillator failure detection and LVD2-triggered auto-reset.

Peripheral integration centers on parallel real-time subsystems: a dedicated Graphics Display Controller with up to 512 KB VRAM and HBI/Quad SPI/SDRAM interfaces; a non-ISO CAN-FD controller with 192 Rx/32 Tx message buffers; and a DSTC (Descriptor System Transfer Controller) with 128 channels for CPU-offloaded data movement-critical for high-throughput sensor fusion or display refresh without CPU intervention.

Key Specifications

Parameter Value and Actual Design Meaning
Core Arm Cortex-M4F @ up to 160 MHz with hardware FPU and MPU - enables DSP-intensive motor control and floating-point graphics math without software emulation.
Memory 384 KB Flash (with accelerator & trace buffer), 32 KB SRAM0 + 4 KB SRAM2, up to 512 KB VRAM - supports boot-from-Flash RTOS execution, dual-bank SRAM for critical data isolation, and frame-buffer storage for GUI rendering.
CAN Interface 1× non-ISO CAN-FD channel, 5 Mbps max, 192 Rx / 32 Tx message buffers - delivers high-bandwidth fieldbus communication for automotive body control or industrial motion systems with extended data length.
USB Interface 1× USB 2.0 Full-Speed device/host with 6 endpoints (EP0–EP5), EP1 double-buffered at 256 bytes - enables HID-class peripheral operation or host-side flash programming via standard USB cables.
GDC Unit Integrated Graphics Display Controller with 2D blit acceleration, HBI/Quad SPI/SDRAM support - offloads pixel transfer and layer composition from CPU, reducing MCU load in touch-enabled HMIs.
I²S Interface 2× TX + 2× RX channels, 7–32 bit word length, 66-word × 32-bit FIFO per direction - supports simultaneous stereo audio playback and recording with low-latency DMA-driven streaming.
Power Supply VCC = 3.0–3.6 V (USB/GDC active), VBAT = 1.65–3.6 V - ensures RTC/calendar operation during main power loss while maintaining compatibility with 3.3 V system rails.

Pinout & Package

This device is housed in a 120-pin LQFP package (14 mm × 14 mm, 0.4 mm pitch) with exposed thermal pad. Pin functions are fully defined in Infineon's S6E2D5 Series datasheet (002-03982 Rev. *F), Section 3 "Pin Assignment" and Section 4 "Pin Descriptions".

Pin/Terminal Circuit Role Design Meaning
P00–P97 General-purpose I/O with port relocate Up to 98 configurable GPIOs; each supports pull-up, direct read, and peripheral function remapping - simplifies PCB layout and enables flexible signal routing across variants.
OSC1/OSC2 Main crystal oscillator input/output Accepts 4–20 MHz external crystal - provides primary clock source for 160 MHz core operation and USB timing accuracy.
XTAL32K 32.768 kHz sub-clock crystal input Drives RTC calendar and wake-up timer in deep standby modes - enables timekeeping with <1 µA VBAT current draw.
VBAT Backup power supply Supplies RTC, 32 kHz oscillator, backup registers, and power-on circuit independently - preserves real-time state during main power interruption.
USB_DP/USB_DM USB 2.0 differential data pair Full-Speed (12 Mbps) signaling interface - requires 27 Ω series resistors and ESD protection per USB-IF compliance.
CAN_H/CAN_L CAN-FD bus differential pair Non-ISO CAN-FD physical layer interface - mandates external 120 Ω termination and common-mode choke for EMC robustness.

Key Features

Feature Design Value
Graphics Display Controller (GDC) Hardware-accelerated 2D block transfer (blit) engine with dedicated VRAM interface - reduces CPU load by >70% during GUI screen updates in HMI applications.
DSTC (Descriptor System Transfer Controller) 128-channel descriptor-based DMA engine - enables zero-CPU-overhead data movement between peripherals (e.g., ADC → SRAM → GDC) for deterministic sensor-to-display pipelines.
Non-ISO CAN-FD 5 Mbps data rate with flexible payload length up to 64 bytes - supports high-resolution actuator feedback and firmware updates over existing CAN infrastructure without ISO 11898-1 compliance overhead.
Real-Time Clock with VBAT Calendar counter (YY-MM-DD hh:mm:ss + weekday), alarm interrupt, leap-year correction, and 32-byte backup registers - maintains accurate time and configuration state across power cycles.
Low-Power Modes Six modes including Deep Standby RTC (with/without RAM retention) and Deep Standby Stop - achieves sub-1 µA RTC-only current and <5 µA stop-mode current for battery-powered edge nodes.

Applications

Industrial HMI Panel Automotive Body Control Module

Use Scenario: Touchscreen dashboard with animated gauges, real-time sensor overlays, and multi-language UI.

IC Role / Device Role / Timing Role: Primary application processor executing FreeRTOS, driving LCD via GDC, polling CAN-FD for vehicle signals, and managing USB for diagnostics.

Use Value: Integrated GDC eliminates external GPU, while 160 MHz M4F + FPU renders vector-based UI elements at 60 fps with <5% CPU utilization.

Use Scenario: Central gateway controlling door locks, lighting, HVAC, and window lift via CAN network.

IC Role / Device Role / Timing Role: CAN-FD master node collecting status from distributed ECUs, performing local logic, and relaying commands with <100 µs jitter.

Use Value: Non-ISO CAN-FD at 5 Mbps enables 4× faster firmware updates and richer diagnostic data vs. legacy CAN 2.0B, reducing service time.

Motor Drive Controller Smart Audio Endpoint

Use Scenario: BLDC/PMSM drive with field-oriented control (FOC), current sensing, and thermal monitoring.

