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Infineon Technologies S6J32EELTPSC20000
- Part No.:
- S6J32EELTPSC20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 216-LQFP Exposed Pad
- Datasheet:
-
S6J32EELTPSC20000.pdf
- Description:
- TRAVEO-55NM
- Quantity:
- Payment:
- Shipping:
Inventory:398
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Product details
Overview
S6J32EELTPSC20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive microcontroller in the TRAVEO™ T1G family, featuring a 240-MHz Arm® Cortex®-R5F CPU, 4-MB Flash, 512-KB RAM, dual-display support up to WVGA (854×480), and on-the-fly display warping for HUD correction. It integrates 4-channel CAN FD, Ethernet RMII, 50-channel 12-bit SAR ADC (1-Msps), and ASIL-B compliance per ISO 26262 - deployed in mid-range instrument clusters driving six gauges and two TFT displays.
For engineers reviewing the S6J32EELTPSC20000 datasheet, S6J32EELTPSC20000 pinout, S6J32EELTPSC20000 application, or S6J32EELTPSC20000 equivalent, key selection criteria include dual-display timing control with warping, CAN FD + Ethernet RMII coexistence, 2.5D graphics engine performance at 200 MHz, and functional safety support for cluster/HUD systems requiring ASIL-B alignment.
Technical Context
This MCU implements five independent power domains with dedicated LDOs, enabling selective domain shutdown for low-power cluster operation. Its clock architecture includes four PLLs (PLL0–PLL3) with SSCG support, programmable core (CLK_CPU), graphics (CLK_CD3A0), and display clocks (64/50 MHz), all synchronized for deterministic real-time rendering and video capture.
The integrated 2.5D graphics subsystem supports ITU656/YCbCr4:2:2/RGB888 video capture, dual-TTL RGB888 outputs, RSDS/TCON, and FPD-Link LVDS (350 Mbps), with hardware-accelerated warping, scaling, rotation, and blending - all managed via Cypress's proprietary 2D driver API without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-R5F @ 240 MHz with FPU, MPU, TPU, and dual-precision floating-point support for real-time cluster control |
| Memory | 4160 KB program Flash + 112 KB work Flash; 128 KB TC-RAM + 384 KB system RAM + 2 MB VRAM for graphics buffering |
| Graphics Engine | 2.5D engine @ 200 MHz with on-the-fly warping, scale/rotate/blend, and 2D driver API for HUD distortion correction |
| Display Support | Dual-channel: TTL RGB888 (ch.0/ch.1), RSDS/TCON (ch.0), FPD-Link LVDS (ch.0, 350 Mbps), max 60 fps at WVGA resolution |
| Analog Peripherals | 50-channel 12-bit SAR ADC @ 1-Msps; 4-channel CAN FD with ECC-protected 16 KB RAM per channel |
| Connectivity | Ethernet AVB with MII/RMII; 12-channel MFS; 2-ch DDR HSSPI; optional HyperBus™ and Media-LB (MOST25) |
| Safety & Security | ASIL-B compliant per ISO 26262; optional SHE with AES-128 encryption; 5-domain power control with LVD monitoring |
Pinout & Package
Supplied in a 208-pin TEQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad, optimized for automotive PCB thermal management and EMI resilience in instrument cluster modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_7 | I/O Power Supply | Eight independent 2.7–5.5 V I/O domains enabling mixed-voltage interface to displays, sensors, and CAN transceivers |
| VDDA | Analog Power | Stable 3.3 V supply for 12-bit ADC reference and audio DAC operation with low-noise regulation |
| VDDCORE | Core Power | 1.2 V ±0.1 V regulated supply for Cortex-R5F core and cache subsystems |
| RMII_RXD0/RMII_RXD1 | Ethernet Interface | Dedicated 2-bit RMII receive data lines supporting 10/100 Mbps AVB traffic with precise timing alignment |
| DISP0_R/G/B[7:0] | Display Output | 24-bit parallel RGB888 output for primary TFT display (channel 0), supporting 854×480 @ 60 fps |
| WARP_CLK/WARP_DATA | Warping Engine Control | Specialized high-speed interface for external warping LUT loading and real-time distortion parameter updates |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly display warping | Hardware-accelerated pixel remapping for HUD projection onto curved windshields without CPU load or frame buffer overhead |
| Dual-display timing control | Independent 64 MHz (ch.0) and 50 MHz (ch.1) display clocks with synchronized start-of-frame triggers for multi-display synchronization |
| Integrated CAN FD + Ethernet RMII | Simultaneous real-time vehicle network communication (CAN FD) and infotainment/data streaming (Ethernet AVB) on single die |
| 2.5D graphics acceleration | Vector drawing, alpha blending, and rotation executed in hardware at 200 MHz - freeing Cortex-R5F for gauge logic and diagnostics |
| ASIL-B ready power domain control | Five isolated power domains with independent reset, clock gating, and voltage monitoring for fault containment per ISO 26262 requirements |
Applications
| Instrument Cluster Gauges | Head-Up Display (HUD) |
|---|---|
Use Scenario: Driving analog stepper motors for six mechanical gauges (speedometer, tachometer, fuel, etc.) while rendering digital overlays on TFT. IC Role / Device Role / Timing Role: Primary cluster controller managing motor PWM, ADC sensor reads, and dual-display compositing with sub-16 ms frame latency. Use Value: Eliminates need for separate gauge driver ICs and display controller; reduces BOM count by integrating stepper control, graphics, and CAN FD diagnostics. | Use Scenario: Projecting speed, navigation, and ADAS alerts onto windshield using optical combiner with geometric distortion compensation. IC Role / Device Role / Timing Role: Real-time warping engine + dual-display controller generating corrected pixel data for LVDS-driven HUD projector module. Use Value: Hardware warping ensures pixel-perfect projection without software interpolation delay or GPU resource contention. |
| Mid-Range Digital Dashboard | Automotive Infotainment Companion |
