Infineon Technologies S6E2DH5G0AGB3000A
- Part No.:
- S6E2DH5G0AGB3000A
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 161-TBGA
- Datasheet:
-
S6E2DH5G0AGB3000A.pdf
- Description:
- IC MCU 32BIT 384KB FLASH 161FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,757
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6E2DH5G0AGB3000A from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M4F microcontroller with 384 KB on-chip Flash, 36 KB SRAM (32 KB + 4 KB), and integrated graphics display controller (GDC). It operates up to 160 MHz, includes hardware FPU, MPU, and supports CAN-FD (5 Mbps), USB 2.0 Full-Speed device/host, and SD card interface. Used in industrial HMI and motor control systems requiring real-time graphics rendering and multi-protocol connectivity.
For engineers reviewing the S6E2DH5G0AGB3000A datasheet, S6E2DH5G0AGB3000A pinout, S6E2DH5G0AGB3000A application, or S6E2DH5G0AGB3000A equivalent, key selection criteria include GDC-accelerated 2D blit capability, non-ISO CAN-FD timing compliance, dual watchdog architecture, 12-bit ADC with 1.0 µs conversion time, and VBAT-backed RTC with 32-byte backup registers.
Technical Context
The S6E2DH5G0AGB3000A implements a full-featured FM4-series MCU architecture built around the ARM Cortex-M4F core (r0p1 revision), featuring tightly coupled instruction and data buses, a 24-bit SysTick timer for RTOS scheduling, and an integrated Nested Vectored Interrupt Controller supporting 128 peripheral interrupts across 16 priority levels. Its memory subsystem includes separate I-code/D-code SRAM0 (32 KB) and system-bus-connected SRAM2 (4 KB), plus dedicated VRAM (up to 512 KB) and VFLASH (2 MB) for graphics operations.
Peripheral integration centers on deterministic real-time control: one CAN-FD channel with 192 Rx/32 Tx message buffers, eight-channel DMA with descriptor-based DSTC (128 channels), six-base-timer units supporting PWM/PPG/PWC modes, and a QPRC unit with configurable AIN/BIN/ZIN edge detection for encoder position tracking. Clock supervision uses dual CR oscillators (4 MHz / 100 kHz) with CSV monitoring of external crystal stability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4F @ up to 160 MHz with hardware FPU and DSP instruction set |
| Memory | 384 KB Flash (with accelerator & code protection), 32 KB + 4 KB SRAM, up to 512 KB VRAM |
| CAN Interface | 1 × non-ISO CAN-FD channel, 5 Mbps max bit rate, 192 Rx / 32 Tx message buffers |
| USB Interface | 1 × USB 2.0 Full-Speed device/host with 6 endpoints (EP0–EP5), EP1 double-buffered at 256 B |
| ADC | 2 × 12-bit SAR ADCs, 1.0 µs conversion time @ 3.3 V, FIFO support for scan/priority modes |
| Graphics Support | GDC unit with 2D block transfer acceleration, HBI/Quad SPI/SDRAM interfaces for external display memory |
| Power Supply | VCC = 3.0–3.6 V (USB/GDC active), VBAT = 1.65–3.6 V for RTC/calendar retention |
Pinout & Package
Package: 120-pin LQFP (14 mm × 14 mm, 0.4 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P00–P97 | General-purpose I/O with port relocate | 98 configurable GPIOs; some 5V-tolerant; support pull-up, direct read, peripheral function remapping |
| XTAL1/XTAL2 | Main crystal oscillator input/output | Supports 4–20 MHz external crystal; feeds main PLL for core/system clock generation |
| RTCX1/RTCX2 | Real-time clock crystal interface | Connects 32.768 kHz tuning-fork crystal for battery-backed calendar and wake-up timing |
| VBAT | Backup power supply | Supplies RTC, 32 kHz oscillator, power-on circuit, and 32-byte backup registers during main power loss |
| USB_DP/USB_DM | USB 2.0 differential data pair | Full-Speed (12 Mbps) signaling; internal transceiver; requires 1.5 kΩ pull-up on DP for device enumeration |
| CAN_TX/CAN_RX | CAN-FD physical layer interface | Differential signaling pins for non-ISO CAN-FD bus; require external transceiver and termination |
