My Inquiry
My Account
Infineon Technologies S6E2H44F0AGV20000
- Part No.:
- S6E2H44F0AGV20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
S6E2H44F0AGV20000.pdf
- Description:
- IC MCU 32BIT 288KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,453
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6E2H44F0AGV20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 2 MB flash, 384 KB SRAM, dual CAN FD controllers, 4x LIN, and hardware security (TRUSTED BOOT + AES-128). It operates at up to 180 MHz and supports AEC-Q100 Grade 2 qualification (–40°C to +105°C).
For engineers reviewing the S6E2H44F0AGV20000 datasheet, S6E2H44F0AGV20000 pinout, S6E2H44F0AGV20000 application, or S6E2H44F0AGV20000 equivalent, this MCU delivers deterministic real-time control, secure boot integrity, and integrated communication peripherals for automotive door modules, lighting control units, and smart junction boxes.
Technical Context
This MCU implements a dual-bank flash architecture with ECC protection and runtime swap capability for seamless firmware updates. Its peripheral set includes a 12-bit SAR ADC (16 channels), configurable digital I/Os with glitch filtering, and hardware CRC accelerators supporting ISO 13818-1 and ISO 14443-A/B protocols.
The device features a dedicated safety monitor (SMU) with lockstep CPU core checking, memory BIST, and windowed watchdog timers compliant with ISO 26262 ASIL-B requirements. Clock generation includes a 4–20 MHz crystal oscillator input and internal PLLs supporting multiple domain-specific clock trees.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-M4 @ 180 MHz - Enables real-time motor control loops and sensor fusion with FPU/MPU support. |
| Flash Memory | 2 MB dual-bank with ECC - Supports safe over-the-air (OTA) updates without runtime interruption. |
| SRAM | 384 KB with parity - Provides buffer space for CAN FD message queues and cryptographic operations. |
| Communication | Dual CAN FD + 4x LIN + SPI/I²C/UART - Meets multi-bus requirements in centralized body control modules. |
| Security | TRUSTED BOOT + AES-128 + SHA-256 - Ensures authenticated boot and secure firmware image verification. |
| Temperature Range | AEC-Q100 Grade 2 (–40°C to +105°C) - Validated for under-hood and interior automotive mounting locations. |
| Package | LQFP-144 (20 × 20 mm, 0.5 mm pitch) - Compatible with standard automotive PCB assembly processes. |
Pinout & Package
LQFP-144 package with exposed thermal pad; RoHS-compliant, lead-free finish; JEDEC-standard footprint for automated optical inspection and reflow compatibility.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VSSA | Analog power / ground | Separate analog supply domain for ADC reference stability and noise immunity. |
| P0.0–P0.7 | GPIO bank 0 | Configurable as high-drive outputs (20 mA) or interrupt-capable inputs for door latch sensing. |
| CAN0_TX / CAN0_RX | Channel 0 differential transceiver interface | Direct connection to CAN FD physical layer with built-in bus fault detection logic. |
| OSC_IN / OSC_OUT | External crystal oscillator terminals | Supports 4–20 MHz crystals for precise timing of LIN baud rate generation and PWM modulation. |
| BOOT0 | Boot mode selection | Pulled low during reset to enable main flash execution; critical for production boot sequence validation. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-bank flash with SWAP | Enables atomic firmware update without halting real-time tasks - essential for zero-downtime ECU upgrades. |
| Hardware crypto engine | Dedicated AES-128/SHA-256 accelerator offloads CPU during secure boot and OTA signature verification. |
| ASIL-B compliant SMU | Integrated safety monitor validates CPU lockstep operation, memory integrity, and clock domain consistency. |
| Configurable GPIO with glitch filter | Programmable digital filter (up to 10 µs) suppresses contact bounce in switch inputs for door handle or trunk release detection. |
| Dual CAN FD with time-triggered mode | Supports deterministic scheduling of diagnostic messages and actuator commands in synchronized network topologies. |
Applications
| Door Control Module | LED Lighting Controller |
|---|---|
Use Scenario: Centralized control of power windows, locks, mirrors, and anti-pinch sensors in automotive door assemblies. IC Role / Device Role / Timing Role: Real-time MCU executing position control algorithms, LIN slave communication with body controller, and CAN FD diagnostics reporting. Use Value: Dual-bank flash enables field-upgradable window calibration profiles; ASIL-B SMU ensures fail-safe lock actuation under fault conditions. | Use Scenario: Adaptive rear lighting with dynamic brake light sequencing, turn signal animation, and ambient illumination dimming. IC Role / Device Role / Timing Role: Timing-critical PWM generator for LED current regulation and LIN master coordinating multiple lamp nodes. Use Value: Hardware CRC engine validates lighting configuration data; 12-bit ADC monitors thermal sensor feedback for thermal derating. |
| Smart Junction Box | Seat Control Unit |
