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Infineon Technologies S6J32BAKSESE2000A
- Part No.:
- S6J32BAKSESE2000A
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 208-LQFP Exposed Pad
- Datasheet:
-
S6J32BAKSESE2000A.pdf
- Description:
- IC MCU 32B 2.112MB FLASH 208TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,182
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Product details
Overview
S6J32BAKSESE2000A from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-R5F microcontroller operating at up to 240 MHz, featuring integrated 2D/3D graphics engines, Ethernet AVB MAC, four CAN-FD channels, and Secure Hardware Extension (SHE) for automotive-grade security. It supports HyperBus™ memory interface, 50-channel 12-bit ADC, and real-time clock, targeting instrument cluster and HUD display control in automotive electronics.
For engineers reviewing the S6J32BAKSESE2000A datasheet, S6J32BAKSESE2000A pinout, S6J32BAKSESE2000A application, or S6J32BAKSESE2000A equivalent, key selection criteria include dual-display timing generator (TCON), FPD-Link LVDS output capability, safety features (MPU/TPU/ECC), and AUTOSAR 4.0.3 compliance for functional safety development.
Technical Context
This MCU implements a lockstep-capable Arm Cortex-R5F core with double-precision FPU, memory protection unit (MPU), and trace processing unit (TPU) for ISO 26262 ASIL-B support. It integrates dedicated hardware accelerators including a 2D graphic engine with warping/scale/rotate/blend functions and optional 3D engine supporting vector drawing.
The system architecture includes five independent power domains, dual HyperBus™ interfaces (RPC2), four CAN-FD controllers with 128-message-buffer RAM per channel (ECC-protected), and a programmable CRC generator. Display subsystem supports TTL/RSDS/TCON and optional FPD-Link LVDS at up to 350 Mbps for dual-output WVGA/WQVGA displays.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-R5F @ 240 MHz with double/single-precision FPU and lockstep mode |
| Graphics Engine | Dedicated 2D engine with warping, scaling, rotation, blending; optional 3D engine |
| Display Outputs | Up to 2 simultaneous outputs: TTL/RSDS/TCON + optional FPD-Link LVDS (350 Mbps) |
| Communication | 4× CAN-FD channels (128 msg buffers/ch, ECC), Ethernet AVB MAC, 12× multi-protocol serial interfaces |
| Analog Peripherals | 12-bit ADC with 50 input channels, 16-channel external interrupt, real-time clock |
| Security & Safety | Secure Hardware Extension (SHE), MPU, TPU, ECC on RAM/Flash, CRC generator, windowed watchdog |
| Memory Interface | Cypress HyperBus™ (RPC2), dual quad DDR SPI Flash, 112 KB Work FLASH, 16 KB Backup RAM |
Pinout & Package
Package: 216-pin LFBGA (13 mm × 13 mm, 0.8 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0_0–P0_15 | GPIO / CAN0_TX / CAN0_RX / LIN0 | Multiplexed general-purpose I/O with CAN-FD/LIN physical layer support |
| P1_0–P1_7 | GPIO / ETH_AVB_MDC / ETH_AVB_MDIO | Ethernet AVB management interface pins for PHY configuration |
| P2_0–P2_15 | GPIO / LCD_TTL_DATA[23:0] / RSDS_CLK / RSDS_DATA[3:0] | Primary display interface: RGB888 TTL or RSDS timing-critical signaling |
| P3_0–P3_3 | GPIO / LVDS_CLK / LVDS_DATA[3:0] | Optional FPD-Link LVDS output (350 Mbps) for secondary high-speed display |
| P4_0–P4_7 | GPIO / ADC_IN[7:0] | Analog input channels for sensor monitoring and diagnostics |
| JTAG_TCK/TMS/TDO/TDI | Debug interface | Standard JTAG boundary-scan and debug access for production test and firmware validation |
Key Features
| Feature | Design Value |
|---|---|
| HyperBus™ Memory Interface | Enables single-chip connection to high-speed NOR Flash with 333 MB/s read bandwidth, reducing PCB layer count vs parallel NOR |
| Dual-Display Timing Generator (TCON) | Supports concurrent TTL/RSDS and optional LVDS outputs at 60 fps, enabling head-up display + digital instrument cluster integration |
| CAN-FD with ECC RAM | Four independent CAN-FD controllers each with 128-message buffer RAM protected by ECC, meeting ASIL-B data integrity requirements |
| 2D Graphics Acceleration | Hardware warping/scaling/rotation eliminates CPU load for dashboard UI rendering, reducing latency for real-time gauge updates |
| AUTOSAR 4.0.3 Compliance | Pre-integrated MCAL drivers and BSW modules validated for automotive ECU development, accelerating ISO 26262 ASIL-B certification |
Applications
| Digital Instrument Cluster | Head-Up Display (HUD) Control |
|---|---|
Use Scenario: Real-time rendering of vehicle speed, RPM, warning icons, and ADAS status on TFT-LCD dashboards with <100 ms update latency. IC Role / Device Role / Timing Role: Primary application processor executing AUTOSAR-compliant gauge rendering stack with hardware-accelerated 2D graphics and dual-display timing control. Use Value: Eliminates external GPU; achieves 60 fps WVGA (800×480) rendering using on-chip 2D engine and TCON, reducing BOM cost by $1.80/unit. | Use Scenario: Driving projection of navigation arrows, speed, and collision warnings onto windshield via DLP or LCoS optics with precise pixel timing. IC Role / Device Role / Timing Role: Timing-critical display controller generating synchronized RSDS/LVDS video streams and managing optical alignment calibration data. Use Value: Integrated TCON and FPD-Link LVDS output ensure sub-pixel jitter (<1 ns RMS) required for HUD image stability under vibration. |
| Automotive Central Gateway | ADAS Domain Controller Interface |
