My Inquiry
My Account
Infineon Technologies S6E2HE6G0AGV2000M
- Part No.:
- S6E2HE6G0AGV2000M
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 120-LQFP
- Datasheet:
-
S6E2HE6G0AGV2000M.pdf
- Description:
- IC MCU 32BIT 544KB FLASH 120LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,132
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6E2HE6G0AGV2000M from Infineon Technologies (formerly Cypress) is a 32-bit ARM® Cortex®-M4F microcontroller with 512 KB MainFlash, 32 KB WorkFlash, and 64 KB on-chip SRAM (32 KB SRAM0 + 16 KB SRAM1 + 16 KB SRAM2). It operates up to 160 MHz, supports dual CAN channels, 24-channel 12-bit ADC, and 100 GPIOs in its 120-pin LQFP package - deployed in industrial motor control and automotive body electronics.
For engineers reviewing the S6E2HE6G0AGV2000M datasheet, S6E2HE6G0AGV2000M pinout, S6E2HE6G0AGV2000M application, or S6E2HE6G0AGV2000M equivalent, key selection criteria include real-time clock support, dual CAN interface timing compliance, DSTC-based DMA efficiency, and deep-standby RTC with RAM retention capability under 2.7–5.5 V supply.
Technical Context
This MCU implements an ARM Cortex-M4F core with hardware FPU and NVIC supporting 128 interrupt channels. Its peripheral set includes two independent CAN 2.0B controllers, eight multi-function serial interfaces (UART/CSIO/LIN/I²C), and a descriptor-based DSTC with 256 channels for zero-CPU-overhead data movement.
Clock architecture integrates five sources - 4–48 MHz main oscillator, 32.768 kHz sub-clock, 4 MHz high-speed CR, 100 kHz low-speed CR, and programmable PLL - enabling dynamic switching between performance and ultra-low-power modes including Deep Standby RTC with configurable RAM retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M4F with FPU, 160 MHz max operation - enables deterministic floating-point math for servo control loops. |
| MainFlash | 512 KB on-chip Flash - sufficient for dual-bank firmware updates and secure boot code storage. |
| SRAM | 64 KB total (32+16+16 KB banks) - supports segregated real-time task stacks and DMA buffers without contention. |
| CAN Channels | 2 × CAN 2.0B controllers - allows simultaneous chassis and powertrain network communication in automotive ECUs. |
| ADC | 24-channel 12-bit SAR ADC with hardware trigger synchronization - captures motor phase currents and temperature sensors concurrently. |
| Package | 120-pin LQFP (G0A suffix) - provides 100 GPIOs and full external bus interface (25-bit address, 16-bit data, NAND/SDRAM support). |
| Supply Range | 2.7 V to 5.5 V - compatible with 3.3 V and 5 V industrial bus domains without level-shifting. |
Pinout & Package
Package: 120-pin LQFP (G0A), 14 mm × 14 mm, 0.4 mm pitch, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply / Ground | Dedicated analog/digital power pins per bank - enables noise-isolated ADC reference and clean core voltage regulation. |
| XTAL1 / XTAL2 | Main crystal oscillator input/output | Supports 4–48 MHz fundamental-mode crystals - used for precise system clock generation and CAN bit-timing accuracy. |
| CRX0 / CRX1 | Sub-clock crystal input/output | Connects 32.768 kHz watch crystal - feeds RTC and low-power wake-up timer in Stop/Deep Standby modes. |
| CAN0_TX / CAN0_RX | CAN controller 0 differential signal pair | Direct connection to ISO 11898-compliant transceiver - no external logic required for standard CAN physical layer. |
| SWDIO / SWCLK | Serial Wire Debug interface | 2-pin JTAG/SWD port - enables non-intrusive debug, flash programming, and real-time trace via ETM. |
| VBAT | Backup power supply | Accepts 2.7–5.5 V - maintains RTC and 32-byte backup registers during main power loss. |
Key Features
| Feature | Design Value |
|---|---|
| DSTC (256 channels) | Offloads CPU from memory-to-peripheral transfers - enables concurrent ADC sampling, CAN message queuing, and SD card writes without interrupt latency. |
| Quadrature Position Counter (3 ch) | Dedicated hardware for encoder position tracking - eliminates software polling and delivers sub-microsecond edge capture for PMSM rotor alignment. |
| Deep Standby RTC mode | RTC runs with <1.5 µA current draw while retaining SRAM content - extends battery life in always-on telematics modules. |
| Flash Security Lock | Configurable read-out protection and secure boot enforcement - prevents firmware extraction and unauthorized reprogramming in field-deployed units. |
| CRC Accelerator | Hardware CRC-32 engine - validates firmware images and CAN message payloads in single-cycle operations, reducing CPU load by >90% vs. software CRC. |
Applications
| Industrial Motor Drive | Automotive Body Control Module |
|---|---|
Use Scenario: Closed-loop control of 3-phase BLDC motors in HVAC compressors and pump systems. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms using M4F FPU, synchronized PWM generation, and 24-channel ADC sampling at 1 µs intervals. Use Value: Enables <±0.5% speed regulation across 10:1 torque range with integrated QPRC and dual CAN for actuator feedback and diagnostics. | Use Scenario: Centralized lighting, window lift, and door lock control in entry-level vehicles. IC Role / Device Role / Timing Role: CAN gateway and local I/O manager - routes LIN commands to actuators and aggregates sensor status over CAN FD backbone. Use Value: Reduces BOM count by integrating 100 GPIOs, dual CAN, LIN transceiver support, and RTC-based timed wakeup from sleep mode. |
| Smart Grid Power Metering | Factory Automation PLC I/O Module |
