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Infineon Technologies S6J311DHACSE20000
- Part No.:
- S6J311DHACSE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
S6J311DHACSE20000.pdf
- Description:
- TRAVEO-55NM
- Quantity:
- Payment:
- Shipping:
Inventory:1,518
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Product details
Overview
S6J311DHACSE20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive-grade microcontroller based on the Arm® Cortex®-R5 CPU core, operating at up to 144 MHz with 3072 KB + 64 KB program flash, 192 KB system SRAM, and dual 12-bit ADCs (64 total channels). It integrates two CAN-FD controllers (1 Mbps), 22 multi-function serial channels (UART/I²C/CSIO/LIN), and supports in-vehicle body control modules requiring functional safety and real-time deterministic execution.
For engineers reviewing the S6J311DHACSE20000 datasheet, S6J311DHACSE20000 pinout, S6J311DHACSE20000 application, or S6J311DHACSE20000 equivalent, key selection criteria include CAN-FD channel count, flash/RAM partitioning, LEP176 package compatibility, RTC calibration via CR oscillator, and SHE security option status for automotive ASIL-B–capable designs.
Technical Context
The S6J311DHACSE20000 implements a dual-issue superscalar Arm v7/Thumb-2 Cortex-R5 core with 16 KB instruction and 16 KB data caches, SEC-DED ECC on TCM ports, and AXI master/slave interfaces for high-bandwidth peripheral access. Its memory subsystem includes 3072 KB + 64 KB program flash, 192 KB system SRAM, 64 KB TCRAM, and 64 KB backup RAM - all mapped to a deterministic memory map supporting lockstep-ready configurations.
Peripheral integration centers on real-time I/O control: two CAN-FD controllers (192 RX/32 TX message buffers per channel), 30 base timers (PWM/PPG/PWC/reload), six 32-bit free-run timers, and 22 configurable serial interfaces with 64-byte FIFOs and DMA support (ch.0–ch.7 only). Clock supervision monitors 4 MHz main crystal failure and auto-switches to 100 kHz CR oscillator with RTC calibration capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-R5, 144 MHz max - enables hard real-time deterministic execution for ASIL-B automotive control tasks |
| Flash Memory | 3072 KB + 64 KB program flash - supports dual-bank operation and secure firmware updates |
| RAM | 192 KB system SRAM + 64 KB TCRAM + 64 KB backup RAM - provides fast deterministic access and power-loss retention |
| CAN-FD | 2 channels, 1 Mbps, 192 RX/32 TX message buffers per channel - meets modern vehicle network bandwidth and diagnostic requirements |
| ADC | Two 12-bit successive-approximation units, 64 total channels - enables simultaneous sensor monitoring across body electronics |
| Package | LEP176 (176-pin LQFP with exposed thermal pad) - supports automotive thermal cycling and board-level reliability |
| Security | SHE (Secure Hardware Extension) disabled - allows customer-defined cryptographic key management without factory-provisioned keys |
Pinout & Package
Package: LEP176 - 176-pin low-profile quad flat package with exposed thermal pad, optimized for automotive under-hood thermal dissipation and reflow soldering reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VSS | Power supply and ground | 5 V single-supply input; internal 1.2 V regulator powers core logic - simplifies power tree design |
| XTAL_IN/XTAL_OUT | Main clock oscillator interface | 4 MHz crystal connection point; monitored by clock supervisor for fail-safe fallback to CR oscillator |
| CR_IN/CR_OUT | 100 kHz RC oscillator terminals | Provides RTC timing and clock redundancy; enables CR-based calibration of main oscillator drift |
| CAN0_TX/CAN0_RX | CAN-FD Channel 0 differential signal pair | Direct connection to external CAN transceiver; supports ISO 11898-1 physical layer compliance |
| PA0–PA149 | General-purpose I/O ports | 150-channel GPIO with I/O relocation - permits PCB layout optimization without firmware changes |
Key Features
| Feature | Design Value |
|---|---|
| Dual CAN-FD controllers | Enables concurrent high-speed diagnostics (CAN-FD) and legacy ECU communication on separate buses |
| RTC with CR oscillator calibration | Compensates for crystal aging and temperature drift using ratio-based prescaler adjustment |
| 16-channel DMA with FIFO support | Offloads CPU from serial peripheral transfers (UART/I²C/CSIO/LIN), preserving real-time latency |
| Hardware watchdog + software watchdog | Provides layered reset supervision: hardware detects clock stall; software validates application state |
| I/O relocation capability | Allows dynamic remapping of peripheral functions to alternate pins - improves routing flexibility and noise immunity |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
Use Scenario: Centralized management of lighting, window lift, mirror adjustment, and door lock actuation in passenger vehicles. IC Role / Device Role / Timing Role: Real-time deterministic MCU executing ASIL-B–compliant control loops with CAN-FD diagnostics and LIN sub-network bridging. Use Value: Dual CAN-FD channels enable simultaneous communication with gateway and domain ECUs; 64-channel ADC supports direct analog sensor interfacing (e.g., rain/light sensors). | Use Scenario: Local control of power windows, side mirrors, and anti-pinch detection in front/rear doors. IC Role / Device Role / Timing Role: Safety-aware motor controller with PWM-driven H-bridge gate drivers and real-time current sensing via integrated ADC. Use Value: 30 base timers provide precise PWM generation and PPG edge timing; 12-channel input capture enables accurate motor position feedback from Hall sensors. |
| Roof Module Controller | Seat Control Unit |
