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Infineon Technologies S6J32EEKSNSE20000
- Part No.:
- S6J32EEKSNSE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 208-LQFP Exposed Pad
- Datasheet:
-
S6J32EEKSNSE20000.pdf
- Description:
- TRAVEO-55NM
- Quantity:
- Payment:
- Shipping:
Inventory:4,198
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Product details
Overview
S6J32EEKSNSE20000 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-R5F automotive microcontroller in the TRAVEO™ T1G family, designed for mid-range instrument clusters and HUD systems. It features a 240-MHz CPU, 4-MB Flash, 512-KB RAM, dual-display support (WVGA), on-the-fly warping, and embedded 4-channel CAN FD. Used in automotive digital cluster control with real-time gauge and TFT display driving.
For engineers reviewing the S6J32EEKSNSE20000 datasheet, S6J32EEKSNSE20000 pinout, S6J32EEKSNSE20000 application, or S6J32EEKSNSE20000 equivalent, key selection criteria include ASIL-B compliance, 2.5D graphics subsystem with 2-MB VRAM, Ethernet RMII interface, 50-channel 12-bit SAR ADC (1-Msps), and 216-pin TEQFP package compatibility.
Technical Context
This MCU implements a dual-domain power architecture with five configurable power domains and integrated LDOs supporting 1.2-V core, 2.7–3.6-V I/O, and 2.7–5.5-V supply ranges. Its clock system includes four PLLs (PLL0–PLL3) with SSCG capability and programmable dividers for CPU (240 MHz), graphics (200 MHz), and display (64/50 MHz) domains.
The device integrates a dedicated 2.5D graphics engine with hardware-accelerated warping, scaling, rotation, and blending - enabling real-time correction of windshield distortion in HUD applications. Video capture supports ITU-R BT.656, YCbCr4:2:2/4:4:4, and RGB formats at up to WVGA resolution.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-R5F with FPU, MPU, TPU, and dual-precision floating-point unit for deterministic real-time cluster control |
| Flash Memory | 4160 KB program Flash + 112 KB work Flash; 20-year retention for automotive lifecycle reliability |
| RAM | 128 KB TC-RAM + 384 KB system-RAM + 16 KB backup-RAM; ECC-enabled for safety-critical data |
| Graphics Engine | 2.5D subsystem with 2-MB VRAM, on-the-fly warping, and dual-TFT output (854×480 each) |
| ADC | 50-channel 12-bit SAR converter with 1-Msps sampling rate for analog sensor interfacing in cluster gauges |
| Communication | 4-channel CAN FD (128 message buffers/channel), 12-channel MFS, optional Ethernet RMII, HyperBus™, and Media-LB (MOST25) |
| Safety | ASIL-B compliant per ISO 26262; includes hardware watchdog timers, low-voltage detection, and optional SHE with AES-128 |
Pinout & Package
Supplied in a 216-pin Thin Enhanced Quad Flat Package (TEQFP) with 0.4-mm pitch, thermally enhanced for automotive under-hood operation. Pin assignment supports dual-display RGB888 outputs, RMII Ethernet, CAN FD transceivers, and 50 ADC input channels across dedicated analog banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P00–P07 | RGB888 Channel 0 Data Bus | Drive first TFT display at 854×480 @ 60 fps with TTL-level timing |
| P10–P17 | RGB888 Channel 1 Data Bus | Drive second independent TFT display or HUD projection path |
| P20–P23 | RMII Interface | Supports 50-MHz Ethernet AVB with MDC/MDIO management and CRS_DV signaling |
| P30–P33 | CAN FD Channel 0 | Dedicated TX/RX for high-speed vehicle network communication (up to 5 Mbps) |
| P40–P49 | ADC Input Group A | 10-channel analog front-end with programmable gain and sample-and-hold for gauge sensors |
| VDDA | Analog Power Supply | Separate 3.3-V rail for ADC and audio DAC to minimize noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly Warping Engine | Real-time pixel remapping for HUD image correction against windshield curvature without CPU overhead |
| Dual-Channel Stepper Motor Control | Direct drive for six analog gauges with microstepping, current regulation, and stall detection |
| Embedded Sound Subsystem | Integrated sound waveform generator, mixer, stereo DAC, and PCM-PWM for audible alerts and UI feedback |
| Hardware Security Extension (SHE) | AES-128 encryption/decryption acceleration with secure key storage for firmware authentication and OTA updates |
| Power Domain Control | Fine-grained shutdown of graphics, display, or communication subsystems to reduce active power in partial-operation modes |
Applications
| Instrument Cluster Control | Head-Up Display (HUD) |
|---|---|
Use Scenario: Digital dashboard with six analog gauges, warning lights, and multi-zone temperature display. IC Role / Device Role / Timing Role: Primary cluster controller managing gauge motors, TFT rendering, and CAN FD telemetry aggregation. Use Value: Integrated stepper motor controllers eliminate external driver ICs; 2.5D graphics engine renders dynamic speedometer sweeps and fuel animations at 60 fps. | Use Scenario: Projection-based HUD displaying speed, navigation, and ADAS alerts onto vehicle windshield. IC Role / Device Role / Timing Role: Graphics processor and display controller performing real-time warping, scaling, and dual-buffered overlay composition. Use Value: On-the-fly warping corrects optical distortion caused by windshield bulge, eliminating need for mechanical calibration or external FPGA. |
| Automotive Infotainment Gateway | ADAS Sensor Fusion Node |
