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Infineon Technologies S6J311EHBCSE20000

Part No.:
S6J311EHBCSE20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
176-LQFP Exposed Pad
Datasheet:
AetrixS6J311EHBCSE20000.pdf
Description:
TRAVEO-55NM
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,767

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Product details

Overview

S6J311EHBCSE20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive-grade microcontroller based on the Arm® Cortex®-R5 CPU core, featuring 4096 KB + 64 KB program flash, 256 KB system SRAM, and dual CAN-FD controllers. It operates at up to 144 MHz, integrates hardware/software watchdogs, RTC with CR clock calibration, and supports LIN 2.1 and 22-channel multi-function serial interfaces for in-vehicle body control modules.

For engineers reviewing the S6J311EHBCSE20000 datasheet, S6J311EHBCSE20000 pinout, S6J311EHBCSE20000 application, or S6J311EHBCSE20000 equivalent, key selection criteria include its 144 MHz Cortex-R5 real-time performance, dual CAN-FD (1 Mbps, 192 Rx buffers/channel), 12-bit dual A/D converters (64 total channels), ECC-protected TCM ports, and LEP176 package compatibility with automotive ASIL-B functional safety requirements.

Technical Context

The S6J311EHBCSE20000 implements a dual-issue superscalar 8-stage Cortex-R5 core with Thumb-2 instruction set, MPU (16 regions), and SEC-DED ECC on TCM ports. It uses a 55 nm CMOS process and runs from a single 5 V supply, internally generating 1.2 V for core logic.

Its peripheral subsystem includes two independent CAN-FD controllers compliant with ISO 11898-1:2015 (v3.2.0), 22 configurable serial channels (UART/LIN/I²C/CSIO), and a 30-channel base timer supporting PWM, PPG, PWC, and reload modes - all synchronized to a 4 MHz main oscillator or calibrated 100 kHz CR clock.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-R5, 144 MHz max operation, 2-instruction superscalar, 8-stage pipeline
Flash Memory4096 KB + 64 KB program flash + 112 KB work flash - enables secure OTA update partitioning
RAM64 KB TCRAM (ECC-protected), 256 KB system SRAM, 64 KB backup RAM - supports ASIL-B runtime integrity
CAN-FD2 channels, 1 Mbps data rate, 192 Rx / 32 Tx message buffers per channel - meets automotive ECU gateway bandwidth needs
A/D ConverterTwo 12-bit successive-approximation units, 32+32 channels total - supports simultaneous sensor monitoring in body control units
PackageLEP176 (176-pin LQFP with exposed thermal pad) - qualified for -40°C to +125°C automotive ambient
SecurityHardware SHE (Secure Hardware Extension), JTAG/test port lock, unique device ID - enables ISO/SAE 21434-compliant secure boot

Pinout & Package

Package: LEP176 - 176-pin low-profile quad flat package with exposed thermal pad, designed for automotive under-hood applications requiring high thermal reliability and mechanical robustness.

Pin/TerminalCircuit RoleDesign Meaning
VDDIO_0–VDDIO_15I/O Power Supply16 independent 5 V I/O rails - enable voltage domain isolation for mixed-signal interfacing
VDDCORECore Power SupplyInternal 1.2 V rail generated from 5 V input - decoupled for low-noise Cortex-R5 operation
XTAL_IN / XTAL_OUTMain Clock Oscillator4 MHz crystal interface - primary timing source for real-time control loops and CAN-FD bit timing
CRIN / CROUTCalibrated RC Oscillator100 kHz internal RC clock - used for RTC and fail-safe clock switching during crystal fault
CAN0_TX / CAN0_RXCAN-FD Channel 0 InterfaceDifferential signal pair - connects directly to ISO 11898-2 transceiver without level-shifting
CAN1_TX / CAN1_RXCAN-FD Channel 1 InterfaceDual-CAN redundancy support - enables gateway routing between powertrain and body networks
JTAG_TCK / TMS / TDI / TDODebug InterfaceIEEE 1149.1-compliant boundary scan - supports production programming and field diagnostics

Key Features

FeatureDesign Value
ECC on TCM portsSEC-DED error correction/detection on ATCM/BTCM - ensures deterministic execution in safety-critical code segments
Dual CAN-FD with 192 Rx buffersHardware message filtering and buffering - eliminates CPU polling overhead for high-load vehicle network traffic
CR clock calibrationRTC accuracy maintained via prescaler ratio adjustment against main oscillator - no external calibration component required
I/O relocationRuntime remapping of peripheral functions to alternate pins - simplifies PCB layout and enables pin-compatible variant reuse
Hardware SHE engineAccelerated AES-128, SHA-256, and key derivation - enables fast secure boot and firmware authentication within 100 ms

Applications

Body Control Module (BCM)Door Module Controller

Use Scenario: Centralized management of lighting, window lift, mirror adjustment, and door lock actuation in modern passenger vehicles.

IC Role / Device Role / Timing Role: Real-time coordinator executing deterministic control tasks using 144 MHz Cortex-R5 and 30-channel base timer PWM outputs.

Use Value: Dual CAN-FD interfaces allow concurrent communication with powertrain and infotainment networks while maintaining <10 µs interrupt latency for safety-critical door latch signals.

Use Scenario: Integrated control of power windows, side mirrors, and anti-pinch sensors in driver/passenger door assemblies.

