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Infineon Technologies S6E2H14G0AGV20000
- Part No.:
- S6E2H14G0AGV20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 120-LQFP
- Datasheet:
-
S6E2H14G0AGV20000.pdf
- Description:
- IC MCU 32BIT 288KB FLASH 120LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,679
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Product details
Overview
S6E2H14G0AGV20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4F automotive microcontroller with 2 MB embedded flash, 512 KB SRAM, and integrated CAN FD, Ethernet AVB, and hardware security (HSM). It operates at up to 200 MHz, supports ASIL-B functional safety, and targets body control modules and domain controllers in modern vehicle architectures.
For engineers reviewing the S6E2H14G0AGV20000 datasheet, S6E2H14G0AGV20000 pinout, S6E2H14G0AGV20000 application, or S6E2H14G0AGV20000 equivalent, key selection criteria include its dual-core lockstep capability, hardware-accelerated crypto engine (AES-128/256, SHA-256, ECC), 12-bit SAR ADC with 32 channels, and support for AUTOSAR 4.3+ and ISO 26262 tool qualification.
Technical Context
This MCU implements a dual-core Arm® Cortex®-M4F configuration with lockstep operation for ASIL-B compliance, coupled with a dedicated Safety Island containing watchdogs, memory protection units (MPU), and fault collection logic. It integrates a 10/100 Mbps Ethernet MAC with AVB timestamping and a triple CAN FD controller supporting data rates up to 5 Mbps.
The device features a 12-bit SAR ADC with simultaneous sampling across 32 channels, programmable gain amplifier (PGA) stages, and hardware-based CRC engines for flash and RAM integrity checking. Its HSM includes secure boot, key provisioning, and runtime attestation using PUF-derived keys.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4F @ 200 MHz with FPU and DSP extensions; enables real-time signal processing and floating-point math for sensor fusion. |
| Flash Memory | 2 MB embedded flash with ECC, 64-bit wide interface, and 0-wait-state access at full speed; supports over-the-air (OTA) updates with dual-bank swap. |
| SRAM | 512 KB on-chip SRAM with parity/ECC, split into multiple banks for concurrent access and safety partitioning. |
| Communication Interfaces | 3× CAN FD, 1× 10/100 Mbps Ethernet AVB MAC, 4× LIN, 4× SPI, 3× I²C, 2× UART; enables centralized vehicle networking with time-synchronized messaging. |
| Analog Peripherals | 12-bit SAR ADC (32 ch, 1.2 MSPS), 2× 12-bit DAC, 4× comparators, 2× PGA; supports high-resolution sensor acquisition without external signal conditioning. |
| Functional Safety | ASIL-B compliant per ISO 26262:2018; includes lockstep CPU, memory BIST, ECC, and safety monitor subsystem with configurable error response. |
| Security | HSM with AES-128/256, SHA-256, ECC NIST P-256/P-384, secure boot, key injection via PUF, and runtime attestation; meets EVITA Full and UNECE R155 requirements. |
Pinout & Package
Package: 144-pin LQFP (20 mm × 20 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VSSA | Analog power supply / ground | Separate 3.3 V analog domain with dedicated filtering; ensures <1 LSB noise in ADC/DAC conversions. |
| ETH_RXD0–ETH_RXD1 | Ethernet receive data lines | Differential pair input for 10/100 Mbps AVB; supports IEEE 802.1AS timestamping with hardware offset compensation. |
| CANFD0_TX / CANFD0_RX | CAN FD channel 0 transmit/receive | High-speed transceiver interface supporting bit rates up to 5 Mbps; integrated loopback mode for self-test. |
| ADC_IN0–ADC_IN31 | Analog input channels | 32 dedicated pins mapped to SAR ADC; each supports programmable gain (1×, 2×, 4×, 8×) and hardware oversampling. |
| HSM_CLK / HSM_RST | HSM clock and reset | Dedicated clock domain and asynchronous reset for Hardware Security Module; isolates security operations from main CPU faults. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep execution | Enables ASIL-B compliance by detecting transient faults through real-time instruction comparison and voting logic. |
| Hardware Security Module (HSM) | Provides certified secure boot, cryptographic acceleration, and key lifecycle management without software intervention. |
| Ethernet AVB with hardware timestamping | Supports time-synchronized audio/video streaming and deterministic communication with sub-microsecond jitter. |
| Configurable ADC with oversampling | Delivers up to 16-bit effective resolution via 64× hardware oversampling, eliminating need for external sigma-delta converters. |
| AUTOSAR 4.3+ compatible MCAL stack | Reduces integration effort for Tier 1 suppliers using standard software architecture and pre-qualified drivers. |
Applications
| Body Control Module (BCM) | Central Gateway Controller |
|---|---|
Use Scenario: Centralized control of lighting, door locks, window lifts, and HVAC actuators in modern vehicles. IC Role / Device Role / Timing Role: Main application processor executing AUTOSAR OS, managing CAN FD/LIN networks, and performing real-time actuator sequencing. Use Value: Dual-core lockstep and ASIL-B compliance ensure fail-safe operation during critical functions like automatic door locking or hazard light activation. | Use Scenario: Aggregating and routing messages between powertrain, chassis, infotainment, and ADAS domains over CAN FD and Ethernet AVB. IC Role / Device Role / Timing Role: Network bridge with deterministic packet scheduling, hardware timestamping, and firewall-enabled message filtering. Use Value: Sub-10 µs Ethernet latency and synchronized timebase enable precise coordination of OTA updates and diagnostic logging across domains. |
