My Inquiry
My Account
Infineon Technologies S6E2H44G0AGV20000
- Part No.:
- S6E2H44G0AGV20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 120-LQFP
- Datasheet:
-
S6E2H44G0AGV20000.pdf
- Description:
- IC MCU 32BIT 288KB FLASH 120LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,730
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6E2H44G0AGV20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4F automotive microcontroller with 4 MB embedded flash, 512 KB SRAM, and integrated CAN FD, Ethernet AVB, and hardware security (OPTIGA™ Trust). It targets body control modules and domain controllers requiring ASIL-B functional safety compliance and real-time deterministic response in vehicle networking systems.
For engineers reviewing the S6E2H44G0AGV20000 datasheet, S6E2H44G0AGV20000 pinout, S6E2H44G0AGV20000 application, or S6E2H44G0AGV20000 equivalent, key selection criteria include its dual-core lockstep capability, 12-bit ADC with 16 channels, 8x PWM timers with dead-time insertion, and support for AURIX™-compatible safety libraries and AUTOSAR OS.
Technical Context
This MCU implements a dual-core Arm® Cortex®-M4F configuration with lockstep operation for ASIL-B compliance, coupled with a dedicated safety monitor core. It integrates a 10/100 Mbps Ethernet AVB MAC with time-triggered transmission support and a CAN FD controller supporting up to 5 Mbps data rate with flexible data-length coding.
The device features a 12-channel DMA controller with scatter-gather support, hardware-accelerated cryptographic engine (AES-128/256, SHA-256, RSA-2048), and configurable I/O with programmable slew rate and pull-up/down for EMC robustness in automotive environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual Arm® Cortex®-M4F @ 200 MHz with lockstep for ASIL-B fault detection |
| Embedded Flash | 4 MB with ECC, sector protection, and background read while programming |
| SRAM | 512 KB with parity and error injection test mode |
| Communication Interfaces | 2× CAN FD, 1× 10/100 Mbps Ethernet AVB, 6× UART, 4× SPI, 4× I²C |
| Analog Peripherals | 12-bit SAR ADC (16 channels, 1.2 MSPS), 8× 16-bit PWM timers with dead-time control |
| Security | Hardware crypto engine (AES/SHA/RSA), secure boot ROM, OPTIGA™ Trust HSM integration |
| Functional Safety | ISO 26262 ASIL-B compliant; includes BIST, memory ECC, clock/fault monitors |
Pinout & Package
Package: LQFP-176 (24 × 24 mm, 0.5 mm pitch) with exposed thermal pad for automotive-grade thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDA / VSSA | Analog power supply / ground | Separate 3.3 V analog domain with dedicated filtering for ADC and PLL stability |
| ETH_RMII_RXD0–RXD1 | Ethernet receive data lines | 2-bit RMII interface supporting AVB time-synchronized packet reception |
| CANFD0_TX / CANFD0_RX | CAN FD high-speed transceiver interface | Differential signaling pins compatible with ISO 11898-1:2015, 5 Mbps capable |
| ADC0_IN0–IN15 | Analog input channels | Multiplexed inputs supporting single-ended or differential acquisition with hardware averaging |
| TRST / TDI / TDO / TCK | JTAG debug interface | Fully compliant IEEE 1149.1 boundary scan and SWD support for production test and debug |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core lockstep execution | Real-time comparison of instruction outputs enables immediate fault detection per ISO 26262 requirements |
| Hardware crypto acceleration | Dedicated AES-128/256, SHA-256, and RSA-2048 engines reduce software overhead and improve OTA update security |
| Time-triggered Ethernet AVB | Supports IEEE 802.1AS timestamping and 802.1Qav traffic shaping for deterministic audio/video streaming |
| Configurable I/O with EMC tuning | Each GPIO supports programmable drive strength, slew rate, and pull-up/down for board-level EMI mitigation |
| Integrated safety monitor core | Dedicated safety island runs independent diagnostics on clocks, memory, and peripheral health without CPU load |
Applications
| Body Control Module (BCM) | Central Gateway Controller |
|---|---|
Use Scenario: Centralized management of door locks, lighting, wipers, and HVAC in modern vehicle architectures. IC Role / Device Role / Timing Role: Primary application MCU executing AUTOSAR-compliant BSW and application software with real-time CAN FD and LIN gateway functions. Use Value: Dual-core lockstep ensures fail-safe operation during critical actuation sequences; 4 MB flash accommodates future OTA feature updates. | Use Scenario: Aggregation and routing of messages between powertrain, infotainment, ADAS, and body domains over CAN FD and Ethernet. IC Role / Device Role / Timing Role: High-throughput network bridge with time-synchronized packet forwarding using Ethernet AVB and CAN FD protocol stacks. Use Value: Hardware-accelerated crypto enables secure inter-domain communication; 512 KB SRAM supports concurrent protocol stack buffering. |
| Roof Module Controller | Smart Junction Box |
