Infineon Technologies S6J32FEKSNSE20000
- Part No.:
- S6J32FEKSNSE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 208-LQFP Exposed Pad
- Datasheet:
-
S6J32FEKSNSE20000.pdf
- Description:
- TRAVEO-55NM
- Quantity:
- Payment:

- Shipping:

Inventory:4,304
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6J32FEKSNSE20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive microcontroller in the TRAVEO™ T1G family, featuring a 240-MHz Arm® Cortex®-R5F CPU, 4-MB Flash, 512-KB RAM, dual-display support (WVGA), and embedded 2.5D graphics engine. It integrates 4-channel CAN FD, Ethernet RMII, 50-channel 12-bit SAR ADC, and ASIL-B compliance for mid-range instrument clusters and HUD systems.
For engineers reviewing the S6J32FEKSNSE20000 datasheet, S6J32FEKSNSE20000 pinout, S6J32FEKSNSE20000 application, or S6J32FEKSNSE20000 equivalent, key selection criteria include real-time graphics rendering capability (200-MHz graphics clock), dual-TFT display timing control (64/50 MHz channels), on-the-fly warping for windshield correction, 2.7–5.5 V I/O supply flexibility, and integrated Secure Hardware Extension (SHE) with AES-128.
Technical Context
This MCU implements a dual-domain power architecture with five configurable power domains and supports AUTOSAR 4.0.3. Its 2.5D graphics subsystem includes dedicated VRAM (2 MB), video capture (ITU-R BT.656, YCbCr4:2:2/4:4:4), and hardware-accelerated warping, scaling, and blending - all synchronized to dual-display outputs at up to 60 fps.
The device integrates four independent CAN FD controllers with ECC-protected message RAM (16 KB/ch), two DDR HSSPI interfaces, and optional Media-LB (MOST25) for infotainment backbone connectivity. Clock generation uses four PLLs (PLL0–3) with SSCG support, enabling precise domain-specific frequency synthesis for CPU (240 MHz), graphics (200 MHz), and display (64/50 MHz) subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-R5F @ 240 MHz with FPU, MPU, TPU, and dual-precision floating-point support |
| Memory | 4160 KB program Flash + 112 KB work Flash; 384 KB system RAM + 128 KB TC-RAM + 2 MB VRAM |
| Graphics Engine | 2.5D accelerator with on-the-fly warping, 60-fps dual-TFT output (854×480 each), RGB888/RSDS/LVDS support |
| Analog Interface | 50-channel 12-bit SAR ADC @ 1 Msps; 4-channel stereo audio DAC with PCM-PWM and I2S |
| Communication | 4× CAN FD (ECC-protected 16 KB RAM/ch), 12× MFS, 2× DDR HSSPI, optional HyperBus™ & Media-LB (MOST25) |
| Timing & Safety | ASIL-B compliant per ISO 26262; 5-domain power control; 20-year Flash retention; SHE with AES-128 encryption |
| Supply Voltage | Core: 1.2 V ±0.1 V; I/O: selectable 2.7–3.6 V or 2.7–5.5 V; internal LDO for 5.0 V rail |
Pinout & Package
Supplied in a 216-pin TEQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad. