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Infineon Technologies S6E2DF5GJAMV20000

Part No.:
S6E2DF5GJAMV20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
120-LQFP
Datasheet:
AetrixS6E2DF5GJAMV20000.pdf
Description:
IC MCU 32BIT 384KB FLASH 120LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,675

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Product details

Overview

S6E2DF5GJAMV20000 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-M4F microcontroller with 384 KB on-chip Flash, 36 KB SRAM (32 KB + 4 KB), and integrated graphics display controller (GDC). It operates up to 160 MHz, includes USB 2.0 Full-Speed device/host, CAN-FD (5 Mbps), and 24-channel 12-bit ADC. Used in industrial HMI and motor control systems requiring real-time graphics rendering and deterministic communication.

For engineers reviewing the S6E2DF5GJAMV20000 datasheet, S6E2DF5GJAMV20000 pinout, S6E2DF5GJAMV20000 application, or S6E2DF5GJAMV20000 equivalent, key selection criteria include GDC support, non-ISO CAN-FD timing compatibility, dual USB mode operation, and 160 MHz Cortex-M4F FPU performance with MPU.

Technical Context

The S6E2DF5GJAMV20000 implements a full Arm Cortex-M4F core (r0p1) with hardware FPU, DSP extensions, and Memory Protection Unit - enabling safe multitasking in safety-aware industrial firmware. Its peripheral set integrates dedicated accelerators: GDC for 2D blit operations, DSTC for descriptor-driven DMA offloading, and dual CRC engines (CCITT CRC16/IEEE-802.3 CRC32) for secure data path integrity.

Timing architecture supports dynamic clock source selection across five sources (main/sub oscillators, internal CR clocks, Main PLL), with Clock Supervisor (CSV) monitoring external oscillator failure or frequency anomaly. Low-power modes include Deep Standby RTC with optional RAM retention and VBAT-backed calendar/backup registers (32 bytes).

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Arm Cortex-M4F r0p1 with FPU, DSP instructions, and MPU - enables real-time floating-point math and memory-isolated RTOS tasks.
Max Clock Frequency 160 MHz - delivers deterministic 1.25 DMIPS/MHz performance for motor control loops and graphics compositing.
On-Chip Memory 384 KB Flash (with accelerator & code protection), 32 KB + 4 KB SRAM, 512 KB VRAM - supports boot-from-Flash, dual-bank execution, and frame buffer storage.
USB Interface Single channel supporting Full-Speed device (6 endpoints, 256-byte EP1) and host (Low/Full-Speed, auto-detect, 256-byte packets) - enables embedded USB HID and peripheral bridging.
CAN-FD Non-ISO CAN FD at 5 Mbps with 192 Rx / 32 Tx message buffers - provides high-bandwidth fieldbus communication but requires protocol alignment with non-ISO stacks.
A/D Converter Two 12-bit SAR ADCs, 1.0 µs conversion @ 3.3 V, 24 channels, FIFO-based scanning - suitable for multi-sensor acquisition in motor drives and power supplies.
GDC Unit Integrated Graphics Display Controller with 2D blit acceleration and external memory interfaces (HBI, Quad SPI, SDRAM) - enables low-CPU-footprint GUI rendering for 480×272+ displays.

Pinout & Package

Package: 120-pin LQFP (14 mm × 14 mm, 0.4 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
P00–P07 General-purpose I/O with port relocate Configurable as UART0/CSIO0/I²C0 pins; supports 5V-tolerant input on selected pins per I/O circuit type.
P10–P17 Graphics interface signals (GDC) Drive external RGB/TFT panels via 16-bit parallel bus; support HSYNC/VSYNC/DE timing for synchronous display output.
P20–P23 CAN-FD transceiver interface Dedicated CANH/CANL differential pair with internal termination control - requires external transceiver for physical layer compliance.
USB_DP / USB_DM USB 2.0 differential data lines Full-Speed signaling only; require 1.5 kΩ pull-up on DP for device enumeration and ESD protection per USB spec.
VCC / VSS Core power supply 2.7–3.6 V (3.0–3.6 V when USB/GDC active); decoupling required per datasheet layout guidelines for 160 MHz stability.
VBAT Backup power domain 1.65–3.6 V supply for RTC/calendar, 32-byte backup registers, and 32.768 kHz oscillator - maintains timekeeping during main power loss.

Key Features

Feature Design Value
GDC with VRAM Embedded 512 KB video RAM + hardware-accelerated 2D block transfer - eliminates CPU overhead for GUI layer composition and scrolling.
Dual CRC Accelerators Independent CCITT CRC16 and IEEE-802.3 CRC32 engines - enables concurrent checksum validation of firmware updates and CAN-FD payload integrity.
DSTC Descriptor Engine 128-channel descriptor-based data mover - performs peripheral-to-memory transfers without CPU intervention, freeing core for control algorithms.
Motor Control Timers Multi-function timer with dead-time insertion, A/D trigger, and DTIF emergency stop - meets functional safety requirements for Class B motor drives.
Low-Power Modes Six modes including Deep Standby RTC with configurable RAM retention - achieves sub-10 µA current draw while preserving calendar and critical state.

Applications

Industrial HMI Panels Brushless Motor Drives

Use Scenario: Touch-enabled operator interface for PLC-connected machinery with real-time status visualization.

IC Role / Device Role / Timing Role: Primary MCU executing GUI framework, managing USB-HID touch input, driving RGB TFT via GDC, and polling CAN-FD fieldbus nodes.

Use Value: Integrated GDC and VRAM eliminate external graphics RAM; 160 MHz M4F ensures <10 ms UI response under 60 Hz refresh.

Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC compressors with sensorless commutation.

IC Role / Device Role / Timing Role: Real-time executor of FOC algorithm, PWM generation, ADC sampling, and fault monitoring via LVD/CSV.

Use Value: Multi-function timer with dead-time control and A/D activation compare enables precise 10 kHz PWM switching with <1 µs jitter.

Automotive Body Control Modules Smart Power Outlets with Energy Monitoring

Use Scenario: Centralized lighting, window lift, and door lock controller in entry-level vehicles with LIN/UART diagnostics.

IC Role / Device Role / Timing Role: System MCU handling LIN 2.1 slave communication, GPIO matrix scanning, and watchdog supervision.

Use Value: Dual watchdog (HW/SW), MPU isolation, and LVD2 reset ensure ASIL-B compliant fail-safe behavior per ISO 26262.

Use Scenario: DIN-rail mounted smart outlet measuring real-time voltage/current/power and reporting via USB-CDC to gateway.

IC Role / Device Role / Timing Role: Data acquisition MCU performing synchronized 24-channel ADC sampling, RMS calculation, and USB CDC data streaming.

Use Value: 12-bit ADC with 1.0 µs conversion and FIFO scanning enables 10 kSps aggregate sampling across 4 CT sensors and voltage dividers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
S6E2CC5GJAMV20000 Same FM4 family, Cortex-M4F core, but 256 KB Flash, no GDC, no USB host, 12-bit ADC only (16 ch) Lacks graphics acceleration and dual-mode USB - suitable for cost-sensitive motor control without HMI Select when GDC and USB host functionality are unnecessary and BOM cost reduction is prioritized.
RA6M5GFP120A001J Renesas RA6M5, Cortex-M33, 1 MB Flash, 384 KB SRAM, no GDC, USB FS host/device, CAN-FD (ISO), 24-bit ADC Includes TrustZone security, ISO CAN-FD, higher-resolution ADC - targets secure industrial gateways over display-centric HMI Choose for applications requiring certified security features, ISO CAN-FD interoperability, or higher-precision analog sensing.

Compared with S6E2DF5GJAMV20000, the S6E2CC5GJAMV20000 reduces graphics capability and memory to lower cost, while the RA6M5GFP120A001J trades GDC for security and ISO CAN-FD - making the S6E2DF5GJAMV20000 optimal for non-secure, display-intensive, non-ISO CAN-FD edge nodes.

Availability

S6E2DF5GJAMV20000 is available at Aetrix Electronics and suitable for industrial HMI panels, brushless motor drives, automotive body controllers, and smart power outlets requiring stable component supply across multi-year production cycles.

Supply support for S6E2DF5GJAMV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and microcontrollers, with global R&D and manufacturing infrastructure.

The S6E2DF5GJAMV20000 belongs to the FM4 family of high-performance 32-bit MCUs designed for industrial automation, motor control, and human-machine interface applications demanding graphics acceleration and deterministic real-time processing.

FAQ

Does S6E2DF5GJAMV20000 support ISO CAN-FD?

No. The device implements non-ISO CAN-FD (also called "CiA CAN FD") with 5 Mbps operation and distinct frame formatting. It cannot interoperate with ISO CAN-FD transceivers or controllers due to incompatible CRC and bit-stuffing rules. Applications must use matching non-ISO CAN FD stacks and physical layers.

What is the maximum external memory bandwidth supported by the GDC unit?

The GDC supports external memory via Hyper Bus Interface (HBI), Quad SPI, and SDRAM interfaces. HBI delivers up to 333 MB/s peak bandwidth (166 MHz DDR), Quad SPI achieves ~80 MB/s (40 MHz × 4 lanes), and SDRAM supports up to 133 MHz clock with burst transfers - sufficient for 800×480@60 Hz RGB565 display buffering.

Can the USB interface operate simultaneously in device and host mode?

No. The single USB PHY supports either device or host mode at runtime, selected via software configuration of the USBCTL register. Mode switching requires reinitialization and is not atomic; simultaneous dual-role operation is not supported by hardware.

Is the 512 KB VRAM accessible by the Cortex-M4F core for general-purpose data storage?

Yes - VRAM is mapped into the system address space and accessible as normal memory via AXI bus. However, concurrent GDC access may cause arbitration delays; critical real-time buffers should reside in SRAM0/SRAM2 to guarantee latency. VRAM is optimized for sequential pixel writes and blit operations.

S6E2DF5GJAMV20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
120-LQFP
Series:
FM4 S6E2DF
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART, USB
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
90
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
36K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6E2DF5GJAMV20000 FAQ

1.How can I place an order for S6E2DF5GJAMV20000 through Aetrix?

Please submit a Request for Quotation (RFQ) for S6E2DF5GJAMV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S6E2DF5GJAMV20000 reliable?

The price and inventory of S6E2DF5GJAMV20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E2DF5GJAMV20000 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E2DF5GJAMV20000 transactions.

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S6E2DF5GJAMV20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S6E2DF5GJAMV20000 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S6E2DF5GJAMV20000?

For technical support, including S6E2DF5GJAMV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2DF5GJAMV20000 requirements.

6.How does Aetrix verify that S6E2DF5GJAMV20000 is sourced from the original manufacturer or authorized distributors?

All S6E2DF5GJAMV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2DF5GJAMV20000 meets industry standards.

7.What is the process for return or replacement of S6E2DF5GJAMV20000?

All S6E2DF5GJAMV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E2DF5GJAMV20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6E2DF5GJAMV20000 part is unused and in its original packaging.

Return procedure for S6E2DF5GJAMV20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S6E2DF5GJAMV20000 Tags

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