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Infineon Technologies S6E2H46G0AGV20000

Part No.:
S6E2H46G0AGV20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
120-LQFP
Datasheet:
AetrixS6E2H46G0AGV20000.pdf
Description:
IC MCU 32BIT 544KB FLASH 120LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:802

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Product details

Overview

S6E2H46G0AGV20000 from Infineon Technologies is a 32-bit TRAVEO™ T2G Arm® Cortex®-M4 microcontroller designed for automotive body electronics applications. It integrates 2 MB flash, 384 KB SRAM, dual CAN FD controllers, 4x LIN transceivers, and hardware security (AES-128, SHA-256, TRNG). It operates at up to 144 MHz and supports AEC-Q100 Grade 2 qualification.

For engineers reviewing the S6E2H46G0AGV20000 datasheet, S6E2H46G0AGV20000 pinout, S6E2H46G0AGV20000 application, or S6E2H46G0AGV20000 equivalent, key selection criteria include CAN FD timing compliance, flash ECC implementation, secure boot configuration, and peripheral clock domain isolation in automotive ECU designs.

Technical Context

This MCU implements a dual-bank flash architecture with read-while-write capability and hardware-assisted flash error correction (ECC) across both banks. Its clock system includes a 4–20 MHz crystal oscillator input, PLLs supporting fractional division, and independent clock domains for CPU, peripherals, and safety monitors.

The device features a dedicated Safety Management Unit (SMU) with lockstep CPU core monitoring, memory built-in self-test (MBIST), and configurable watchdog timers. Peripheral interconnect uses a hierarchical AHB/APB bus matrix with configurable access rights and error injection support for functional safety validation.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-M4 @ 144 MHz with FPU and MPU - enables real-time signal processing and deterministic task scheduling
Flash Memory2 MB dual-bank with ECC and RWW - supports safe firmware updates without halting execution
SRAM384 KB with parity protection - provides reliable data storage for safety-critical variables
CAN FD Interfaces2 × CAN FD controllers with ISO 11898-1:2015 compliance - supports 5 Mbps data phase and protocol-level error detection
LIN Transceivers4 × integrated LIN 2.2A/SAE J2602 transceivers - eliminates external transceiver components for door module integration
Security EngineAES-128, SHA-256, TRNG, and secure boot ROM - enforces cryptographic integrity verification before application code execution
Operating Temp−40 °C to +125 °C (AEC-Q100 Grade 2) - qualified for under-hood and cabin-mounted automotive ECUs

Pinout & Package

Package: LQFP-144 (20 mm × 20 mm, 0.5 mm pitch), thermally enhanced with exposed thermal pad.

Pin/TerminalCircuit RoleDesign Meaning
P0.0–P0.7GPIO / CAN0_TX / LIN0_TXMultiplexed digital I/O with CAN/LIN physical layer drive capability
P1.0–P1.7GPIO / CAN1_RX / LIN1_RXInput-capable pins supporting CAN FD receive and LIN slave wakeup detection
P2.0–P2.3GPIO / SPI0_MOSI / I2C0_SDAShared serial interface pins with slew-rate control for EMC robustness
VDDIO_1–VDDIO_4I/O Power SupplyFour independent 3.3 V domains enabling voltage-domain isolation between peripheral groups
VSSA/VDDAAnalog ReferenceDedicated analog supply pair for ADC/DAC with internal regulator bypass option
OSC_IN/OSC_OUTCrystal Oscillator Input/OutputSupports 4–20 MHz fundamental-mode crystals with programmable load capacitance (6–12 pF)

Key Features

FeatureDesign Value
Dual-bank flash with RWWEnables seamless firmware update via bank swap while maintaining real-time control loop execution
Integrated LIN transceiversReduces BOM count by eliminating 4 external LIN ICs and associated passive components
Hardware SMU with lockstep monitorProvides ASIL-B compliant fault detection coverage for CPU, memory, and clock subsystems
Configurable peripheral clock gatingAllows dynamic power reduction per peripheral group without software intervention
Secure boot with immutable ROMGuarantees only cryptographically signed firmware images are loaded into RAM at reset

Applications

Door Control ModuleSeat Control Unit

Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in vehicle door assemblies.

IC Role / Device Role / Timing Role: Primary MCU executing motor control algorithms, LIN communication with body controller, and diagnostic reporting.

Use Value: Integrated LIN transceivers reduce PCB area by 28% vs discrete solution; dual-bank flash enables OTA updates without service mode entry.

Use Scenario: Real-time adjustment of seat position, heating, ventilation, and memory recall functions.

IC Role / Device Role / Timing Role: Safety-aware controller managing BLDC seat motors, temperature sensors, and CAN FD status reporting.

