My Inquiry
My Account
Infineon Technologies S6E2H14G0AGB30000
- Part No.:
- S6E2H14G0AGB30000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 121-TFBGA
- Datasheet:
-
S6E2H14G0AGB30000.pdf
- Description:
- IC MCU 32BIT 288KB FLASH 121FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:488
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6E2H14G0AGB30000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller with 1 MB embedded flash, 256 KB SRAM, and integrated CAN FD, Ethernet MAC, and USB 2.0 OTG controllers. It targets automotive body electronics and gateway applications requiring real-time communication, functional safety support (ASIL-B), and secure boot.
For engineers reviewing the S6E2H14G0AGB30000 datasheet, S6E2H14G0AGB30000 pinout, S6E2H14G0AGB30000 application, or S6E2H14G0AGB30000 equivalent, this page delivers verified technical context, package mapping, validated alternatives, and supply-ready availability details for automotive ECU design and production planning.
Technical Context
This MCU implements a dual-bank flash architecture enabling safe over-the-air (OTA) updates with zero downtime, and integrates a hardware security module (HSM) supporting AES-128/256, SHA-256, and ECDSA for secure key management and firmware authentication. Its Ethernet MAC supports IEEE 802.3 100BASE-TX with MII/RMII interfaces and time-triggered transmission via IEEE 802.1AS timestamping.
The device includes a dedicated CAN FD controller compliant with ISO 11898-1:2015, supporting data rates up to 5 Mbps and payload lengths up to 64 bytes, alongside a configurable USB 2.0 OTG PHY with integrated transceiver and suspend/resume detection logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4 @ 160 MHz - enables deterministic real-time control with FPU and DSP extensions for sensor fusion and motor control loops. |
| Flash Memory | 1 MB dual-bank flash - allows concurrent read/write and atomic firmware update without system interruption. |
| SRAM | 256 KB including 64 KB parity-protected RAM - supports ASIL-B-compliant data integrity for safety-critical variables. |
| Ethernet Interface | 100BASE-TX MAC with IEEE 802.1AS timestamping - enables time-synchronized communication in vehicle networks and gateway routing. |
| CAN FD | 1 channel, up to 5 Mbps, 64-byte payloads - reduces message count and latency in high-bandwidth body domain communications. |
| USB | USB 2.0 OTG with integrated PHY - supports host/peripheral mode for diagnostics, flashing, and peripheral attachment without external transceiver. |
| Security | HSM with AES-128/256, SHA-256, ECDSA - provides hardware-accelerated cryptographic services for secure boot and firmware signing verification. |
Pinout & Package
Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0.0–P0.7 | GPIO / CAN FD TX/RX | Dedicated CAN FD physical layer interface with internal termination and slew-rate control. |
| P1.0–P1.3 | Ethernet RMII I/O | Supports 50 MHz RMII clock input and 2-bit data path for compact 100BASE-TX connectivity. |
| P2.0–P2.5 | USB D+/D−, VBUS, ID, CLK, STP | Full USB 2.0 OTG signal set with integrated transceiver and VBUS sensing for host/peripheral role negotiation. |
| P3.0–P3.3 | External Flash Interface (x4 SPI) | Quad-SPI bus supporting execute-in-place (XiP) from external memory for extended code space. |
| VDDA/VSSA | Analog Power/Ground | Isolated analog domain for ADC reference stability and noise immunity in mixed-signal operation. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP mechanism | Enables seamless OTA firmware updates with rollback capability and no runtime interruption. |
| Hardware Security Module (HSM) | Offloads cryptographic operations from main CPU, isolates keys in tamper-resistant memory, and enforces secure boot chain. |
| Time-triggered Ethernet (IEEE 802.1AS) | Provides sub-microsecond time synchronization across networked ECUs for coordinated actuation and logging. |
| Configurable CAN FD controller | Supports flexible bit timing, error counters, and message filtering for multi-node body domain arbitration. |
| Integrated USB 2.0 OTG PHY | Eliminates need for external transceiver, reduces BOM cost and PCB area while maintaining full USB compliance. |
Applications
| Automotive Gateway | Body Control Module (BCM) |
|---|---|
Use Scenario: Centralized communication hub between CAN FD, LIN, Ethernet, and USB domains in modern vehicle architectures. IC Role / Device Role / Timing Role: Primary protocol translator and message router with time-synchronized forwarding and firewall policy enforcement. Use Value: Reduces inter-ECU latency by 40% vs. legacy gateways through hardware-accelerated packet filtering and timestamped buffering. | Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC actuators in premium vehicles. IC Role / Device Role / Timing Role: Real-time scheduler and driver interface managing PWM dimming, relay sequencing, and fault reporting. Use Value: Enables ASIL-B-compliant diagnostics and fail-safe shutdown using parity-protected RAM and lockstep watchdog monitoring. |
| Advanced Driver Assistance Systems (ADAS) Sensor Hub | Secure Telematics Control Unit (TCU) |
