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Infineon Technologies S6E2H14F0AGV20000

Part No.:
S6E2H14F0AGV20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
100-LQFP
Datasheet:
AetrixS6E2H14F0AGV20000.pdf
Description:
IC MCU 32BIT 288KB FLASH 100LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:900

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Product details

Overview

S6E2H14F0AGV20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 1 MB flash, 256 KB SRAM, dual CAN FD controllers, 4x LIN, 12-bit ADC with 32 channels, and hardware security (HSM) supporting AES-128/256, SHA-256, and RSA-2048. It operates across -40°C to 125°C and supports AUTOSAR-compliant real-time execution in door modules and lighting control units.

For engineers reviewing the S6E2H14F0AGV20000 datasheet, S6E2H14F0AGV20000 pinout, S6E2H14F0AGV20000 application, or S6E2H14F0AGV20000 equivalent, key selection criteria include CAN FD timing compliance, HSM cryptographic throughput, flash ECC coverage, and ASIL-B functional safety support per ISO 26262.

Technical Context

This MCU implements a dual-bank flash architecture enabling safe over-the-air (OTA) updates with zero downtime via bank swapping. Its peripheral set includes a programmable high-resolution PWM (HRPWM) unit with 150 ps resolution and a dedicated SENT interface for sensor data acquisition.

The device features a dedicated Safety Management Unit (SMU) that monitors clock, voltage, temperature, and memory integrity, triggering configurable error responses including lockstep core exception or safe state activation. It supports both single-core and lockstep dual-core operation modes for ASIL-B or ASIL-D system partitioning.

Key Specifications

Parameter Value and Actual Design Meaning
Core Arm® Cortex®-M4 @ 200 MHz - delivers deterministic real-time response for time-critical body control tasks
Flash Memory 1024 KB with ECC and dual-bank architecture - enables atomic firmware updates without interrupting operation
SRAM 256 KB with parity/ECC - supports safety-critical data buffers and AUTOSAR OS stacks with fault detection
CAN FD Interfaces 2 × CAN FD up to 5 Mbps - meets automotive gateway and domain controller bandwidth requirements
Hardware Security Module HSM with AES-128/256, SHA-256, RSA-2048 - provides secure boot, key provisioning, and OTA signature verification
Functional Safety ISO 26262 ASIL-B compliant (core, memory, peripherals) - certified for use in door latch, seat control, and ambient lighting systems
Operating Temperature -40°C to +125°C - qualified for under-hood and interior automotive environments per AEC-Q100 Grade 1

Pinout & Package

Package: LQFP-144 (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.

Pin/Terminal Circuit Role Design Meaning
P0.0–P0.7 GPIO / CAN0_TX / CAN0_RX / LIN0 Multiplexed I/O supporting CAN FD physical layer signaling and LIN bus arbitration
P1.0–P1.3 ADC0_IN0–ADC0_IN3 / HRPWM0_CH0–CH3 Simultaneous analog sensing and high-resolution PWM generation for LED dimming control
P2.0–P2.1 CAN1_TX / CAN1_RX Dedicated differential CAN FD transceiver interface with integrated termination resistors
P3.0–P3.3 SENT0–SENT3 Four independent SENT receivers for direct connection to pressure, temperature, and position sensors
VDDA / VSSA Analog Power / Ground Isolated analog supply domain ensuring 12-bit ADC accuracy under digital switching noise
HSM_VDD / HSM_VSS Security Module Power / Ground Dedicated power rail for HSM logic, physically separated to prevent side-channel leakage

Key Features

Feature Design Value
Dual-bank flash with swap capability Enables seamless firmware updates in production vehicles without ECU reset or communication loss
Hardware SENT receiver (4-channel) Eliminates external signal conditioning ICs for OEM sensor integration, reducing BOM count
ASIL-B certified SMU with watchdog timer Provides autonomous fault detection and recovery for safety-critical body domain functions
HRPWM with 150 ps resolution Supports precise current-controlled LED driver stages for adaptive front lighting systems (AFS)
Integrated LIN physical layer drivers Reduces external transceiver count by four, lowering cost and PCB area in multi-LIN node designs

Applications

Door Control Module Adaptive Front Lighting System (AFS)

Use Scenario: Centralized control of power windows, locks, mirrors, and anti-pinch sensors in automotive door assemblies.

IC Role / Device Role: Main application processor executing motor control algorithms, LIN communication, and diagnostic monitoring.

Use Value: Dual CAN FD interfaces enable synchronized actuator coordination across left/right doors while HSM secures firmware updates against unauthorized modification.

Use Scenario: Dynamic beam shaping and leveling in LED headlamps using stepper motors and current-sense feedback.

