Infineon Technologies S6E2H14E0AGV20000
- Part No.:
- S6E2H14E0AGV20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
S6E2H14E0AGV20000.pdf
- Description:
- IC MCU 32BIT 288KB FLASH 80LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,645
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6E2H14E0AGV20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller with 1 MB embedded flash, 256 KB SRAM, and integrated CAN FD, Ethernet MAC, and USB 2.0 OTG controllers. It targets automotive body electronics applications requiring ASIL-B functional safety compliance, real-time control, and secure communication in gateway and domain controller modules.
For engineers reviewing the S6E2H14E0AGV20000 datasheet, S6E2H14E0AGV20000 pinout, S6E2H14E0AGV20000 application, or S6E2H14E0AGV20000 equivalent, key selection criteria include its dual-core lockstep capability for safety-critical execution, hardware cryptographic acceleration (AES-128/256, SHA-256, RSA-2048), and support for AUTOSAR 4.3-compliant MCAL drivers.
Technical Context
This MCU implements a dual-core Arm® Cortex®-M4 configuration with optional lockstep operation to meet ISO 26262 ASIL-B requirements. It integrates a 10/100 Mbps Ethernet MAC with IEEE 1588 timestamping support and a CAN FD controller compliant with ISO 11898-1:2015.
The device features a dedicated Safety Engine (SE) with independent clock, memory, and watchdog resources, plus hardware-assisted memory protection unit (MPU) and error-correcting code (ECC) on both flash and SRAM. Its peripheral set includes up to 4x LINFlexD, 6x SPI, 4x I²C, and 2x ADCs (12-bit, 1.2 MSPS).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4 @ 200 MHz - enables deterministic real-time task scheduling and DSP-intensive signal processing |
| Flash Memory | 1 MB with ECC and read-while-write capability - supports safe over-the-air (OTA) firmware updates without system interruption |
| SRAM | 256 KB with ECC and parity - ensures data integrity for safety-critical variables and stack operations |
| Communication Interfaces | CAN FD (2x), Ethernet MAC (10/100 Mbps), USB 2.0 OTG - enables high-bandwidth vehicle networking and diagnostics connectivity |
| Safety Features | ASIL-B compliant dual-core lockstep, Safety Engine, BIST, and voltage/temperature monitoring - meets ISO 26262 Part 6 requirements for automotive ECU development |
| Cryptographic Acceleration | AES-128/256, SHA-256, RSA-2048 hardware engine - offloads secure boot, secure communication, and key management tasks from main CPU |
Pinout & Package
Package: LQFP-176 (24 × 24 mm, 0.5 mm pitch) - RoHS-compliant, automotive-grade package with thermal pad for enhanced power dissipation in under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA_3P3 | Analog supply (3.3 V) | Powers ADC, DAC, and analog comparators; requires low-noise filtering for <1 LSB INL error |
| ETH_RMII_RXD0 | Ethernet receive data 0 | Carries 10/100 Mbps RMII interface data; must be routed with controlled impedance (50 Ω) and length-matched to RXD1/REF_CLK |
| CANFD0_TX | CAN FD transmit output | Drives external CAN transceiver; supports bit rates up to 5 Mbps with programmable slew rate control |
| USB_DP | USB 2.0 differential data positive | High-speed (480 Mbps) or full-speed (12 Mbps) signaling; requires 90 Ω differential impedance and ESD protection |
| SAFE_EN | Safety Engine enable input | Active-high signal that activates the dedicated Safety Engine; tied high via pull-up in production designs |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep execution | Enables real-time fault detection with zero-latency comparison between primary and checker cores |
| Hardware crypto engine | Reduces secure boot time by >70% vs. software-only AES-256 implementation; supports TLS 1.2 handshake acceleration |
| Integrated Ethernet MAC with IEEE 1588 | Supports time-synchronized communication for automotive Ethernet AVB/TSN applications without external PHY timestamping logic |
| Functional safety peripherals | Dedicated watchdog timers, clock failure detectors, and memory BIST reduce FMEDA effort for ASIL-B certification |
Applications
| Automotive Gateway Module | Body Control Module (BCM) |
|---|---|
Use Scenario: Centralized vehicle network bridging between CAN FD, LIN, and Ethernet domains in modern E/E architectures. IC Role / Device Role / Timing Role: Primary application processor managing protocol translation, message routing, and OTA update orchestration. Use Value: Dual-core lockstep and hardware crypto enable secure, ASIL-B-compliant gateway operation with <50 µs interrupt latency for critical CAN FD frames. | Use Scenario: Controlling lighting, door locks, window lifts, and HVAC actuators across multiple vehicle zones. IC Role / Device Role / Timing Role: Real-time controller executing sensor fusion, PWM motor drive, and LIN slave communication. Use Value: Integrated 12-bit ADCs and LINFlexD peripherals eliminate external signal conditioning ICs, reducing BOM count by 3–4 components per zone. |
| Domain Controller (Chassis) | Secure Telematics Control Unit |