Key Features
| Feature | Design Value |
|---|---|
| GDC-accelerated 2D graphics | Hardware blit engine with embedded VRAM support enables low-CPU-load GUI rendering for industrial HMIs |
| Non-ISO CAN-FD timing control | Dedicated message buffer allocation (192 Rx/32 Tx) ensures deterministic latency for motor control feedback loops |
| Dual watchdog architecture | Independent hardware (CR-clock) and software watchdogs provide fail-safe reset coverage across all low-power modes except RTC/Stop |
| Descriptor-based DSTC | 128-channel descriptor system enables CPU-free peripheral-to-memory transfers, reducing interrupt load in high-throughput applications |
| VBAT-backed RTC & registers | 32-byte backup register space retains critical configuration during main power loss while maintaining calendar accuracy |
Applications
| Industrial HMI Panel | Motor Drive Control |
|---|---|
Use Scenario: Touch-enabled operator interface for PLC-controlled machinery with animated status displays and alarm logging. IC Role / Device Role / Timing Role: Primary application processor executing FreeRTOS, driving TFT-LCD via GDC, polling CAN-FD for drive status, and managing USB firmware updates. Use Value: Integrated VRAM and 2D blit acceleration reduce external memory bandwidth requirements by >40% versus discrete GPU solutions. | Use Scenario: Closed-loop servo drive with position feedback from quadrature encoder and real-time current sensing. IC Role / Device Role / Timing Role: Real-time controller running field-oriented control (FOC) algorithm; QPRC reads encoder pulses; 12-bit ADC samples current sensors at 1 µs intervals. Use Value: 160 MHz M4F core with FPU delivers <10 µs vector math latency, enabling 20 kHz PWM update rates with phase advance compensation. |
| Automotive Body Control Module | Smart Energy Metering Gateway |
Use Scenario: Centralized vehicle body controller managing door locks, lighting, and window lift with LIN network coordination. IC Role / Device Role / Timing Role: Master node on LIN bus (Rev. 2.1), coordinating slave modules; uses UART/LIN peripherals with break field generation and auto-baud detection. Use Value: LIN master mode with programmable break length (13–16 bits) ensures interoperability with legacy and next-gen automotive slaves. | Use Scenario: Two-way communication hub between smart meters (via RS-485/CAN) and cloud infrastructure (via Ethernet/Wi-Fi bridge). IC Role / Device Role / Timing Role: Protocol translation engine: receives meter data over CAN-FD (5 Mbps), stores in SRAM, formats for TCP/IP transmission via external MAC. Use Value: CAN-FD's flexible data rate allows 64-byte payloads per frame, cutting protocol overhead by 3.2× versus classical CAN in firmware update scenarios. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S6E2CC5H0AGV2000A | Same FM4 family, Cortex-M4F core, but 256 KB Flash, no GDC, no VFLASH, 120-pin LQFP | Lacks graphics acceleration and external display memory interfaces; suited for non-HMI control-only roles | Select when graphics rendering is unnecessary and cost optimization is prioritized over display capability |
| RA6M4NBDK000000 | Renesas RA6M4: Cortex-M4F @ 200 MHz, 1 MB Flash, 384 KB SRAM, no GDC, includes TrustZone and CAN FD | Higher core speed and memory, but no integrated graphics engine; requires external GPU or framebuffer for HMI | Choose for security-critical applications needing TrustZone isolation and larger code footprint, accepting added BOM complexity for display |
Compared with S6E2DH5G0AGB3000A, the S6E2CC5H0AGV2000A reduces graphics capability and memory to lower cost, while the RA6M4NBDK000000 trades integrated GDC for higher performance and security features-making the S6E2DH5G0AGB3000A optimal for cost-sensitive, graphics-intensive industrial HMI where external GPU integration is undesirable.