IC Role / Device Role / Timing Role: Sensor fusion hub processing analog A/D inputs (potentiometers, current sense) and driving motor drivers via PWM/PPG timers.

Use Value: 64-channel 12-bit A/D converter enables simultaneous sampling of 8+ analog sensors; backup RAM retains position state during battery disconnect.

Roof Module ControllerSmart Junction Box

Use Scenario: Control of sunroof, panoramic roof, and ambient lighting with integrated LIN slave nodes for LED dimming.

IC Role / Device Role / Timing Role: LIN-UART master managing up to 16 slave devices while synchronizing motion profiles via free-run timer output compare.

Use Value: LIN 2.1 compliance ensures interoperability with OEM-standard lighting modules; CR-calibrated RTC maintains accurate time-based lighting schedules.

Use Scenario: High-density power distribution unit routing switched 12 V supplies to 20+ vehicle subsystems with load monitoring and short-circuit protection.

IC Role / Device Role / Timing Role: System supervisor using hardware watchdog, clock supervisor, and low-voltage detection to enforce safe power sequencing and fault recovery.

Use Value: Standby and partial wakeup modes reduce quiescent current to <50 µA; 5 V I/O tolerance eliminates need for external level shifters on legacy sensor interfaces.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R7F7016883AFP#AA032-bit RH850/U2A core, 200 MHz, 3 MB flash, single CAN-FD, no SHELacks hardware security extension and second CAN-FD channel - unsuitable for gateway or secure boot designsSelect only for cost-sensitive non-gateway ECUs where LIN-only networking suffices
SPC58EC80E3Power Architecture e200z4, 180 MHz, 4 MB flash, dual CAN-FD, no CR oscillator calibrationNo built-in RC clock calibration - requires external trimming or software compensation for RTC accuracyPrefer when existing toolchain investment in SPC5 Studio outweighs need for autonomous RTC calibration

Compared with R7F7016883AFP#AA0 and SPC58EC80E3, the S6J311EHBCSE20000 uniquely combines dual CAN-FD, hardware SHE, and CR clock calibration in a single LEP176 package - enabling compact, ASIL-B-compliant gateway and body controller designs without external timing or security components.

Availability

S6J311EHBCSE20000 is available at Aetrix Electronics and suitable for automotive body control modules, door module controllers, roof module controllers, and smart junction boxes requiring stable component supply across extended vehicle lifecycles.

Supply support for S6J311EHBCSE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, automotive MCUs, and security solutions for industrial and transportation markets.

The TRAVEO™ T1G family - including the S6J311EHBCSE20000 - was developed to deliver scalable, ASIL-B-capable microcontrollers for automotive body electronics, integrating real-time control, functional safety, and embedded security in a single die.

FAQ

What is the maximum operating temperature range for the S6J311EHBCSE20000?

The S6J311EHBCSE20000 is qualified for operation from -40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 2 requirements for under-hood automotive applications. Its LEP176 package includes an exposed thermal pad to enhance heat dissipation in sealed enclosures.

Does the S6J311EHBCSE20000 support JTAG debugging in production environments?

Yes - the device supports IEEE 1149.1 JTAG boundary scan via dedicated TCK/TMS/TDI/TDO pins. Debug access can be permanently disabled via Flash security fuse to prevent unauthorized firmware extraction in deployed ECUs.

How does the CR oscillator calibration function improve RTC accuracy?

The CR oscillator calibration adjusts the RTC prescaler dynamically using the ratio between the 4 MHz main crystal and the 100 kHz CR clock. This compensates for temperature-induced drift, achieving ±1.5 minutes/month RTC accuracy without external calibration components or factory trimming.

Can the S6J311EHBCSE20000 operate without an external crystal?

Yes - it can run entirely from the internal 100 kHz or 4 MHz CR oscillators. However, CAN-FD bit timing and high-precision real-time control require the 4 MHz crystal for guaranteed timing compliance; CR-only mode is limited to standby, diagnostics, or non-timing-critical functions.

S6J311EHBCSE20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
176-LQFP Exposed Pad
Series:
Traveo™ T1G
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-R5
Core Size:
32-Bit
Speed:
144MHz
Connectivity:
CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
116
Program Memory Size:
4MB (4M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
384K x 8
Voltage - Supply (Vcc/Vdd):
4.5V ~ 5.25V
Data Converters:
A/D 56x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6J311EHBCSE20000 FAQ

1.How can I place an order for S6J311EHBCSE20000 through Aetrix?

Please submit a Request for Quotation (RFQ) for S6J311EHBCSE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S6J311EHBCSE20000 reliable?

The price and inventory of S6J311EHBCSE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J311EHBCSE20000 is usually 5 days.

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Once your S6J311EHBCSE20000 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S6J311EHBCSE20000?

For technical support, including S6J311EHBCSE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J311EHBCSE20000 requirements.

6.How does Aetrix verify that S6J311EHBCSE20000 is sourced from the original manufacturer or authorized distributors?

All S6J311EHBCSE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J311EHBCSE20000 meets industry standards.

7.What is the process for return or replacement of S6J311EHBCSE20000?

All S6J311EHBCSE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J311EHBCSE20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6J311EHBCSE20000 part is unused and in its original packaging.

Return procedure for S6J311EHBCSE20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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