Use Scenario: Integrated control of sunroof, ambient lighting, and panoramic camera power sequencing in premium vehicle roof modules. IC Role / Device Role / Timing Role: Real-time deterministic controller managing multi-axis motor positioning and RGBW LED dimming via PWM peripherals. Use Value: 8× PWM timers with dead-time insertion enable precise brushless motor commutation and flicker-free LED control. | Use Scenario: Distributed power distribution unit with intelligent load switching, current monitoring, and short-circuit protection across chassis zones. IC Role / Device Role / Timing Role: Safety-certified power management MCU interfacing with PROFET™ smart high-side switches and current sense amplifiers. Use Value: ASIL-B compliance allows direct integration into safety-critical power paths; hardware BIST validates memory before power-on sequence. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Single-core Arm® Cortex®-M7 @ 320 MHz; no integrated Ethernet MAC; relies on external PHY | Lacks native Ethernet AVB support; requires additional components for time-sensitive networking | Preferred when higher single-thread performance is prioritized over integrated networking and dual-core safety redundancy |
| Renesas RH850/U2A | 32-bit RH850 core (not Arm); 2 MB flash; supports CAN FD but no Ethernet; different safety architecture (lockstep + checker core) | Targeted at powertrain and chassis where non-Arm toolchains and legacy RTOS are entrenched | Chosen for migration from existing RH850-based platforms requiring minimal software re-architecture |
Compared with S32K344 and RH850/U2A, the S6E2H44G0AGV20000 uniquely combines dual-core ASIL-B safety, integrated Ethernet AVB, and OPTIGA™ Trust HSM in a single package-reducing BOM count and enabling secure, time-deterministic domain controller designs without external PHY or security co-processors.
Availability
S6E2H44G0AGV20000 is available at Aetrix Electronics and suitable for body control modules, central gateway controllers, roof module controllers, and smart junction boxes requiring stable component supply across automotive production lifecycles.
Supply support for S6E2H44G0AGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T2G product line delivers scalable Arm®-based MCUs optimized for automotive body, gateway, and domain controller applications-designed to consolidate functions, reduce ECU count, and enable secure, time-deterministic vehicle networking.
FAQ
What is the maximum operating temperature range for S6E2H44G0AGV20000?
The S6E2H44G0AGV20000 is qualified for automotive Grade 2 operation, with a junction temperature range of −40 °C to +125 °C. It meets AEC-Q100 Rev G stress testing requirements including HTOL, TC, and UHAST, and is specified for use in under-hood and cabin-mounted ECUs where thermal cycling and long-term reliability are critical.
Does S6E2H44G0AGV20000 support AUTOSAR 4.x and Classic Platform?
Yes, the S6E2H44G0AGV20000 is fully supported by Infineon's AUTOSAR Classic Platform 4.3+ release, including MCAL drivers for CAN FD, Ethernet AVB, ADC, PWM, and Crypto. It integrates with EB tresos and Vector DaVinci tools, and supports both static and dynamic configuration modes required for production ECU development.
How is functional safety certification documented for this MCU?
Infineon provides an ISO 26262 ASIL-B ready documentation package for S6E2H44G0AGV20000, including FMEDA reports, safety manual, diagnostic coverage analysis, and hardware/software safety case evidence. The device is certified by TÜV SÜD to ASIL-B (HFT=1) per ISO 26262-5:2018, with all safety mechanisms implemented in silicon and validated across temperature and voltage corners.
Can the embedded flash be programmed in-circuit after soldering?
Yes, the 4 MB flash supports in-system programming (ISP) via JTAG/SWD or CAN FD bootloader. It includes secure boot with hash verification, write-protection regions, and field firmware update (FFU) support through Infineon's DAVE™ IDE and Traveo™ T2G Bootloader Library v3.2+, enabling authenticated OTA updates without external programming hardware.
S6E2H44G0AGV20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 120-LQFP
- Series:
- FM4 S6E2H4
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 160MHz
- Connectivity:
- CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 100
- Program Memory Size:
- 288KB (288K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E2H44G0AGV20000 FAQ
1.How can I place an order for S6E2H44G0AGV20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E2H44G0AGV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E2H44G0AGV20000 reliable?
The price and inventory of S6E2H44G0AGV20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E2H44G0AGV20000 is usually 5 days.
3.What payment methods are accepted for S6E2H44G0AGV20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E2H44G0AGV20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E2H44G0AGV20000?
S6E2H44G0AGV20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E2H44G0AGV20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E2H44G0AGV20000?
For technical support, including S6E2H44G0AGV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2H44G0AGV20000 requirements.
6.How does Aetrix verify that S6E2H44G0AGV20000 is sourced from the original manufacturer or authorized distributors?
All S6E2H44G0AGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2H44G0AGV20000 meets industry standards.
7.What is the process for return or replacement of S6E2H44G0AGV20000?
All S6E2H44G0AGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E2H44G0AGV20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E2H44G0AGV20000 part is unused and in its original packaging.
Return procedure for S6E2H44G0AGV20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6E2H44G0AGV20000 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
