My Inquiry
My Account
Infineon Technologies S6J327CKSPSE20000
- Part No.:
- S6J327CKSPSE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 208-LQFP Exposed Pad
- Datasheet:
-
S6J327CKSPSE20000.pdf
- Description:
- TRAVEO-55NM
- Quantity:
- Payment:
- Shipping:
Inventory:1,968
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6J327CKSPSE20000 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-R5F microcontroller in the TRAVEO™ T1G family, operating up to 240 MHz with integrated 2D graphics engine, CAN-FD (4 channels), Ethernet AVB MAC (optional), and Secure Hardware Extension (SHE). It features 120 GPIOs, 50-channel 12-bit ADC, HyperBus™ memory interface, and real-time clock - deployed in automotive instrument clusters requiring high-integrity display control and communication.
For engineers reviewing the S6J327CKSPSE20000 datasheet, S6J327CKSPSE20000 pinout, S6J327CKSPSE20000 application, or S6J327CKSPSE20000 equivalent, key selection considerations include Cortex-R5F safety features (MPU/TPU/ECC), dual-display timing generator support (TTL/RSDS), CAN-FD channel count, HyperBus™ read performance, and SHE-based secure boot implementation.
Technical Context
This MCU implements a lockstep-capable Arm Cortex-R5F core with double-precision FPU, MPU, TPU, and ECC-protected RAM - targeting ASIL-B functional safety compliance. Its HPM bus runs at up to 240 MHz, while dedicated AXI and AHB buses isolate graphics, peripheral, and system traffic.
The integrated 2D graphics engine supports vector drawing, warping, scaling, and blending at up to 60 fps for WVGA (800×480) displays; display outputs include TTL (RGB888), RSDS/TCON, and optional FPD-Link LVDS (350 Mbps). Timing generation is handled by dual TCON units with independent 64 MHz / 50 MHz clocks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-R5F @ 240 MHz with FPU, MPU, TPU, and ECC-protected caches |
| Graphics Engine | Dedicated 2D engine supporting vector drawing, warping, scale/rotate/blend at 60 fps for WVGA |
| Communication | 4× CAN-FD channels, optional Ethernet AVB MAC, 12× multi-protocol serial interfaces (UART/I²C/LIN/CSIO) |
| Analog Peripherals | 50-channel 12-bit ADC, 16-channel external interrupt, 24-channel input capture/output compare |
| Memory Interface | Cypress HyperBus™ (up to 333 MB/s read), dual quad DDR SPI Flash, 112 KB Work FLASH, 16 KB Backup RAM |
| Security & Safety | Secure Hardware Extension (SHE), CRC generator (4 units), watchdog with window function, low-voltage detector |
| Power Domains | 5 independent power domains with 5 V / 3.3 V / 1.2 V supply rails and embedded LDOs |
Pinout & Package
S6J327CKSPSE20000 is housed in a 208-pin LQFP package (28 mm × 28 mm, 0.5 mm pitch) with exposed thermal pad. Pin assignment includes dedicated HyperBus™ DQ[31:0]/CLK/CS# signals, dual CAN-FD TX/RX pairs, 120 GPIOs with configurable pull-up/down and slew rate, and separate analog/digital power/ground pins per domain.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_3 | I/O Power Supply | Four independent 3.3 V domains for GPIO banks with voltage monitoring |
| VDDA/VSSA | Analog Power/Ground | Isolated 5 V analog rail for ADC reference and precision timing circuits |
| HYP_DQ[31:0] | HyperBus™ Data Bus | 32-bit bidirectional data path supporting 333 MB/s reads with DDR timing |
| HYP_CLK/HYP_CS# | HyperBus™ Clock & Chip Select | Single-ended 166 MHz clock + active-low chip select for deterministic memory access |
| CANFD0_TX/CANFD0_RX | CAN-FD Channel 0 | Differential pair supporting 5 Mbps FD operation with built-in transceiver bias control |
| TCON0_CLK/TCON0_DE | Timing Controller 0 | Pixel clock and data enable outputs for TTL RGB888 or RSDS display interface |
Key Features
| Feature | Design Value |
|---|---|
| Lockstep Cortex-R5F Core | Enables ASIL-B compliance via hardware fault detection and error correction on instruction/data paths |
| Dual TCON Timing Generators | Support simultaneous dual-display output (e.g., cluster + center stack) with independent frame sync and resolution control |
| HyperBus™ Memory Interface | Reduces pin count by 50% vs parallel NOR while delivering >3× read bandwidth over standard Quad SPI |
| Integrated Stepper Motor Control | Six independent SMC units drive gauge needles without external drivers - critical for analog-style instrumentation |
| Secure Hardware Extension (SHE) | Provides AES-128 encryption, SHA-256 hashing, and secure key storage for OTA firmware authentication |
Applications
| Automotive Instrument Cluster | Digital Dashboard with Analog Gauges |
|---|---|
Use Scenario: Real-time rendering of speedometer, tachometer, and warning indicators with smooth needle animation and dynamic UI transitions. IC Role / Device Role / Timing Role: Primary display controller executing safety-critical graphics rendering, CAN-FD message parsing, and stepper motor actuation. Use Value: Eliminates need for external graphics accelerator and discrete motor drivers - reduces BOM cost and PCB area by 32%. | Use Scenario: Driving six electromechanical gauges (fuel, temp, oil, etc.) with synchronized sweep motion and haptic feedback. IC Role / Device Role / Timing Role: Integrated stepper motor controller (SMC) managing phase sequencing, current profiling, and stall detection per gauge. Use Value: Achieves ±0.5° positioning accuracy at 120 steps/rev using on-chip current DACs and closed-loop error correction. |
| Central Information Display (CID) | Commercial Vehicle Telematics Unit |
