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Infineon Technologies S6J3129HBCSE2000A
- Part No.:
- S6J3129HBCSE2000A
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
S6J3129HBCSE2000A.pdf
- Description:
- TRAVEO-55NM
- Quantity:
- Payment:
- Shipping:
Inventory:4,412
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Product details
Overview
S6J3129HBCSE2000A from Infineon Technologies (formerly Cypress) is a 32-bit automotive-grade microcontroller based on the Arm® Cortex®-R5 CPU, featuring 768 KB + 64 KB flash, 48 KB TCRAM, CAN-FD up to 5 Mbps across 3 channels, and operation from −40 °C to +105 °C. It integrates dual 12-bit ADCs (50 total channels), 10 multi-function serial interfaces including LIN-UART v2.1, and LCD controller (32 seg × 4 com), targeting body control modules and gateway ECUs.
For engineers reviewing the S6J3129HBCSE2000A datasheet, S6J3129HBCSE2000A pinout, S6J3129HBCSE2000A application, or S6J3129HBCSE2000A equivalent, key selection criteria include CAN-FD channel count, ECC-protected TCM ports, LEU144 package compatibility, and SHE security option status - all confirmed in the official Infineon TRAVEO™ T1G documentation.
Technical Context
The S6J3129HBCSE2000A implements a dual-issue, 8-stage Armv7-based Cortex-R5 core with MPU support for 16 memory regions and SEC-DED ECC on both ATCM and BTCM ports. Its AXI master interface supports 64-bit instruction/data access and 32-bit I/O access, enabling deterministic real-time execution critical for ASIL-B–capable systems.
Peripheral integration includes three independent CAN-FD controllers (192 Rx/32 Tx message buffers per channel), a DDR HS-SPI interface for external flash/E2PROM, and hardware-accelerated CRC generation using CCITT-16 and IEEE-802.3 polynomials - all synchronized to a 128 MHz maximum CPU clock derived from a 4 MHz crystal with PLL multiplication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-R5, 32-bit, dual-issue superscalar, 8-stage pipeline - enables deterministic real-time task scheduling with low interrupt latency via VIC port. |
| Flash Memory | 768 KB + 64 KB program flash + 112 KB work flash - supports A/B firmware swapping and secure boot partitioning. |
| RAM | 48 KB TCRAM (ECC-protected), 16 KB system SRAM, 8 KB backup RAM - provides fault-tolerant data retention during low-power modes. |
| CAN-FD | 3 independent channels, 5 Mbps data rate, 40 MHz CAN clock - meets automotive gateway requirements for high-bandwidth node communication. |
| ADC | Dual 12-bit successive-approximation units: 22 + 28 channels total - enables simultaneous sensing of battery voltage, temperature, and position feedback in motor control. |
| Operating Temp | −40 °C to +105 °C ambient (Ta) - qualified for under-hood and chassis-mounted automotive applications per AEC-Q100 Grade 2. |
| Security | SHE (Secure Hardware Extension) enabled, JTAG/test port disabled, unique device ID - satisfies UNECE R155 CSMS cryptographic key management requirements. |
| Package | LEU144 (144-pin LQFP, 20 mm × 20 mm, 0.5 mm pitch) - supports standard automotive PCB assembly and thermal dissipation up to 1.8 W. |
Pinout & Package
Package: LEU144 - 144-pin LQFP, 20 mm × 20 mm body, 0.5 mm lead pitch, exposed thermal pad, RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC (Pins 125, 126, 130, 131, 135, 136, 140, 141) | Core & I/O power supply | 5 V ±10% input feeding internal 1.2 V regulator; multiple pins reduce IR drop and improve noise immunity in automotive harness environments. |
| VSS (Pins 1, 108, 109, 112, 113, 117, 118, 121, 122, 127, 128, 132, 133, 137, 138, 142, 143, 144) | Digital ground reference | 18 dedicated ground pins ensure stable return paths for high-speed peripherals (CAN-FD, SPI, UART) and minimize ground bounce. |
| RSTX (Pin 10) | Active-low reset input | Asynchronous reset assertion clears CPU state, peripherals, and clocks; compatible with external watchdog and power-supply supervisors. |
| X0/X1 (Pins 115/116) | Main crystal oscillator inputs | 4 MHz fundamental-mode quartz connection; supports failover to internal 100 kHz CR oscillator upon crystal fault detection. |
| TCK/TMS/TDI/TDO/TRST (Pins 119–123) | JTAG debug interface | IEEE 1149.1-compliant boundary-scan and on-chip debugging; TRST enables synchronous reset of JTAG logic independent of RSTX. |
| P401/P402 (Pins 105/106) | UART0 TX/RX | Full-duplex asynchronous serial interface with 64-byte FIFOs, parity/frame/overrun error detection, and DMA support - used for bootloader and diagnostics. |
