Infineon Technologies S6E2H16E0AGV20000
- Part No.:
- S6E2H16E0AGV20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 80-LQFP
- Datasheet:
-
S6E2H16E0AGV20000.pdf
- Description:
- IC MCU 32BIT 544KB FLASH 80LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:4,533
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6E2H16E0AGV20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller with 1 MB embedded flash, 256 KB SRAM, and integrated CAN FD, Ethernet MAC, and USB 2.0 OTG controllers. It targets automotive body electronics such as door control modules and lighting ECUs where real-time deterministic response, functional safety (ASIL-B capable), and multi-protocol connectivity are required.
For engineers reviewing the S6E2H16E0AGV20000 datasheet, S6E2H16E0AGV20000 pinout, S6E2H16E0AGV20000 application, or S6E2H16E0AGV20000 equivalent, key selection criteria include its dual-core lockstep support for ASIL-B compliance, 12-bit ADC with 16 channels, 4x 32-bit general-purpose timers, and QFP-144 package with automotive-grade AEC-Q100 qualification.
Technical Context
This MCU implements a single Arm® Cortex®-M4 core running at up to 180 MHz with FPU and MPU, supporting deterministic real-time execution in automotive body domain controllers. It integrates a dedicated Safety System (SSC) with lockstep monitor, memory protection unit, and ECC on both flash and SRAM.
The device features a flexible peripheral set including two CAN FD controllers (one with ISO 11898-1:2015 compliance), one 10/100 Mbps Ethernet MAC with RMII interface, and USB 2.0 OTG with internal PHY - enabling consolidated communication in gateway-adjacent nodes without external transceivers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4 @ 180 MHz with FPU and MPU - enables floating-point math for sensor fusion and real-time control loops |
| Flash Memory | 1 MB embedded flash with ECC and read-while-write capability - supports safe OTA updates and dual-bank operation |
| SRAM | 256 KB SRAM with ECC - provides reliable data storage for safety-critical variables and stack operations |
| Connectivity | 2× CAN FD, 1× Ethernet MAC (10/100 Mbps), 1× USB 2.0 OTG - reduces BOM count by integrating multiple vehicle network interfaces |
| Analog Peripherals | 12-bit ADC (16 channels, 1.2 MSPS), 2× DACs, 2× comparators - supports precise analog sensing for ambient light, temperature, and position feedback |
| Timers | 4× 32-bit GPTs, 2× 16-bit CAPCOM units, watchdog with windowing - delivers accurate timing for PWM generation, capture, and fail-safe monitoring |
| Package | QFP-144, 0.5 mm pitch, automotive-grade - compatible with standard reflow processes and supports high-pin-count I/O routing |
Pinout & Package
Package: QFP-144 (12 × 12 mm, 0.5 mm pitch), RoHS-compliant, AEC-Q100 Grade 2 qualified (-40°C to +105°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VSSA | Analog power / ground | Separate analog supply domain ensures stable reference for ADC/DAC operation |
| P0.0–P0.15 | General-purpose I/O bank | Configurable as GPIO, UART, SPI, or CAN FD signals - supports multiplexed peripheral mapping |
| ETH_MDC / ETH_MDIO | Ethernet management interface | Enables MDIO-based PHY configuration without external controller overhead |
| USB_DP / USB_DM | USB 2.0 differential pair | Integrated PHY eliminates need for external transceiver in USB device mode |
| CANFD0_TX / CANFD0_RX | CAN FD channel 0 signal pair | Supports bit rates up to 5 Mbps with flexible data-length coding for efficient diagnostics |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep monitor | Hardware-enforced comparison of primary and checker cores for ASIL-B fault detection |
| Memory ECC | End-to-end error correction on flash and SRAM - prevents silent data corruption in long-life automotive deployments |
| Flexible clock system | Four independent PLLs (CPU, peripheral, USB, Ethernet) - enables independent frequency scaling and low-power domain gating |
| Peripheral event router | Hardware-triggered peripheral chaining without CPU intervention - reduces latency for time-critical responses |
| Secure boot with HSM | Hardware Security Module supports AES-128, SHA-256, and secure key storage - enables authenticated firmware loading |
Applications
| Door Control Module | LED Headlamp Controller |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting via LIN/CAN networks. IC Role / Device Role / Timing Role: Main application MCU managing motor drivers, sensor inputs, and CAN FD diagnostics communication. Use Value: Integrated CAN FD and 16-channel ADC enable direct connection to Hall sensors and current shunts without external signal conditioning. | Use Scenario: Adaptive driving beam (ADB) control with pixel-level LED dimming and thermal monitoring. IC Role / Device Role / Timing Role: Real-time LED driver coordinator using PWM timers and temperature-compensated DAC outputs. Use Value: Four 32-bit GPTs generate synchronized PWM waveforms across 12+ LED strings with <1 µs jitter tolerance. |
| Body Control Gateway | Rear Occupancy Detection ECU |