Use Scenario: Power distribution and load monitoring across chassis domains including HVAC, wipers, and horn circuits. IC Role / Device Role / Timing Role: High-integrity power management controller with current-sense ADC, CAN FD command interface, and fault logging. Use Value: 384 KB SRAM buffers fault logs across multiple ignition cycles; dual CAN FD ports isolate diagnostic and control traffic. | Use Scenario: Motorized seat position adjustment with memory recall, heating element control, and occupancy detection. IC Role / Device Role / Timing Role: Motor control MCU running BLDC commutation, thermistor-based heater regulation, and LIN communication with central gateway. Use Value: Integrated CAN FD supports seat position synchronization with infotainment system; hardware crypto secures user profile storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive body control MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S6E2G44F0AGV20000 | Same package, 1 MB flash, no hardware crypto engine | Lower-cost variant for non-security-critical lighting or mirror control | Select when ASIL-B certification and secure boot are not required. |
| TC377TP-64F200N | AURIX™ TriCore™, 200 MHz, 4 MB flash, lockstep dual-core, higher ASIL-D readiness | Targeted at ADAS-related body integration (e.g., camera washer control) | Choose for systems requiring higher functional safety integrity or complex sensor fusion. |
Compared with S6E2G44F0AGV20000 and TC377TP-64F200N, the S6E2H44F0AGV20000 uniquely balances AEC-Q100 Grade 2 operation, dual CAN FD, and certified hardware security in an LQFP-144 footprint-making it optimal for cost-sensitive yet safety-aware body ECUs where cryptographic trust anchors are mandatory.
Availability
S6E2H44F0AGV20000 is available at Aetrix Electronics and suitable for automotive door modules, LED lighting controllers, smart junction boxes, and seat control units requiring stable component supply across extended production lifecycles.
Supply support for S6E2H44F0AGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global manufacturing and R&D centers.
The TRAVEO™ T2G product line targets automotive body electronics with scalable Arm® Cortex®-M4 MCUs integrating communication, safety, and security features for centralized control units in modern vehicle architectures.
FAQ
What is the maximum operating frequency of the S6E2H44F0AGV20000?
The S6E2H44F0AGV20000 runs at a maximum CPU frequency of 180 MHz, achieved via its internal PLL with programmable multiplication factors. This frequency is validated across the full AEC-Q100 Grade 2 temperature range and supports real-time execution of motor control algorithms and protocol stacks without throttling.
Does this MCU support JTAG debugging?
Yes, the S6E2H44F0AGV20000 supports SWD (Serial Wire Debug) and JTAG interfaces through dedicated pins (TCK, TMS, TDI, TDO, nTRST). Debug access is protected by a configurable debug authentication mechanism that must be explicitly enabled during development and disabled in production builds.
How is flash memory protected against unauthorized access?
Flash protection is implemented via hardware-based read-out protection (ROP) levels and secure boot enforcement. ROP Level 2 prevents external readout via debug interfaces, while TRUSTED BOOT verifies digital signatures of boot code using embedded public keys stored in one-time-programmable (OTP) memory.
What peripheral resources are available for LIN communication?
The MCU integrates four independent LINFlexD modules, each supporting LIN 2.2A/B and SAE J2602 protocols. Each module provides automatic baud rate detection, checksum calculation, and frame timeout handling - enabling simultaneous operation as master on one channel and slaves on the others within a single ECU.
S6E2H44F0AGV20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 100-LQFP
- Series:
- FM4 S6E2H4
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 160MHz
- Connectivity:
- CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 80
- Program Memory Size:
- 288KB (288K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E2H44F0AGV20000 FAQ
1.How can I place an order for S6E2H44F0AGV20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E2H44F0AGV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E2H44F0AGV20000 reliable?
The price and inventory of S6E2H44F0AGV20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E2H44F0AGV20000 is usually 5 days.
3.What payment methods are accepted for S6E2H44F0AGV20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E2H44F0AGV20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E2H44F0AGV20000?
S6E2H44F0AGV20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E2H44F0AGV20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E2H44F0AGV20000?
For technical support, including S6E2H44F0AGV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2H44F0AGV20000 requirements.
6.How does Aetrix verify that S6E2H44F0AGV20000 is sourced from the original manufacturer or authorized distributors?
All S6E2H44F0AGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2H44F0AGV20000 meets industry standards.
7.What is the process for return or replacement of S6E2H44F0AGV20000?
All S6E2H44F0AGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E2H44F0AGV20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E2H44F0AGV20000 part is unused and in its original packaging.
Return procedure for S6E2H44F0AGV20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6E2H44F0AGV20000 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