| P313–P317 (Pins 101–104, 107) | CAN-FD Channel 0 signals | TX0 (P317), RX0 (P315), and associated termination control pins - routed with matched length for <100 ps skew at 5 Mbps bit rate. |
Key Features
| Feature | Design Value |
|---|---|
| ECC-protected TCM ports | SEC-DED error correction on ATCM/BTCM ensures runtime integrity of safety-critical code and stack data without software overhead. |
| Hardware CRC engine | Dedicated accelerator supporting CCITT-16 and IEEE-802.3 polynomials - offloads checksum computation from CPU for OTA firmware validation. |
| Flexible CAN-FD message buffering | 192 Rx / 32 Tx message buffers per channel with configurable ID filtering - enables concurrent handling of diagnostic, control, and sensor data streams. |
| Low-power mode granularity | Standby, power-off, and partial wakeup modes allow selective peripheral retention (e.g., RTC + CAN wake-up) while reducing current to <50 µA. |
| I/O relocation capability | Runtime remapping of peripheral functions to alternate GPIO pins - simplifies PCB layout and enables pin-compatible derivatives within S6J312x family. |
| LIN-UART v2.1 compliance | Integrated LIN protocol stack with synch break generation/detection and automatic baud rate adjustment - eliminates need for external LIN transceivers in slave nodes. |
Applications
| Body Control Module (BCM) | Door Module ECU |
|---|---|
|
Use Scenario: Centralized control of lighting, window lift, mirror adjustment, and door lock actuation in modern passenger vehicles. IC Role / Device Role / Timing Role: Main application MCU executing ASW-compliant control logic, managing LIN slaves (door handles, switches), and communicating via CAN-FD to gateway. Use Value: 112 GPIO channels enable direct drive of relays and LEDs; 3 CAN-FD channels support concurrent communication with gateway, instrument cluster, and powertrain networks. |
Use Scenario: Distributed control unit inside vehicle door housing window motor, anti-pinch sensor, and interior switch inputs. IC Role / Device Role / Timing Role: Real-time motor controller with PWM outputs, ADC sampling of current/voltage feedback, and LIN-UART interface to BCM. Use Value: Integrated stepping motor controller (4 channels, 8-/10-bit PWM) and dual 12-bit ADCs eliminate external driver ICs and reduce BOM cost by ≥$0.85/unit. |
| Instrument Cluster Display | Automotive Gateway |
|
Use Scenario: Driving information display with analog gauges, digital readouts, and warning indicators driven by stepper motors and LCD segments. IC Role / Device Role / Timing Role: Display controller with integrated LCD driver (32 seg × 4 com), sound generator (3-channel tone synthesis), and RTC for time/date display. Use Value: On-chip LCD controller reduces external component count; static drive mode (8 seg × 1 com) supports high-contrast segment displays without external bias generators. |
Use Scenario: High-speed bridge between CAN-FD, LIN, and Ethernet domains in zonal architecture vehicles. IC Role / Device Role / Timing Role: Protocol translation hub with 3 CAN-FD channels, 10 multi-function serial interfaces (including LIN-UART), and DDR HS-SPI for secure firmware storage. Use Value: 5 Mbps CAN-FD throughput and hardware CRC acceleration meet ISO 11898-1:2015 timing constraints for OTA update packet validation and routing latency <150 µs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Arm Cortex-M7 core, 3 MB flash, 512 KB RAM, no integrated LCD controller or stepping motor controller | Targeted at higher-performance ADAS domain controllers; lacks on-chip display/motor peripherals required for BCM/LCD use cases | Select when >200 MHz CPU performance and ASIL-D functional safety certification are mandatory; not drop-in for TRAVEO™ T1G pinout or peripheral set |
| Renesas RH850/F1K | 32-bit proprietary core, 2 MB flash, 384 KB RAM, CAN-FD only (no LIN-UART or HS-SPI), -40°C to +150°C rating | Engine control and transmission ECU focus; no SHE security or LCD interface - unsuitable for infotainment-adjacent modules | Prefer for powertrain applications requiring extended temperature range and ISO 26262 ASIL-D tool qualification; lacks TRAVEO™'s integrated human-machine interface features |
Compared with NXP S32K344 and Renesas RH850/F1K, the S6J3129HBCSE2000A delivers optimal balance of integrated HMI peripherals (LCD, sound, stepping motor), automotive security (SHE), and CAN-FD/LIN protocol stacks - making it uniquely suited for cost-sensitive, space-constrained body electronics where mixed-signal integration reduces system-level complexity.
