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Infineon Technologies S6J329CKUPSE20000
- Part No.:
- S6J329CKUPSE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 208-LQFP Exposed Pad
- Datasheet:
-
S6J329CKUPSE20000.pdf
- Description:
- TRAVEO-55NM
- Quantity:
- Payment:
- Shipping:
Inventory:1,795
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Product details
Overview
S6J329CKUPSE20000 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-R5F microcontroller operating at up to 240 MHz, featuring integrated 2D/3D graphics engines, Ethernet AVB MAC, four CAN-FD channels, and Secure Hardware Extension (SHE) for automotive HMI systems. It supports HyperBus™ memory interface, 50-channel 12-bit ADC, and 120 GPIOs.
For engineers reviewing the S6J329CKUPSE20000 datasheet, S6J329CKUPSE20000 pinout, S6J329CKUPSE20000 application, or S6J329CKUPSE20000 equivalent, key selection criteria include real-time safety features (MPU, TPU, ECC), dual-display timing control (TCON), FPD-Link LVDS output (350 Mbps), and AUTOSAR 4.0.3 compliance for functional safety-critical dashboard systems.
Technical Context
This MCU implements a dual-core lockstep-capable Arm Cortex-R5F with double-precision FPU, hardware memory protection (MPU/TPU), and ECC-protected RAM (16 KB/ch per CAN-FD channel). Its clock system includes four PLLs with SSCG support and independent clock supervisors for all source clocks.
The graphics subsystem integrates a dedicated 2D engine with vector drawing, warping, and blend support plus optional 3D engine - both clocked independently (64 MHz ch.0 / 50 MHz ch.1) and synchronized to display outputs targeting WVGA (800×480) at 60 fps.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-R5F, 240 MHz max - deterministic real-time execution with lockstep capability for ASIL-B compliance. |
| Graphics Engine | Integrated 2D engine + optional 3D engine - enables GUI rendering without external GPU, reducing BOM cost in instrument clusters. |
| Communication | 4× CAN-FD + Ethernet AVB MAC - supports time-synchronized diagnostics and audio/video streaming in vehicle networks. |
| Analog Peripherals | 50-channel 12-bit ADC + 24-channel input capture - suitable for multi-sensor fusion in body control modules. |
| Security | Secure Hardware Extension (SHE) + ECC RAM + CRC generator - meets ISO 21434 cybersecurity requirements for secure boot and firmware updates. |
| Memory Interface | Cypress HyperBus™ + Dual Quad SPI Flash - achieves >300 MB/s read throughput with 12-pin interface, replacing parallel NOR flash. |
| Display Outputs | TTL/RSDS + optional FPD-Link LVDS (350 Mbps) - drives dual displays (e.g., cluster + center stack) with independent timing generators. |
Pinout & Package
Package: 208-pin LQFP (28 × 28 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_3V3 | I/O power supply | Supplies 3.3 V ±0.3 V to GPIO banks and serial interfaces (UART/I²C/CAN-FD). |
| VDDA_5V | Analog power supply | Provides 5.0 V ±0.5 V to ADC reference and analog front-end circuits. |
| XTAL_IN / XTAL_OUT | Crystal oscillator input/output | Supports 1–20 MHz external crystal for precise RTC and system clock generation. |
| ETH_AVB_RXD[3:0] | Ethernet AVB receive data | 4-bit RMII interface for time-sensitive audio/video packet reception with IEEE 802.1AS timestamping. |
| CANFD0_TX / CANFD0_RX | CAN-FD Channel 0 differential pair | High-speed (5 Mbps) fault-tolerant bus interface compliant with ISO 11898-1:2015. |
| LVDS_CLK_P/N | FPD-Link LVDS clock differential pair | Transmits 350 Mbps pixel clock for high-resolution TFT displays with EMI-reduced signaling. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-display timing control (TCON) | Independent frame synchronization for two displays (e.g., digital cluster + infotainment), eliminating external TCON IC. |
| Stepper motor controller (SMC) | Six independent units drive analog gauges with microstepping and position feedback - replaces discrete motor drivers in instrument panels. |
| HyperBus™ memory interface | 12-pin, DDR interface achieving >300 MB/s read bandwidth - cuts PCB layer count vs. parallel NOR flash solutions. |
| AUTOSAR 4.0.3 support | Pre-integrated MCAL drivers and OS abstraction layer - reduces AUTOSAR integration effort by ~40% for Tier 1 suppliers. |
| Low-latency interrupt response | Sub-100 ns wake-up from sleep mode with configurable priority levels - critical for real-time gauge needle updates. |
Applications
| Digital Instrument Cluster | Automotive Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of speed, RPM, warning icons, and ADAS alerts on TFT-LCD with 60 fps refresh. IC Role / Device Role / Timing Role: Primary graphics controller and safety monitor - executes ASIL-B software while driving dual-display TCON and LVDS outputs. Use Value: Eliminates external GPU and display controller; integrated SHE enables secure OTA updates of cluster firmware. | Use Scenario: Projection of navigation guidance and speed overlay onto windshield via DLP or LCoS optics. IC Role / Device Role / Timing Role: Graphics processor and video capture unit - processes camera feed (ITU656/YCbCr4:2:2) and overlays vector-rendered UI elements. Use Value: On-chip 2D warping and scaling reduce optical calibration complexity; FPD-Link LVDS ensures jitter-free pixel transmission. |
| Central Information Display (CID) | Body Control Module (BCM) with HMI |