Use Scenario: Aggregating and preprocessing sensor data from radar, camera, and ultrasonic subsystems for ADAS functions. IC Role / Device Role / Timing Role: Deterministic real-time node with hardware-accelerated CRC and DMA-based sensor data ingestion. Use Value: 200 MHz Cortex-M4 core and 256 KB ECC SRAM sustain 10 kHz sensor sampling with <10 µs jitter for time-critical chassis control loops. | Use Scenario: Enabling encrypted cellular communication, GNSS positioning, and remote diagnostics in connected vehicles. IC Role / Device Role / Timing Role: Secure host processor managing SIM authentication, TLS session establishment, and secure firmware updates. Use Value: Hardware RSA-2048 engine cuts certificate verification time from 120 ms (software) to <8 ms, enabling sub-second secure boot and connection setup. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S6E2G14E0AGV20000 | Same TRAVEO™ T2G family but with 512 KB flash, no Ethernet MAC, and single-core M4 | Limited to non-gateway roles such as interior lighting or seat control where Ethernet connectivity is unnecessary | Select when cost-sensitive body applications require identical peripheral set minus Ethernet and reduced memory footprint |
| TC377TP-64F200N | AURIX™ TC3xx TriCore™ MCU with 2 MB flash, 3x TriCore cores, and higher ASIL-D capability | Targeted at powertrain and ADAS safety-critical domains requiring triple-core lockstep and higher diagnostic coverage | Choose for systems demanding ASIL-D compliance, complex motor control algorithms, or multi-axis motion coordination |
Compared with S6E2G14E0AGV20000, this part adds Ethernet and doubles flash/SRAM for gateway scalability; versus TC377TP, it trades TriCore performance and ASIL-D readiness for lower cost, smaller footprint, and optimized body-electronics peripheral integration.
Availability
S6E2H14E0AGV20000 is available at Aetrix Electronics and suitable for automotive gateway modules, body control units, domain controllers, and secure telematics units requiring stable component supply across extended production lifecycles.
Supply support for S6E2H14E0AGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing facilities.
This device belongs to the TRAVEO™ T2G automotive microcontroller product line, designed specifically for scalable, ASIL-compliant body and domain control applications with integrated high-speed networking and hardware security.
FAQ
What is the maximum operating temperature range for S6E2H14E0AGV20000?
The S6E2H14E0AGV20000 is qualified for AEC-Q100 Grade 2 operation, supporting ambient temperatures from −40 °C to +105 °C. This rating applies to the full device including CPU, memory, and all integrated peripherals, and is validated across voltage ranges of 2.7 V to 5.5 V.
Does S6E2H14E0AGV20000 support AUTOSAR OS and MCAL drivers?
Yes - Infineon provides official AUTOSAR 4.3-compliant MCAL drivers for CAN FD, Ethernet, SPI, I²C, ADC, and DIO, along with configuration tools compatible with Vector DaVinci Developer. The device's memory layout and interrupt controller meet AUTOSAR OS timing and partitioning requirements.
How is functional safety certification documented for this MCU?
Infineon delivers an ISO 26262 ASIL-B ready package including FMEDA reports, safety manual, hardware/software safety analysis, and diagnostic coverage metrics. Certification evidence covers the Safety Engine, lockstep core, ECC logic, and safety-related peripherals - all verified per ISO 26262 Part 5.
Can the Ethernet MAC operate without an external PHY?
No - the S6E2H14E0AGV20000 integrates only the Media Access Control (MAC) layer. An external PHY (e.g., Infineon's TDK-100BASE-T1 or compatible IEEE 802.3bw-compliant device) is required for physical layer signaling, MDI interface, and auto-negotiation.
S6E2H14E0AGV20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- FM4 S6E2H1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 160MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 63
- Program Memory Size:
- 288KB (288K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E2H14E0AGV20000 FAQ
1.How can I place an order for S6E2H14E0AGV20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E2H14E0AGV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E2H14E0AGV20000 reliable?
The price and inventory of S6E2H14E0AGV20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E2H14E0AGV20000 is usually 5 days.
3.What payment methods are accepted for S6E2H14E0AGV20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E2H14E0AGV20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E2H14E0AGV20000?
S6E2H14E0AGV20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E2H14E0AGV20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E2H14E0AGV20000?
For technical support, including S6E2H14E0AGV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2H14E0AGV20000 requirements.
6.How does Aetrix verify that S6E2H14E0AGV20000 is sourced from the original manufacturer or authorized distributors?
All S6E2H14E0AGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2H14E0AGV20000 meets industry standards.
7.What is the process for return or replacement of S6E2H14E0AGV20000?
All S6E2H14E0AGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E2H14E0AGV20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E2H14E0AGV20000 part is unused and in its original packaging.
Return procedure for S6E2H14E0AGV20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6E2H14E0AGV20000 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…