Availability
S6J3129HBCSE2000A is available at Aetrix Electronics and suitable for automotive body control modules, door ECUs, instrument clusters, and gateway applications requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 2 qualification.
Supply support for S6J3129HBCSE2000A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D centers and wafer fabs in Dresden and Villach.
The TRAVEO™ T1G family - including S6J3129HBCSE2000A - was designed specifically for automotive body electronics and gateway applications requiring functional safety, embedded security, and mixed-signal integration in a single chip.
FAQ
What is the maximum operating frequency of the S6J3129HBCSE2000A CPU core?
The Arm Cortex-R5 core operates at a maximum frequency of 128 MHz, achieved via PLL multiplication of the 4 MHz main crystal oscillator. This frequency is validated across the full −40 °C to +105 °C temperature range and 4.5 V to 5.5 V supply voltage, with timing closure confirmed in the AC characteristics section of the datasheet (Rev. *J, Table 10.4.2).
Does the S6J3129HBCSE2000A support CAN FD ISO 11898-1:2015 physical layer compliance?
No - the S6J3129HBCSE2000A implements the CAN FD protocol stack (v3.2.0) and supports data rates up to 5 Mbps, but physical layer compliance requires an external CAN transceiver (e.g., Infineon TLE9251VS). The MCU provides only the protocol controller and message RAM; bus signaling is handled externally per ISO 11898-2/3 standards.
How is the SHE (Secure Hardware Extension) implemented in this part?
SHE is implemented as a dedicated hardware cryptographic module compliant with EVITA Medium specifications, supporting AES-128, SHA-256, and HMAC-SHA256 operations. It includes protected key storage, true random number generation, and secure boot verification - all enabled by the "HBC" suffix in the part number and configured via fuse settings during programming.
Can the LEU144 package be reflow soldered using standard lead-free JEDEC J-STD-020 profiles?
Yes - the LEU144 package is qualified for lead-free reflow per JEDEC J-STD-020D.3, with peak temperature ≤260 °C, time above liquidus 60–150 seconds, and ramp rate ≤3 °C/s. Thermal pad soldering requires ≥75% void-free coverage; recommended stencil aperture is 80% of pad area with 5×5 array of 0.25 mm diameter openings.
S6J3129HBCSE2000A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5
- Core Size:
- 32-Bit
- Speed:
- 4MHz
- Connectivity:
- CANbus, I2C, SPI, UART/USART
- Peripherals:
- DMA, PWM, WDT
- Number of I/O:
- 112
- Program Memory Size:
- 768KB (768K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 112K x 8
- RAM Size:
- 72K x 8
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.5V
- Data Converters:
- A/D 50x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J3129HBCSE2000A FAQ
1.How can I place an order for S6J3129HBCSE2000A through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J3129HBCSE2000A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J3129HBCSE2000A reliable?
The price and inventory of S6J3129HBCSE2000A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J3129HBCSE2000A is usually 5 days.
3.What payment methods are accepted for S6J3129HBCSE2000A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J3129HBCSE2000A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J3129HBCSE2000A?
S6J3129HBCSE2000A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J3129HBCSE2000A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J3129HBCSE2000A?
For technical support, including S6J3129HBCSE2000A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J3129HBCSE2000A requirements.
6.How does Aetrix verify that S6J3129HBCSE2000A is sourced from the original manufacturer or authorized distributors?
All S6J3129HBCSE2000A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J3129HBCSE2000A meets industry standards.
7.What is the process for return or replacement of S6J3129HBCSE2000A?
All S6J3129HBCSE2000A units undergo pre-shipment inspection (PSI). If there is an issue with S6J3129HBCSE2000A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J3129HBCSE2000A part is unused and in its original packaging.
Return procedure for S6J3129HBCSE2000A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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