Use Scenario: Multi-touch GUI with media playback, climate control, and vehicle settings on 10.25″ WVGA display. IC Role / Device Role / Timing Role: Application processor and multimedia hub - runs Linux-based HMI stack while managing I²S audio, CAN-FD comms, and HyperBus flash. Use Value: Integrated stereo DAC and sound mixer enable premium audio feedback without external codec; dual-display support allows split-screen operation. | Use Scenario: Integration of door lock, lighting, window lift, and seat position controls with status visualization. IC Role / Device Role / Timing Role: Real-time control unit with sensor fusion - reads 50-channel ADC for ambient light/temperature, processes LIN/UART commands, and drives stepper gauges. Use Value: 120 GPIOs and six SMC units consolidate multiple discrete controllers; low-voltage detection ensures fail-safe shutdown during battery brownout. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive graphics MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7010283AFP#AA0 (Renesas RH850/F1K) | 32-bit RXv2 core (160 MHz), no integrated 2D/3D graphics engine, supports CAN-FD but lacks Ethernet AVB. | Targeted at non-graphic intensive body control; requires external GPU for display rendering. | Select when display functionality is minimal and CAN-FD + LIN dominance is required over graphics performance. |
| TC377TP-64F200N (Infineon AURIX™ TC3xx) | Tri-core TriCore™ (200 MHz), ASIL-D capable, no HyperBus or FPD-Link LVDS, stronger safety certification out-of-box. | Focused on powertrain and chassis control; not optimized for high-resolution GUI rendering or multimedia. | Select for safety-critical powertrain applications where graphics are secondary and ISO 26262 ASIL-D certification is mandatory. |
Compared with R7F7010283AFP#AA0 and TC377TP-64F200N, S6J329CKUPSE20000 uniquely balances real-time safety (ASIL-B), embedded graphics acceleration, and automotive networking - making it optimal for cost-sensitive digital clusters requiring <100 ms GUI latency and dual-display support.
Availability
S6J329CKUPSE20000 is available at Aetrix Electronics and suitable for digital instrument clusters, automotive head-up displays, central information displays, and body control modules requiring stable component supply across extended automotive lifecycles.
Supply support for S6J329CKUPSE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security ICs, with global R&D and manufacturing infrastructure.
The TRAVEO™ T1G family - including S6J329CKUPSE20000 - was designed specifically for automotive human-machine interface applications demanding integrated graphics, functional safety, and high-bandwidth automotive networking.
FAQ
What is the maximum operating frequency of the Arm Cortex-R5F core in S6J329CKUPSE20000?
The Arm Cortex-R5F core operates at up to 240 MHz under specified voltage and temperature conditions (VDD = 1.2 V ±0.1 V, TA = –40°C to +125°C). This frequency is achievable with PLL0 configured for core clock synthesis and validated across AC characteristics in the official datasheet (002-05682 Rev. *R, Section 8.4).
Does S6J329CKUPSE20000 support AUTOSAR-compliant software stacks?
Yes, S6J329CKUPSE20000 supports AUTOSAR 4.0.3 through pre-qualified MCAL drivers and OS abstraction layers provided by Infineon. These drivers cover CAN-FD, Ethernet AVB, ADC, and PWM peripherals, enabling seamless integration into AUTOSAR-based ECU development workflows.
What display interfaces does S6J329CKUPSE20000 natively support?
S6J329CKUPSE20000 natively supports TTL (RGB888), RSDS/TCON, and optional FPD-Link LVDS (350 Mbps) outputs. The TCON block provides independent timing control for dual displays, and LVDS output is implemented via dedicated differential pairs (LVDS_CLK_P/N, LVDS_DATA_P/N) verified in package pin assignment documentation.
Is HyperBus™ memory interface compatible with standard Octal SPI flash devices?
No, HyperBus™ is a proprietary Cypress/Infineon interface requiring HyperBus-compatible flash (e.g., S26KS512SDPBHI010). It is electrically and protocol-wise incompatible with standard Octal SPI or QSPI devices due to its DDR signaling, command set, and 12-pin physical layout (8 data + 2 clock + 2 control).
S6J329CKUPSE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 208-LQFP Exposed Pad
- Series:
- Traveo S6J3200
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 2.0625MB (2.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2.25K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.15V ~ 5.5V
- Data Converters:
- A/D 50x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J329CKUPSE20000 FAQ
1.How can I place an order for S6J329CKUPSE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J329CKUPSE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J329CKUPSE20000 reliable?
The price and inventory of S6J329CKUPSE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J329CKUPSE20000 is usually 5 days.
3.What payment methods are accepted for S6J329CKUPSE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J329CKUPSE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J329CKUPSE20000?
S6J329CKUPSE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J329CKUPSE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J329CKUPSE20000?
For technical support, including S6J329CKUPSE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J329CKUPSE20000 requirements.
6.How does Aetrix verify that S6J329CKUPSE20000 is sourced from the original manufacturer or authorized distributors?
All S6J329CKUPSE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J329CKUPSE20000 meets industry standards.
7.What is the process for return or replacement of S6J329CKUPSE20000?
All S6J329CKUPSE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J329CKUPSE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J329CKUPSE20000 part is unused and in its original packaging.
Return procedure for S6J329CKUPSE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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