IC Role / Device Role / Timing Role: Real-time executor of FOC loop (PWM, ADC sampling, Clarke/Park transforms), using base timers and QPRC for rotor position feedback.

Use Value: Hardware FPU completes FOC math in <1.2 µs; dual 12-bit ADCs sample all three phases simultaneously with 1.0 µs conversion time.

Use Scenario: Voice-controlled speaker with local wake-word detection, audio playback, and USB audio class support.

IC Role / Device Role / Timing Role: Audio stream processor handling I²S input (mic array) and output (DAC), USB audio class device, and FFT-based keyword spotting.

Use Value: Dual I²S interfaces enable concurrent 24-bit/48 kHz mic capture and speaker playback; 66-word FIFOs prevent buffer underrun/overrun at 10 ms intervals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
R7FS7G27H3A01CFB 32-bit RX72M core @ 240 MHz, 2 MB Flash, 1 MB SRAM, integrated EtherCAT slave - no GDC or CAN-FD; adds Ethernet and TSN support. Targets industrial PLCs and motion controllers requiring deterministic Ethernet, not graphics-rich HMIs. Select when EtherCAT or IEEE 1588 time synchronization is required over display acceleration or CAN-FD bandwidth.
RA6M5DFA001FH#AA0 Arm Cortex-M33 @ 200 MHz, 1 MB Flash, 384 KB SRAM, TrustZone, CAN-FD, USB HS - no GDC, no DSTC, no VRAM interface. Suitable for secure IoT gateways and connected sensors where cryptographic isolation matters more than GUI rendering. Choose for PSA Certified designs needing hardware security features, not for applications requiring hardware-accelerated 2D graphics.

Compared with R7FS7G27H3A01CFB and RA6M5DFA001FH#AA0, the S6E2D55J0AGV2000A uniquely balances high-speed real-time control (160 MHz M4F+FPU), non-ISO CAN-FD for legacy-compatible high-bandwidth fieldbus, and integrated GDC for cost-sensitive embedded displays - making it optimal for HMI-centric industrial and automotive edge nodes where graphics offload and CAN upgrade coexist.

Availability

S6E2D55J0AGV2000A is available at Aetrix Electronics and suitable for industrial HMI panels, automotive body control modules, motor drive controllers, and smart audio endpoints requiring stable component supply, long-term lifecycle support, and qualified automotive-grade sourcing.

Supply support for S6E2D55J0AGV2000A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and microcontrollers, with global R&D and manufacturing infrastructure.

The S6E2D5 Series belongs to Infineon's FM4 family of 32-bit Arm-based MCUs, designed specifically for high-performance embedded applications demanding real-time graphics, motor control, and multi-protocol connectivity in industrial and automotive environments.

FAQ

What is the maximum operating frequency and voltage range for S6E2D55J0AGV2000A?

The S6E2D55J0AGV2000A operates at up to 160 MHz with a core supply voltage (VCC) of 3.0–3.6 V when USB or GDC functionality is active. Its VBAT supply supports 1.65–3.6 V for RTC and backup register retention. The device requires a 4–20 MHz external crystal for main clock generation and uses internal CR oscillators for low-power modes.

Does S6E2D55J0AGV2000A support ISO CAN-FD or only non-ISO CAN-FD?

S6E2D55J0AGV2000A implements non-ISO CAN-FD, compliant with the original Bosch CAN FD specification (not ISO 11898-1:2015). It supports 5 Mbps data rates and extended payloads but cannot interoperate with ISO CAN-FD nodes due to differences in CRC calculation and bit stuffing rules. Infineon documentation explicitly states this distinction and references CiA white papers on the incompatibility.

How is graphics acceleration implemented, and what memory does the GDC use?

The GDC is a dedicated hardware block supporting 2D block image transfers (blit), alpha blending, and color space conversion. It accesses up to 512 KB of dedicated VRAM (separate from main SRAM), and supports external memory expansion via HBI, Quad SPI, or SDRAM interfaces. VRAM is physically distinct and managed by GDC-specific address mapping, enabling concurrent CPU and GDC access without arbitration stalls.

What debug and trace capabilities does S6E2D55J0AGV2000A provide?

The device includes Serial Wire Debug Port (SWJ-DP) for JTAG/SWD debugging and Embedded Trace Macrocell (ETM) for instruction-level trace. ETM supports real-time instruction trace with timestamping and branch profiling, enabling cycle-accurate analysis of interrupt latency and RTOS task scheduling. No external trace port is required - trace data is streamed via SWO pin or captured in on-chip buffers.

S6E2D55J0AGV2000A Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
176-LQFP
Series:
FM4 S6E2D5
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
154
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
36K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6E2D55J0AGV2000A FAQ

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The price and inventory of S6E2D55J0AGV2000A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E2D55J0AGV2000A is usually 5 days.

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5.How can I obtain technical support or documentation for S6E2D55J0AGV2000A?

For technical support, including S6E2D55J0AGV2000A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2D55J0AGV2000A requirements.

6.How does Aetrix verify that S6E2D55J0AGV2000A is sourced from the original manufacturer or authorized distributors?

All S6E2D55J0AGV2000A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2D55J0AGV2000A meets industry standards.

7.What is the process for return or replacement of S6E2D55J0AGV2000A?

All S6E2D55J0AGV2000A units undergo pre-shipment inspection (PSI). If there is an issue with S6E2D55J0AGV2000A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6E2D55J0AGV2000A part is unused and in its original packaging.

Return procedure for S6E2D55J0AGV2000A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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