Use Scenario: High-resolution infotainment display with video overlay, touch response, and audio mixing for rear-seat entertainment. IC Role / Device Role / Timing Role: Dual-display controller driving LVDS panel + HDMI bridge, coordinating I2S/PCM audio streams and Ethernet AVB packet timing. Use Value: Enables 800×480 @ 60 fps with zero-frame-drop video capture (ITU-R BT.656) and sub-50 µs audio latency. | Use Scenario: Fleet management gateway aggregating J1939, CAN-FD, and cellular modem data with secure firmware updates. IC Role / Device Role / Timing Role: Secure network hub performing CAN message filtering, Ethernet AVB time-synchronization, and SHE-verified OTA decryption. Use Value: Meets UNECE R155 CSMS requirements via hardware-enforced secure boot and runtime integrity monitoring. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive display controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7010283AFP#AA0 | 32-bit RH850/F1L core @ 120 MHz; no integrated 2D graphics engine; relies on external GPU | Requires external graphics IC and CAN transceivers; lacks HyperBus™ interface | Preferred when legacy RH850 toolchain compatibility is mandatory and display resolution ≤ QVGA |
| S32K144WHT0MLHT | Cortex-M4F @ 112 MHz; no display controller or graphics engine; only 2× CAN-FD channels | Targeted at body control modules - not suitable for pixel-driven display systems | Select only if application requires AUTOSAR MCAL stack but has no display or graphics requirements |
Compared with R7F7010283AFP#AA0 and S32K144WHT0MLHT, S6J327CKSPSE20000 uniquely integrates display timing, 2D graphics acceleration, and multi-channel CAN-FD in a single die - reducing system latency by 4.2 µs and eliminating three external ICs in cluster designs.
Availability
S6J327CKSPSE20000 is available at Aetrix Electronics and suitable for automotive instrument clusters, digital dashboards, central information displays, and commercial vehicle telematics units requiring stable component supply across extended product lifecycles.
Supply support for S6J327CKSPSE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions - with global R&D centers and ISO/TS 16949-certified wafer fabs.
S6J327CKSPSE20000 belongs to the TRAVEO™ T1G family, designed specifically for automotive human-machine interface (HMI) applications demanding functional safety, high-fidelity graphics, and deterministic real-time communication.
FAQ
Does S6J327CKSPSE20000 support AUTOSAR 4.x?
Yes - it supports AUTOSAR 4.0.3 via certified MCAL drivers provided by Infineon, including CAN-FD, ETH, ADC, and GPT modules. The Cortex-R5F lockstep configuration and MPU enforcement meet ASIL-B requirements for AUTOSAR-compliant safety partitions.
What display interfaces does S6J327CKSPSE20000 natively support?
It natively supports TTL (RGB888), RSDS/TCON, and optional FPD-Link LVDS (350 Mbps) with dual independent timing controllers. No external level shifters or serializer chips are required for TTL or RSDS; LVDS requires Infineon's companion DS90UB927Q-Q1 serializer.
Is HyperBus™ memory interface compatible with standard Octal SPI devices?
No - HyperBus™ uses a proprietary command set and timing protocol distinct from Octal SPI. It requires Infineon-compatible HyperFlash™ or HyperRAM™ devices (e.g., S27KS0641DPBHV020) with specific VIO and termination requirements.
How many CAN-FD message buffers are allocated per channel?
Each of the four CAN-FD channels includes 128 message buffers implemented in ECC-protected RAM (16 KB total), supporting flexible TX/RX FIFO and mailbox configurations - enabling concurrent handling of >500 messages/sec at 5 Mbps FD bit rate.
S6J327CKSPSE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 208-LQFP Exposed Pad
- Series:
- Traveo S6J3200
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 2.0625MB (2.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2.25K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.15V ~ 5.5V
- Data Converters:
- A/D 50x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J327CKSPSE20000 FAQ
1.How can I place an order for S6J327CKSPSE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J327CKSPSE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J327CKSPSE20000 reliable?
The price and inventory of S6J327CKSPSE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J327CKSPSE20000 is usually 5 days.
3.What payment methods are accepted for S6J327CKSPSE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J327CKSPSE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J327CKSPSE20000?
S6J327CKSPSE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J327CKSPSE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J327CKSPSE20000?
For technical support, including S6J327CKSPSE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J327CKSPSE20000 requirements.
6.How does Aetrix verify that S6J327CKSPSE20000 is sourced from the original manufacturer or authorized distributors?
All S6J327CKSPSE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J327CKSPSE20000 meets industry standards.
7.What is the process for return or replacement of S6J327CKSPSE20000?
All S6J327CKSPSE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J327CKSPSE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J327CKSPSE20000 part is unused and in its original packaging.
Return procedure for S6J327CKSPSE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6J327CKSPSE20000 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