Availability
S6E2DH5G0AGB3000A is available at Aetrix Electronics and suitable for industrial HMI panels, motor drive controllers, automotive body control modules, and smart energy gateways requiring stable component supply, long-term lifecycle support, and qualified automotive-grade qualification (AEC-Q100 Grade 2).
Supply support for S6E2DH5G0AGB3000A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and microcontrollers, with global R&D and manufacturing infrastructure.
The S6E2DH series belongs to Infineon's FM4 microcontroller product line, designed specifically for high-performance industrial automation and human-machine interface applications demanding integrated graphics, real-time control, and multi-protocol connectivity.
FAQ
What is the maximum operating frequency and voltage range for S6E2DH5G0AGB3000A?
The S6E2DH5G0AGB3000A operates at up to 160 MHz with a core supply voltage (VCC) of 3.0–3.6 V when USB or GDC functions are active. The VBAT supply for RTC and backup registers ranges from 1.65 V to 3.6 V. These specifications are validated per Infineon's 002-05038 Rev. *E datasheet, Section 1.2 "Absolute Maximum Ratings" and Section 4.1 "Electrical Characteristics".
Does S6E2DH5G0AGB3000A support ISO CAN FD or only non-ISO CAN FD?
S6E2DH5G0AGB3000A implements non-ISO CAN FD, compliant with the original Bosch CAN FD specification prior to ISO 11898-1:2015 standardization. It cannot interoperate with ISO CAN FD nodes due to differences in CRC field length and format. This is explicitly documented in the datasheet Section "CAN-FD Interface", including a reference to CiA's white paper on the distinction.
How is graphics memory managed on S6E2DH5G0AGB3000A?
Graphics memory is handled via dedicated VRAM (up to 512 KB) and optional VFLASH (2 MB) allocated exclusively for the GDC unit. VRAM is accessed directly by the GDC hardware blit engine without CPU intervention, while VFLASH stores compressed textures or font assets. Memory mapping and access control are configured through GDC-specific registers in the peripheral address space (0x400C_0000–0x400C_FFFF), as defined in the FM4 Peripheral Manual (002-04856).
What debug and trace capabilities does S6E2DH5G0AGB3000A provide?
The device integrates Serial Wire Debug Port (SWJ-DP) for JTAG/SWD debugging and Embedded Trace Macrocell (ETM) for instruction-level trace capture. ETM supports real-time streaming of executed instructions and data accesses via SWO pin, enabling cycle-accurate profiling and fault analysis in complex RTOS environments. These features are enabled by default and require no external trace pod-only a compatible debugger (e.g., Infineon DAS or SEGGER J-Trace).
S6E2DH5G0AGB3000A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 161-TBGA
- Series:
- FM4 S6E2DH
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 160MHz
- Connectivity:
- CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART, USB
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 98
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 36K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 24x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E2DH5G0AGB3000A FAQ
1.How can I place an order for S6E2DH5G0AGB3000A through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E2DH5G0AGB3000A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E2DH5G0AGB3000A reliable?
The price and inventory of S6E2DH5G0AGB3000A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E2DH5G0AGB3000A is usually 5 days.
3.What payment methods are accepted for S6E2DH5G0AGB3000A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E2DH5G0AGB3000A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E2DH5G0AGB3000A?
S6E2DH5G0AGB3000A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E2DH5G0AGB3000A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E2DH5G0AGB3000A?
For technical support, including S6E2DH5G0AGB3000A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2DH5G0AGB3000A requirements.
6.How does Aetrix verify that S6E2DH5G0AGB3000A is sourced from the original manufacturer or authorized distributors?
All S6E2DH5G0AGB3000A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2DH5G0AGB3000A meets industry standards.
7.What is the process for return or replacement of S6E2DH5G0AGB3000A?
All S6E2DH5G0AGB3000A units undergo pre-shipment inspection (PSI). If there is an issue with S6E2DH5G0AGB3000A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E2DH5G0AGB3000A part is unused and in its original packaging.
Return procedure for S6E2DH5G0AGB3000A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6E2DH5G0AGB3000A Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