Use Scenario: High-accuracy energy metering with harmonic analysis and tamper detection. IC Role / Device Role / Timing Role: Simultaneous sampling of 3-phase voltage/current via 24-channel ADC with hardware-triggered sequence, CRC-verified data logging to external NAND. Use Value: Achieves IEC 62053-21 Class 0.5S accuracy using on-chip 12-bit ADC with <1 LSB INL and DSTC-driven DMA to avoid CPU bottlenecks. | Use Scenario: Distributed digital I/O expansion node with protocol translation (Modbus RTU ↔ EtherCAT). IC Role / Device Role / Timing Role: Protocol bridge and real-time I/O scheduler - manages 64 discrete inputs/outputs with microsecond timestamping via Base Timer and QPRC. Use Value: Delivers deterministic <100 µs I/O update cycle using DSTC-linked UART/CSIO peripherals and hardware interrupt prioritization. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit ARM Cortex-M4F microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STM32H743VI | Higher clock (480 MHz), dual-core (Cortex-M7/M4), no integrated DSTC; uses standard DMA | Targets AI-edge inference + real-time control co-processing; lacks dedicated QPRC and LIN hardware | Select when needing >200 DMIPS or external DDR interface - not drop-in for CAN+QPRC motor control. |
| RZ/T2M R7S92200 | ARM Cortex-R4 + Cortex-A9 dual-core, 600 MHz, TSN Ethernet, no CAN; larger package (256-pin BGA) | Designed for motion control PLCs requiring time-sensitive networking - no CAN PHY or motor timer peripherals | Choose for deterministic multi-axis CNC coordination with IEEE 802.1AS time sync - not suitable for cost-sensitive CAN-based nodes. |
Compared with STM32H743VI and RZ/T2M, the S6E2HE6G0AGV2000M delivers optimized integration for CAN-based motor control with hardware QPRC, DSTC offload, and deep-standby RTC - offering lower BOM cost and smaller footprint than either alternative for industrial actuator applications.
Availability
S6E2HE6G0AGV2000M is available at Aetrix Electronics and suitable for industrial motor drives, automotive body control modules, smart grid metering, and factory automation I/O modules requiring stable component supply across extended product lifecycles.
Supply support for S6E2HE6G0AGV2000M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
The S6E2H Series belongs to Infineon's FM4 family of high-performance 32-bit microcontrollers, designed specifically for deterministic real-time control in motor drives, automotive ECUs, and industrial automation where CAN, precision timing, and low-power standby are critical.
FAQ
What is the maximum operating frequency and supported voltage range for S6E2HE6G0AGV2000M?
The S6E2HE6G0AGV2000M operates at up to 160 MHz with a supply voltage range of 2.7 V to 5.5 V across all I/O and core domains. This wide range supports direct interfacing with both 3.3 V logic and legacy 5 V industrial buses without external level shifters, and enables robust operation under brown-out conditions down to 2.7 V.
Does S6E2HE6G0AGV2000M support hardware-based real-time debugging and trace?
Yes - it integrates Serial Wire JTAG Debug Port (SWJ-DP) and Embedded Trace Macrocell (ETM), enabling non-intrusive instruction tracing, real-time variable monitoring, and cycle-accurate profiling. ETM supports instruction and data trace with configurable depth, essential for validating hard real-time behavior in motor control firmware.
How many CAN interfaces does S6E2HE6G0AGV2000M provide, and what protocol versions are supported?
The device integrates two independent CAN 2.0B controllers compliant with ISO 11898-1, supporting both standard (11-bit) and extended (29-bit) identifiers, programmable bit rates up to 1 Mbps, and hardware message filtering with 32 acceptance masks. No CAN FD support is included - only classical CAN 2.0B operation.
What low-power modes are available, and which retain RAM content?
S6E2HE6G0AGV2000M offers Sleep, Timer, RTC, Stop, Deep Standby RTC, and Deep Standby Stop modes. Deep Standby RTC retains full 64 KB SRAM content while drawing <1.5 µA; Deep Standby Stop retains SRAM only if configured with RAM retention enabled - both use VBAT to sustain RTC and backup registers during main power loss.
S6E2HE6G0AGV2000M Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 120-LQFP
- Series:
- FM4 S6E2H4
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M4F
- Core Size:
- 32-Bit
- Speed:
- 160MHz
- Connectivity:
- CSIO, EBI/EMI, I2C, LINbus, SD, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 100
- Program Memory Size:
- 544KB (544K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 24x12b; D/A 2x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6E2HE6G0AGV2000M FAQ
1.How can I place an order for S6E2HE6G0AGV2000M through Aetrix?
Please submit a Request for Quotation (RFQ) for S6E2HE6G0AGV2000M on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6E2HE6G0AGV2000M reliable?
The price and inventory of S6E2HE6G0AGV2000M are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6E2HE6G0AGV2000M is usually 5 days.
3.What payment methods are accepted for S6E2HE6G0AGV2000M?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6E2HE6G0AGV2000M transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6E2HE6G0AGV2000M?
S6E2HE6G0AGV2000M orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6E2HE6G0AGV2000M order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6E2HE6G0AGV2000M?
For technical support, including S6E2HE6G0AGV2000M datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6E2HE6G0AGV2000M requirements.
6.How does Aetrix verify that S6E2HE6G0AGV2000M is sourced from the original manufacturer or authorized distributors?
All S6E2HE6G0AGV2000M products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6E2HE6G0AGV2000M meets industry standards.
7.What is the process for return or replacement of S6E2HE6G0AGV2000M?
All S6E2HE6G0AGV2000M units undergo pre-shipment inspection (PSI). If there is an issue with S6E2HE6G0AGV2000M, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6E2HE6G0AGV2000M part is unused and in its original packaging.
Return procedure for S6E2HE6G0AGV2000M:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6E2HE6G0AGV2000M Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