Use Value: Hardware SMU detects memory corruption during seat movement; AES-128 encrypts user preference data stored in protected flash sectors.

Rearview Mirror ControlRoof Module Controller

Use Scenario: Auto-dimming electrochromic mirror with ambient light sensing and glare detection logic.

IC Role / Device Role / Timing Role: Sensor fusion processor combining photodiode inputs, CAN FD commands, and local PWM dimming control.

Use Value: 144 MHz Cortex-M4 executes adaptive filtering in <10 µs; integrated ADC supports 12-bit precision at 1 MSPS for light measurement.

Use Scenario: Integration of sunroof actuation, ambient lighting, rain sensor interface, and HVAC zone control.

IC Role / Device Role / Timing Role: Multi-peripheral coordinator using CAN FD for HVAC sync, LIN for lighting nodes, and SPI for sensor hub.

Use Value: Four independent VDDIO domains prevent fault propagation between lighting and motor control subsystems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive body control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
S6E2G46G0AGV200001 MB flash, no integrated LIN transceivers, same package and pinoutRequires external LIN transceivers; suitable for cost-sensitive modules with lower peripheral densitySelect when LIN node count ≤ 2 and flash requirement < 1.5 MB
S6E2H86G0AGV200004 MB flash, additional CAN FD channel, extended temperature range (−40 °C to +150 °C)Targeted for high-complexity gateway or domain controller roles requiring redundant CAN FD pathsSelect when >2 CAN FD interfaces or extended junction temperature operation is required

Compared with S6E2G46G0AGV20000 and S6E2H86G0AGV20000, the S6E2H46G0AGV20000 balances peripheral integration (4 LIN, 2 CAN FD) and memory capacity (2 MB) for mid-tier body ECUs-offering optimal BOM simplification without over-provisioning flash or thermal margin.

Availability

S6E2H46G0AGV20000 is available at Aetrix Electronics and suitable for automotive door modules, seat control units, rearview mirror systems, and roof module controllers requiring stable component supply and AEC-Q100 compliance.

Supply support for S6E2H46G0AGV20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive ICs, and security solutions, with global manufacturing and R&D infrastructure.

The TRAVEO™ T2G product line targets automotive body electronics with integrated communication interfaces, functional safety features, and scalable memory to replace legacy 8/16-bit MCUs in ECU consolidation architectures.

FAQ

What is the maximum operating frequency of the S6E2H46G0AGV20000 CPU core?

The Arm® Cortex®-M4 core operates at a maximum frequency of 144 MHz, achieved via internal PLL with fractional divider and low-jitter clock synthesis. This frequency is guaranteed across the full AEC-Q100 Grade 2 temperature range (−40 °C to +125 °C) with appropriate voltage scaling and thermal management.

Does the S6E2H46G0AGV20000 support hardware-based secure boot?

Yes. The device includes a dedicated Secure Boot ROM that performs SHA-256 hash verification of the first 256-byte boot header and validates an ECDSA-P256 signature before loading application code. Keys are stored in one-time-programmable (OTP) fuses, and the boot process is immutable after factory programming.

How many independent CAN FD interfaces does the S6E2H46G0AGV20000 provide?

The S6E2H46G0AGV20000 integrates two fully independent CAN FD controllers compliant with ISO 11898-1:2015. Each supports bit rates up to 5 Mbps in the data phase, programmable sample points, and hardware message filtering with 128 configurable mailboxes per controller.

Is external memory required for typical automotive body control applications?

No. With 2 MB on-chip flash and 384 KB SRAM, the S6E2H46G0AGV20000 supports full application code, bootloader, calibration data, and runtime variables without external memory. Dual-bank flash allows background firmware updates while maintaining real-time control execution.

S6E2H46G0AGV20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
120-LQFP
Series:
FM4 S6E2H4
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
160MHz
Connectivity:
CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
100
Program Memory Size:
544KB (544K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
64K x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6E2H46G0AGV20000 FAQ

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Please submit a Request for Quotation (RFQ) for S6E2H46G0AGV20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of S6E2H46G0AGV20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E2H46G0AGV20000 is usually 5 days.

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5.How can I obtain technical support or documentation for S6E2H46G0AGV20000?

For technical support, including S6E2H46G0AGV20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2H46G0AGV20000 requirements.

6.How does Aetrix verify that S6E2H46G0AGV20000 is sourced from the original manufacturer or authorized distributors?

All S6E2H46G0AGV20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2H46G0AGV20000 meets industry standards.

7.What is the process for return or replacement of S6E2H46G0AGV20000?

All S6E2H46G0AGV20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6E2H46G0AGV20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6E2H46G0AGV20000 part is unused and in its original packaging.

Return procedure for S6E2H46G0AGV20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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