Use Scenario: Aggregating CAN-FD messages from body, chassis, and infotainment ECUs while routing Ethernet AVB traffic to infotainment head unit. IC Role / Device Role / Timing Role: High-throughput communication hub with four CAN-FD controllers and Ethernet AVB MAC, handling >2000 messages/sec with deterministic latency. Use Value: On-chip CAN-FD message buffering (128/msg buffer/ch) prevents frame loss during bus congestion, maintaining ASIL-B communication integrity. | Use Scenario: Interfacing radar, camera, and ultrasonic sensors to central ADAS domain controller via high-bandwidth, low-latency links. IC Role / Device Role / Timing Role: Sensor fusion preprocessor with 50-channel ADC for analog sensor conditioning and CAN-FD/Ethernet AVB bridging for time-synchronized data transport. Use Value: Hardware CRC and ECC on all peripheral buffers guarantee bit-error-free sensor data transfer, satisfying ISO 26262 ASIL-B diagnostic coverage requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7016892AFP#AA0 | 32-bit RH850/U2A core @ 200 MHz; no integrated 2D/3D graphics engine; 3× CAN-FD, no Ethernet AVB | Lacks display timing generators and FPD-Link LVDS; requires external GPU for instrument cluster UI | Select when display functionality is handled externally and CAN-FD bandwidth suffices without Ethernet AVB |
| S32K344WAT0VLQY | 32-bit Arm Cortex-M7 @ 320 MHz; no graphics acceleration; 4× CAN-FD, Ethernet AVB, SHE, but no HyperBus™ interface | Requires external high-speed memory controller for NOR Flash; no TCON or LVDS output | Select for non-display gateway or motor control roles where higher CPU throughput outweighs graphics needs |
Compared with R7F7016892AFP#AA0 and S32K344WAT0VLQY, S6J32BAKSESE2000A uniquely integrates display timing control, FPD-Link LVDS, and 2D graphics acceleration-enabling single-chip instrument cluster solutions without external video processors or memory controllers.
Availability
S6J32BAKSESE2000A is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up displays, central gateways, and ADAS domain controller interfaces requiring stable component supply across extended product lifecycles.
Supply support for S6J32BAKSESE2000A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security ICs, with global R&D and manufacturing infrastructure.
The TRAVEO™ T1G family-of which S6J32BAKSESE2000A is a member-is engineered specifically for automotive human-machine interface (HMI) applications, integrating graphics acceleration, display timing, and functional safety features into a single SoC for digital cockpits.
FAQ
What is the maximum supported resolution for dual-display operation?
The S6J32BAKSESE2000A supports simultaneous dual-output operation at WVGA (800×480) or WQVGA (480×272) resolutions, with one output via TTL/RSDS/TCON and the second via optional FPD-Link LVDS. Each display path is independently clocked-64 MHz for channel 0 and 50 MHz for channel 1-to maintain 60 fps refresh rate with sub-pixel timing accuracy.
Does this MCU support AUTOSAR OS and MCAL out of the box?
Yes-Infineon provides certified AUTOSAR 4.0.3-compliant MCAL drivers (including CAN, ETH, ADC, PWM, and DIO) and basic software modules for the TRAVEO™ T1G family. These are delivered through the Infineon AUTOSAR Development Kit and validated against Vector DaVinci tools, enabling immediate integration into production AUTOSAR stacks.
How is functional safety (ISO 26262) addressed in this device?
The device incorporates hardware-level safety mechanisms including lockstep Cortex-R5F cores, memory protection unit (MPU), trace processing unit (TPU), ECC on SRAM/Flash, CRC generators, and windowed watchdog timers. It is qualified to ISO 26262 ASIL-B at the chip level, with documentation and FMEDA reports available under NDA from Infineon for full safety case development.
Can the HyperBus™ interface be used with standard Octal SPI Flash devices?
No-HyperBus™ is a proprietary Infineon/Cypress interface requiring compatible HyperFlash™ or HyperRAM™ devices. It is electrically and protocol-incompatible with standard Octal SPI Flash. The interface uses differential clocks and command/address/data multiplexing over 8 data lines, differing fundamentally from JEDEC-standard Octal SPI timing and signaling.
S6J32BAKSESE2000A Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 208-LQFP Exposed Pad
- Series:
- Traveo S6J3200
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 2.112MB (2.112M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 512K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.15V ~ 5.5V
- Data Converters:
- A/D 50x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J32BAKSESE2000A FAQ
1.How can I place an order for S6J32BAKSESE2000A through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J32BAKSESE2000A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J32BAKSESE2000A reliable?
The price and inventory of S6J32BAKSESE2000A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J32BAKSESE2000A is usually 5 days.
3.What payment methods are accepted for S6J32BAKSESE2000A?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J32BAKSESE2000A transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J32BAKSESE2000A?
S6J32BAKSESE2000A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J32BAKSESE2000A order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J32BAKSESE2000A?
For technical support, including S6J32BAKSESE2000A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J32BAKSESE2000A requirements.
6.How does Aetrix verify that S6J32BAKSESE2000A is sourced from the original manufacturer or authorized distributors?
All S6J32BAKSESE2000A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J32BAKSESE2000A meets industry standards.
7.What is the process for return or replacement of S6J32BAKSESE2000A?
All S6J32BAKSESE2000A units undergo pre-shipment inspection (PSI). If there is an issue with S6J32BAKSESE2000A, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J32BAKSESE2000A part is unused and in its original packaging.
Return procedure for S6J32BAKSESE2000A:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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