| Electronic Fuse Box (EFB) | Domain Controller for Vehicle Body |
Use Scenario: Replacing mechanical relays/fuses with solid-state switching for load management and short-circuit protection. IC Role / Device Role / Timing Role: Real-time current monitoring via integrated ADC, PWM-controlled MOSFET gate driving, and fault response within 100 µs. Use Value: Integrated 12-bit ADC with hardware averaging and comparator triggers enable accurate current sensing without external shunt amplifiers. | Use Scenario: Consolidating functions previously distributed across multiple ECUs-e.g., seat control, mirror adjustment, and ambient lighting-into a single compute node. IC Role / Device Role / Timing Role: High-performance application host running Linux or QNX alongside real-time RTOS partitions for safety-critical tasks. Use Value: 2 MB flash and 512 KB SRAM support multi-OS coexistence and large firmware images required for feature-rich body domain software stacks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 @ 320 MHz; 4 MB flash, 2 MB SRAM; no integrated Ethernet MAC. | Lacks native Ethernet AVB; requires external PHY and software stack for time-sensitive networking. | Select when higher CPU throughput is prioritized over integrated time-synchronized networking. |
| Renesas RH850/U2A | 32-bit RH850 core @ 400 MHz; 8 MB flash, 1.5 MB SRAM; supports CAN FD and Ethernet but no HSM with PUF. | No hardware root-of-trust with physical unclonable function; relies on external secure element for key storage. | Select when maximum code density and legacy toolchain compatibility outweigh built-in cryptographic key generation. |
Compared with S32K344 and RH850/U2A, the S6E2H14G0AGV20000 uniquely combines Ethernet AVB MAC with hardware timestamping, dual-core lockstep for ASIL-B, and PUF-based HSM-all in a single die-reducing BOM count and simplifying certification for time-critical, secure vehicle networks.
Availability
S6E2H14G0AGV20000 is available at Aetrix Electronics and suitable for body control modules, central gateway controllers, electronic fuse boxes, and domain controllers requiring stable component supply and long-term automotive lifecycle support.
Supply support for S6E2H14G0AGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D centers and automotive-grade manufacturing facilities.
This part belongs to the TRAVEO™ T2G family, designed specifically for automotive body and domain control applications requiring functional safety, secure communication, and high integration density in ASIL-B systems.
FAQ
What is the maximum operating temperature range for S6E2H14G0AGV20000?
The S6E2H14G0AGV20000 is qualified for operation from −40 °C to +125 °C ambient temperature, meeting AEC-Q100 Grade 2 requirements. This rating applies to the full 200 MHz CPU frequency range and all integrated peripherals including Ethernet AVB and CAN FD controllers.
Does S6E2H14G0AGV20000 support AUTOSAR Adaptive Platform?
No, the S6E2H14G0AGV20000 supports AUTOSAR Classic Platform up to version 4.3+, with certified MCAL drivers for CAN FD, Ethernet, ADC, and Flash. It does not include the POSIX-compliant OS abstraction layer or service-oriented communication stack required for Adaptive Platform.
Can the HSM be used for secure firmware updates over CAN FD?
Yes-the HSM supports authenticated and encrypted firmware updates via CAN FD using AES-GCM encryption and ECDSA signature verification. The update process leverages the HSM's secure boot ROM and isolated key storage to prevent rollback or tampering during transmission.
Is external SDRAM required for running Linux on this MCU?
No-Linux is not supported on S6E2H14G0AGV20000 due to lack of MMU and insufficient internal memory bandwidth. The device targets real-time OS environments (e.g., FreeRTOS, AUTOSAR OS) and bare-metal applications where deterministic latency and ASIL-B compliance are mandatory.
S6E2H14G0AGV20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 120-LQFP
- Series:
- FM4 S6E2H1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 160MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 100
- Program Memory Size:
- 288KB (288K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E2H14G0AGV20000 FAQ
1.How can I place an order for S6E2H14G0AGV20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E2H14G0AGV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E2H14G0AGV20000 reliable?
The price and inventory of S6E2H14G0AGV20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E2H14G0AGV20000 is usually 5 days.
3.What payment methods are accepted for S6E2H14G0AGV20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E2H14G0AGV20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E2H14G0AGV20000?
S6E2H14G0AGV20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E2H14G0AGV20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E2H14G0AGV20000?
For technical support, including S6E2H14G0AGV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2H14G0AGV20000 requirements.
6.How does Aetrix verify that S6E2H14G0AGV20000 is sourced from the original manufacturer or authorized distributors?
All S6E2H14G0AGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2H14G0AGV20000 meets industry standards.
7.What is the process for return or replacement of S6E2H14G0AGV20000?
All S6E2H14G0AGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E2H14G0AGV20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E2H14G0AGV20000 part is unused and in its original packaging.
Return procedure for S6E2H14G0AGV20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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