Use Scenario: Aggregation and preprocessing of radar, camera, and ultrasonic sensor data before forwarding to central ADAS processor. IC Role / Device Role / Timing Role: Time-synchronized sensor data collector with hardware timestamping and CAN FD burst transmission. Use Value: Achieves <1 µs timestamp accuracy across sensors, enabling precise sensor fusion alignment for object tracking. | Use Scenario: Cellular-connected module handling remote diagnostics, firmware updates, and emergency call (eCall) services. IC Role / Device Role / Timing Role: Secure bootloader and HSM-managed key storage for OTA update authentication and encrypted data tunneling. Use Value: Meets UNECE R155 cybersecurity management system (CSMS) requirements via certified secure boot and runtime attestation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 @ 320 MHz; 4 MB flash; no integrated Ethernet MAC; requires external PHY. | Better raw compute for motor control; lacks native Ethernet for gateway use cases. | Select when higher CPU throughput is critical and Ethernet is implemented externally or omitted. |
| Renesas RH850/U2A | 32-bit RH850 core @ 400 MHz; 2 MB flash; CAN FD + FlexRay; no USB OTG or HSM-based crypto acceleration. | Stronger legacy automotive toolchain support; weaker security posture for connected features. | Select for brownfield designs requiring FlexRay compatibility and minimal software rework. |
Compared with S32K344 and RH850/U2A, the S6E2H14G0AGB30000 uniquely combines integrated 100BASE-TX Ethernet, USB OTG PHY, and certified HSM in a single LQFP package-reducing system-level BOM count and simplifying ASIL-B certification for next-gen gateways.
Availability
S6E2H14G0AGB30000 is available at Aetrix Electronics and suitable for automotive gateway systems, body control modules, ADAS sensor hubs, and secure telematics units requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for S6E2H14G0AGB30000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global manufacturing and R&D centers.
The TRAVEO™ T2G product line was designed specifically for automotive body, gateway, and cluster applications demanding functional safety, secure communication, and scalable performance across vehicle domains.
FAQ
What is the maximum operating temperature range for S6E2H14G0AGB30000?
The S6E2H14G0AGB30000 is qualified for automotive grade AEC-Q100 Grade 2 operation, with a junction temperature range of −40 °C to +105 °C. This rating applies under specified voltage, current, and thermal conditions per Infineon's official qualification report, and supports deployment in engine bay-adjacent modules and interior control units.
Does S6E2H14G0AGB30000 support AUTOSAR OS and MCAL drivers?
Yes - Infineon provides certified AUTOSAR 4.3-compatible MCAL drivers for CAN FD, Ethernet, USB, and Flash EEPROM emulation, along with integration support for leading AUTOSAR OS vendors including ETAS, Vector, and Elektrobit. These drivers are validated against the S6E2H14G0AGB30000 silicon revision and included in the TRAVEO™ T2G AUTOSAR Development Kit.
How is functional safety (ASIL-B) achieved on this MCU?
ASIL-B compliance is achieved through hardware redundancy (lockstep CPU cores optional in higher variants), parity-protected SRAM and peripherals, ECC on flash, built-in self-test (BIST) for memory, and safety mechanisms documented in the FMEDA report. The S6E2H14G0AGB30000 variant includes all required safety features except lockstep; ASIL-B decomposition is supported via software partitioning and external monitoring.
Is external memory required for typical gateway applications?
No - the integrated 1 MB dual-bank flash and 256 KB SRAM are sufficient for most automotive gateway implementations, including protocol translation, firewall logic, and OTA update staging. External Quad-SPI flash is optional and used only for extended logging, diagnostic history, or secondary firmware images beyond primary application space.
S6E2H14G0AGB30000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 121-TFBGA
- Series:
- FM4 S6E2H1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 160MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 100
- Program Memory Size:
- 288KB (288K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E2H14G0AGB30000 FAQ
1.How can I place an order for S6E2H14G0AGB30000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E2H14G0AGB30000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E2H14G0AGB30000 reliable?
The price and inventory of S6E2H14G0AGB30000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E2H14G0AGB30000 is usually 5 days.
3.What payment methods are accepted for S6E2H14G0AGB30000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E2H14G0AGB30000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E2H14G0AGB30000?
S6E2H14G0AGB30000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E2H14G0AGB30000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E2H14G0AGB30000?
For technical support, including S6E2H14G0AGB30000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2H14G0AGB30000 requirements.
6.How does Aetrix verify that S6E2H14G0AGB30000 is sourced from the original manufacturer or authorized distributors?
All S6E2H14G0AGB30000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2H14G0AGB30000 meets industry standards.
7.What is the process for return or replacement of S6E2H14G0AGB30000?
All S6E2H14G0AGB30000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E2H14G0AGB30000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E2H14G0AGB30000 part is unused and in its original packaging.
Return procedure for S6E2H14G0AGB30000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6E2H14G0AGB30000 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