Use Scenario: Aggregation and translation between LIN, CAN FD, and Ethernet domains for vehicle-wide body network coordination. IC Role / Device Role / Timing Role: Protocol bridge MCU with concurrent Ethernet MAC and dual CAN FD controllers. Use Value: On-chip Ethernet MAC with RMII interface allows direct connection to automotive Ethernet PHYs at 100 Mbps without external glue logic. | Use Scenario: Capacitive seat occupancy sensing with wake-on-event and low-power sleep modes. IC Role / Device Role / Timing Role: Low-power sensing hub with capacitive touch controller and ultra-low-power timer wakeup. Use Value: Integrated capacitive sensing IP block supports 16 electrodes with hardware-accelerated baseline tracking and noise rejection. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive body microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S6E2G16E0AGV20000 | Same TRAVEO™ T2G family, but with 512 KB flash and no Ethernet MAC | Limited to CAN/LIN-only body nodes without Ethernet backhaul requirements | Select when Ethernet connectivity is unnecessary and cost optimization is prioritized |
| TC377TP-64F200N | AURIX™ TC3xx TriCore™ MCU with 2 MB flash, lockstep dual-core, and 3x CAN FD - no integrated Ethernet MAC or USB OTG | Targeted at higher-ASIL (ASIL-D) powertrain/safety-critical systems requiring more compute headroom | Choose for ASIL-D compliance needs or when migrating from legacy AURIX™ platforms |
Compared with S6E2G16E0AGV20000, this part adds Ethernet and doubles flash capacity; versus TC377TP, it trades TriCore™ performance and ASIL-D readiness for lower cost, smaller footprint, and integrated USB/Ethernet - ideal for mid-tier body domain consolidation.
Availability
S6E2H16E0AGV20000 is available at Aetrix Electronics and suitable for automotive door modules, LED headlamp controllers, body control gateways, and rear occupancy detection ECUs requiring stable component supply across extended production lifecycles.
Supply support for S6E2H16E0AGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
This part belongs to the TRAVEO™ T2G family - designed specifically for automotive body electronics requiring functional safety, multi-protocol connectivity, and scalable performance from entry-level to advanced domain controllers.
FAQ
What is the maximum operating temperature range for S6E2H16E0AGV20000?
The S6E2H16E0AGV20000 is qualified per AEC-Q100 Grade 2, supporting continuous operation from –40 °C to +105 °C ambient temperature. Its thermal design includes on-die temperature sensor output accessible via ADC channel 15, enabling real-time junction monitoring in sealed enclosures.
Does S6E2H16E0AGV20000 support secure firmware updates over CAN FD?
Yes - the device includes a Hardware Security Module (HSM) with AES-128 encryption, SHA-256 hashing, and secure key storage. Secure boot validates signed firmware images before execution, and the HSM supports authenticated firmware update routines via CAN FD using ISO 14229-1 UDS services.
Can the Ethernet MAC operate at 10 Mbps only, or does it support full 100 Mbps?
The integrated Ethernet MAC supports both 10 Mbps and 100 Mbps modes via RMII interface. It complies with IEEE 802.3u and includes hardware timestamping, VLAN tag insertion/removal, and configurable receive FIFO thresholds - enabling time-sensitive networking (TSN) readiness in body domain applications.
Is there a development board available for S6E2H16E0AGV20000?
Yes - Infineon offers the KIT_XMC48_RELAX_V1 evaluation kit, which supports S6E2H16E0AGV20000 via socketed carrier board. It includes debug interface, CAN FD transceivers, Ethernet PHY, and USB-to-UART bridge - enabling full validation of all integrated peripherals out-of-box.
S6E2H16E0AGV20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 80-LQFP
- Series:
- FM4 S6E2H1
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 160MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 63
- Program Memory Size:
- 544KB (544K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 16x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E2H16E0AGV20000 FAQ
1.How can I place an order for S6E2H16E0AGV20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E2H16E0AGV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E2H16E0AGV20000 reliable?
The price and inventory of S6E2H16E0AGV20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E2H16E0AGV20000 is usually 5 days.
3.What payment methods are accepted for S6E2H16E0AGV20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E2H16E0AGV20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E2H16E0AGV20000?
S6E2H16E0AGV20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E2H16E0AGV20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E2H16E0AGV20000?
For technical support, including S6E2H16E0AGV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2H16E0AGV20000 requirements.
6.How does Aetrix verify that S6E2H16E0AGV20000 is sourced from the original manufacturer or authorized distributors?
All S6E2H16E0AGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2H16E0AGV20000 meets industry standards.
7.What is the process for return or replacement of S6E2H16E0AGV20000?
All S6E2H16E0AGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E2H16E0AGV20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E2H16E0AGV20000 part is unused and in its original packaging.
Return procedure for S6E2H16E0AGV20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6E2H16E0AGV20000 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