Use Scenario: Mid-tier vehicle gateway aggregating audio, Bluetooth, USB, and CAN data for central HMI. IC Role / Device Role / Timing Role: High-bandwidth interface hub with MFS, I2S, and optional Media-LB for MOST25 audio backbone integration. Use Value: 12-channel MFS supports simultaneous UART, SPI, and I²C peripherals; stereo DAC enables local audio playback without external codec. | Use Scenario: Real-time fusion of radar, camera, and ultrasonic inputs for lane departure and blind-spot detection. IC Role / Device Role / Timing Role: Safety-aware processing node with ASIL-B runtime integrity, CAN FD sensor ingestion, and hardware CRC for data path validation. Use Value: Dual watchdog timers, ECC RAM, and low-voltage detection ensure fail-safe operation during critical sensor data processing cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive cluster controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RH850/U2A | 32-bit RH850 core (not Arm); 200-MHz max; no integrated graphics engine or warping | Lacks native TFT/HUD rendering capability; requires external GPU or FPGA for display processing | Choose when legacy Renesas toolchain and CAN FD+LIN focus outweigh graphics needs |
| S32K344 | Arm® Cortex-M7 core; 320-MHz; 8-MB Flash; no integrated 2.5D graphics or display controllers | Requires external display interface ICs and video memory; no on-chip VRAM or warping logic | Prefer for high-CPU-throughput safety applications where display is handled separately |
Compared with RH850/U2A and S32K344, S6J32EEKSNSE20000 uniquely integrates display generation, warping, and dual-TFT timing in a single die - reducing BOM count and latency in HUD and cluster systems requiring pixel-level real-time correction.
Availability
S6J32EEKSNSE20000 is available at Aetrix Electronics and suitable for automotive instrument cluster design, head-up display development, and ASIL-B-compliant embedded control requiring stable component supply over extended vehicle lifecycles.
Supply support for S6J32EEKSNSE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T1G product line was developed specifically for automotive digital cockpit applications - integrating graphics, display, motor control, and safety-critical processing into a single SoC optimized for instrument clusters and HUDs.
FAQ
What is the maximum operating junction temperature for S6J32EEKSNSE20000?
The device is qualified for automotive Grade 2 operation with a maximum junction temperature of +125°C. Thermal design must account for 216-pin TEQFP package dissipation under full graphics and CPU load, and derating curves are specified in Section 8.2 of the datasheet for ambient temperatures above +105°C.
Does S6J32EEKSNSE20000 support AUTOSAR 4.x?
Yes - it supports AUTOSAR 4.0.3 via certified MCAL drivers and compatible OS abstraction layer. The integrated CAN FD controllers, memory protection unit (MPU), and hardware watchdogs meet required AUTOSAR BSW module dependencies, and Infineon provides validated configuration tools for EB tresos and Vector DaVinci.
Is the HyperBus™ interface enabled on this specific variant?
No - S6J32EEKSNSE20000 (function digit "E") does not include HyperBus™ support, as confirmed in Table 2-2 of the datasheet. Only variants with function digits G and H support up to two HyperBus™ channels; "E" and "F" variants omit this interface entirely.
Can the on-chip audio DAC drive speakers directly?
No - the stereo audio DAC outputs are line-level (±1 V differential, 16–24 bit) and require external Class-D or Class-AB amplifier circuitry. It is designed for connection to audio codecs or amplifiers, not direct speaker drive, and includes programmable volume control and mute functionality per channel.
S6J32EEKSNSE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 208-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 4.171875MB (4.171875M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2.125M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.1V ~ 5.5V
- Data Converters:
- A/D 46x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J32EEKSNSE20000 FAQ
1.How can I place an order for S6J32EEKSNSE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J32EEKSNSE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J32EEKSNSE20000 reliable?
The price and inventory of S6J32EEKSNSE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J32EEKSNSE20000 is usually 5 days.
3.What payment methods are accepted for S6J32EEKSNSE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J32EEKSNSE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J32EEKSNSE20000?
S6J32EEKSNSE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J32EEKSNSE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J32EEKSNSE20000?
For technical support, including S6J32EEKSNSE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J32EEKSNSE20000 requirements.
6.How does Aetrix verify that S6J32EEKSNSE20000 is sourced from the original manufacturer or authorized distributors?
All S6J32EEKSNSE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J32EEKSNSE20000 meets industry standards.
7.What is the process for return or replacement of S6J32EEKSNSE20000?
All S6J32EEKSNSE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J32EEKSNSE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J32EEKSNSE20000 part is unused and in its original packaging.
Return procedure for S6J32EEKSNSE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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