Use Scenario: Replacing legacy analog clusters with full-color, animated UIs including battery status, range estimation, and connectivity indicators. IC Role / Device Role / Timing Role: Graphics subsystem renders vector-based UI elements while CPU handles BLE/Wi-Fi bridge logic and OTA update parsing. Use Value: 2 MB VRAM enables double-buffered animation at 60 fps; 512 KB RAM accommodates AUTOSAR OS and middleware stacks. | Use Scenario: Acting as display processor and network gateway between head unit (CAN FD) and cluster (Ethernet AVB) in distributed architecture. IC Role / Device Role / Timing Role: Ethernet AVB endpoint receiving media streams and CAN FD node aggregating vehicle state data for synchronized UI updates. Use Value: Dual-network capability avoids external bridge ICs; time-synchronized packet handling enables lip-sync audio/video in HUD notifications. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive cluster microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RH850/U2A | 32-bit RX core @ 400 MHz; 8 MB Flash; no integrated graphics engine or display warping | Requires external display controller and FPGA-based warping; higher core performance but larger software integration effort | Select when maximum CPU throughput is prioritized over integrated graphics and HUD-specific features |
| S32K344 | Arm® Cortex-M7 @ 320 MHz; 8 MB Flash; no display output or graphics accelerator; ASIL-D capable | Targeted at domain controllers and safety-critical gateways - lacks native display interfaces and HUD support | Select for safety-critical body/ADAS domains where display functionality is handled by separate SoC |
Compared with RH850/U2A and S32K344, S6J32EELTPSC20000 uniquely combines ASIL-B cluster control, dual-display timing, hardware warping, and CAN FD + Ethernet RMII on one die - reducing system complexity and inter-IC latency for HUD-integrated instrument clusters.
Availability
S6J32EELTPSC20000 is available at Aetrix Electronics and suitable for automotive instrument cluster development, Head-Up Display (HUD) integration, and mid-range digital dashboard production requiring stable component supply across extended automotive lifecycles.
Supply support for S6J32EELTPSC20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive MCUs, and security solutions for industrial and transportation markets.
The TRAVEO™ T1G product line was designed specifically for automotive digital cockpit applications - integrating graphics, display control, real-time processing, and functional safety into single-chip solutions for instrument clusters and HUD systems.
FAQ
What is the maximum supported resolution for each display channel?
S6J32EELTPSC20000 supports WVGA resolution (854 × 480 pixels) per channel at 60 fps. Channel 0 operates at 64 MHz pixel clock for full RGB888 output, while channel 1 uses a 50 MHz clock and supports RGB888 or reduced formats. Both channels can drive TFT panels simultaneously with independent timing and gamma correction.
Does this MCU support AUTOSAR-compliant software stacks?
Yes - the S6J32EELTPSC20000 is certified for AUTOSAR 4.0.3 compliance. Its memory protection unit (MPU), interrupt controller with 512 vectors, and ASIL-B-aligned peripherals enable deployment of production-grade AUTOSAR OS, BSW modules, and RTE layers without external safety co-processors.
Is the Ethernet interface limited to RMII, or does it support MII as well?
The Ethernet AVB peripheral supports both MII and RMII physical layer interfaces. RMII is enabled by default in the S6J32E variant (as indicated by "Ethernet RMII ON" in Function Digit Table), while MII remains accessible via alternate pin mapping and configuration register settings per the Hardware Manual (Document #002-12500).
How is flash memory retention validated for automotive use?
Flash retention is specified at 20 years under operating conditions of –40°C to +125°C junction temperature, verified through accelerated endurance testing per AEC-Q100 Grade 1 stress profiles. Each block undergoes ECC protection during read/write, and retention is guaranteed without periodic refresh cycles in automotive storage applications.
S6J32EELTPSC20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 216-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 128
- Program Memory Size:
- 4.171875MB (4.171875M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2.125M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.1V ~ 5.5V
- Data Converters:
- A/D 50x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J32EELTPSC20000 FAQ
1.How can I place an order for S6J32EELTPSC20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J32EELTPSC20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J32EELTPSC20000 reliable?
The price and inventory of S6J32EELTPSC20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J32EELTPSC20000 is usually 5 days.
3.What payment methods are accepted for S6J32EELTPSC20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J32EELTPSC20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J32EELTPSC20000?
S6J32EELTPSC20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J32EELTPSC20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J32EELTPSC20000?
For technical support, including S6J32EELTPSC20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J32EELTPSC20000 requirements.
6.How does Aetrix verify that S6J32EELTPSC20000 is sourced from the original manufacturer or authorized distributors?
All S6J32EELTPSC20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J32EELTPSC20000 meets industry standards.
7.What is the process for return or replacement of S6J32EELTPSC20000?
All S6J32EELTPSC20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J32EELTPSC20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J32EELTPSC20000 part is unused and in its original packaging.
Return procedure for S6J32EELTPSC20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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