Use Scenario: Integrated control of sunroof, panoramic roof, ambient lighting, and HVAC actuators in premium vehicle cabins. IC Role / Device Role / Timing Role: Multi-interface coordinator managing I²C-connected RGB LEDs, UART-linked HVAC sensors, and CSIO-driven motor drivers. Use Value: 22 multi-function serial channels allow concurrent full-duplex communication across heterogeneous peripherals without external bridge ICs. | Use Scenario: Position and heating control for power-adjustable driver/passenger seats with memory function and occupant detection. IC Role / Device Role / Timing Role: Sensor fusion hub aggregating seat position potentiometers, seat occupancy capacitive sensors, and heater thermistors. Use Value: Dual 12-bit ADCs with 64 total channels enable simultaneous sampling of 8+ analog inputs; backup RAM retains seat position profiles during ignition-off. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S6J311EHACSE20000 | 4096 KB + 64 KB program flash, 256 KB system SRAM, SHE security enabled | Required where secure boot, cryptographic acceleration, or OEM key provisioning is mandated | Select when ASIL-B certification requires hardware-enforced secure boot and key storage |
| R7F701684 | Renesas RH850/F1L core, 120 MHz, 2 MB flash, no CAN-FD, LIN-only serial interface | Limited to legacy LIN-based body networks without CAN-FD upgrade path | Choose only for cost-sensitive LIN-only modules where CAN-FD bandwidth is unnecessary |
Compared with S6J311EHACSE20000, this part trades flash capacity and SHE for lower BOM cost and reduced security overhead; versus R7F701684, it delivers CAN-FD readiness and higher ADC channel count but requires more complex power sequencing and thermal management.
Availability
S6J311DHACSE20000 is available at Aetrix Electronics and suitable for body control modules, door module controllers, roof module controllers, and seat control units requiring stable component supply across automotive production lifecycles.
Supply support for S6J311DHACSE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, automotive MCUs, and security solutions for industrial and transportation markets.
The TRAVEO™ T1G family - including the S6J3110 series - was designed specifically for automotive body electronics requiring ASIL-B compliance, CAN-FD connectivity, and robust real-time performance in extended temperature environments.
FAQ
What is the maximum operating frequency and supported voltage range?
The S6J311DHACSE20000 operates at up to 144 MHz with a single 5 V ±10% supply. Internal regulation generates 1.2 V for the core, while I/O circuits run directly from 5 V. Absolute maximum ratings specify VDD = 5.5 V and operating temperature from −40 °C to +125 °C ambient, validated per AEC-Q100 Grade 2.
Does this part support JTAG debugging and flash programming?
Yes - the device supports standard JTAG interface (TCK/TMS/TDI/TDO/nTRST) for boundary scan, debug, and flash programming. Pin assignment confirms dedicated JTAG signals on Port 0, and the datasheet specifies JTAG tool connection procedures including voltage level matching and pull-up resistor requirements.
How many CAN-FD message buffers are allocated per channel?
Each of the two CAN-FD channels provides 192 message buffers for reception and 32 message buffers for transmission. Buffer allocation is configurable via register settings, and the hardware supports automatic message filtering, priority arbitration, and error frame handling per ISO 11898-1:2015.
Is RTC calibration supported, and how is it implemented?
Yes - RTC calibration uses the 100 kHz CR oscillator as reference to correct drift in the main 4 MHz crystal oscillator. The calibration ratio is computed in firmware and applied to the RTC prescaler register, enabling ±1 ppm accuracy over temperature and aging - documented in Section 1.4.3 and Section 10.9 of the datasheet.
S6J311DHACSE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5
- Core Size:
- 32-Bit
- Speed:
- 144MHz
- Connectivity:
- CANbus, CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, LVD, POR, PWM, WDT
- Number of I/O:
- 116
- Program Memory Size:
- 3MB (3M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 320K x 8
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.25V
- Data Converters:
- A/D 56x12b SAR
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J311DHACSE20000 FAQ
1.How can I place an order for S6J311DHACSE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J311DHACSE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J311DHACSE20000 reliable?
The price and inventory of S6J311DHACSE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J311DHACSE20000 is usually 5 days.
3.What payment methods are accepted for S6J311DHACSE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J311DHACSE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J311DHACSE20000?
S6J311DHACSE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J311DHACSE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J311DHACSE20000?
For technical support, including S6J311DHACSE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J311DHACSE20000 requirements.
6.How does Aetrix verify that S6J311DHACSE20000 is sourced from the original manufacturer or authorized distributors?
All S6J311DHACSE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J311DHACSE20000 meets industry standards.
7.What is the process for return or replacement of S6J311DHACSE20000?
All S6J311DHACSE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J311DHACSE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J311DHACSE20000 part is unused and in its original packaging.
Return procedure for S6J311DHACSE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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