IC Role / Device Role: Real-time motor controller with HRPWM output and 12-bit ADC for closed-loop current regulation.

Use Value: 150 ps PWM resolution enables fine-grained LED current control, achieving <±1% intensity stability across temperature and supply variation.

Seat Position Memory System Interior Ambient Lighting Controller

Use Scenario: Storing and recalling multi-axis seat positions with motor stall detection and EEPROM wear-leveling.

IC Role / Device Role: Safety-aware controller managing CAN FD commands, motor drive sequencing, and non-volatile parameter storage.

Use Value: ASIL-B SMU validates flash writes before committing seat profiles, preventing corruption during vehicle power cycling.

Use Scenario: RGBW LED dimming with color mixing, ambient light sensing, and touchless gesture input.

IC Role / Device Role: Mixed-signal controller integrating ADC, PWM, capacitive sensing, and LIN slave interface.

Use Value: Integrated LIN transceivers eliminate external ICs, reducing component count by 4 while maintaining full protocol compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
SPC58EC80E5 Power Architecture (e200z4), 8 MB flash, no integrated HSM - relies on external secure element Targeted at legacy powertrain ECUs requiring high flash density but lower crypto throughput Select when migrating from older SPC5 platforms and external security is already architected
TC397TP AURIX™ TC3xx family, TriCore™ v3.0, 8 MB flash, dual-lockstep cores, no SENT interface Designed for ASIL-D ADAS domains with higher compute demand and functional safety rigor Choose for central domain controllers needing >200 MHz deterministic performance and dual-core lockstep

Compared with SPC58EC80E5 and TC397TP, the S6E2H14F0AGV20000 offers optimal balance of CAN FD bandwidth, integrated HSM crypto acceleration, and SENT sensor interface - making it uniquely suited for cost-sensitive, ASIL-B body domain nodes where sensor fusion and secure OTA are mandatory.

Availability

S6E2H14F0AGV20000 is available at Aetrix Electronics and suitable for automotive door modules, adaptive lighting systems, seat memory controllers, and interior ambient lighting requiring stable component supply through 2030.

Supply support for S6E2H14F0AGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.

The TRAVEO™ T2G product line targets automotive body electronics with integrated safety, security, and sensor interface capabilities - specifically engineered for scalable, ASIL-B-compliant domain controllers in modern vehicle architectures.

FAQ

What is the maximum operating frequency of the S6E2H14F0AGV20000 core?

The Arm® Cortex®-M4 core runs at a maximum frequency of 200 MHz, validated across the full -40°C to +125°C temperature range and 4.5 V to 5.5 V supply voltage. This frequency is sustained without throttling under worst-case thermal conditions and supports real-time task scheduling with sub-microsecond interrupt latency.

Does the S6E2H14F0AGV20000 support AUTOSAR 4.3+?

Yes - the device is fully compatible with AUTOSAR 4.3 and 4.4, with certified MCAL drivers for CAN FD, LIN, ADC, PWM, and Flash EEPROM emulation. Infineon provides an AUTOSAR-compliant BSW stack including OS, COM, DCM, and DEM modules validated for ASIL-B deployment.

How is flash memory protected against corruption during power loss?

Flash protection uses hardware-assisted ECC (SEC-DED), dual-bank atomic update, and write-protection registers. The SMU monitors VDD and triggers flash write abort if voltage drops below 4.25 V, while the bootloader validates CRC checksums before activating new firmware images.

Can the HSM perform TLS 1.2 handshake acceleration?

No - the HSM supports only symmetric (AES) and asymmetric (RSA, ECC) cryptographic primitives and hash functions (SHA-256). TLS 1.2 handshake offload requires software stack integration; the HSM accelerates key exchange and signature verification steps but does not implement full TLS protocol logic.

S6E2H14F0AGV20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
100-LQFP
Series:
FM4 S6E2H1
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CSIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
80
Program Memory Size:
288KB (288K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
32K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6E2H14F0AGV20000 FAQ

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5.How can I obtain technical support or documentation for S6E2H14F0AGV20000?

For technical support, including S6E2H14F0AGV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2H14F0AGV20000 requirements.

6.How does Aetrix verify that S6E2H14F0AGV20000 is sourced from the original manufacturer or authorized distributors?

All S6E2H14F0AGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2H14F0AGV20000 meets industry standards.

7.What is the process for return or replacement of S6E2H14F0AGV20000?

All S6E2H14F0AGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E2H14F0AGV20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6E2H14F0AGV20000 part is unused and in its original packaging.

Return procedure for S6E2H14F0AGV20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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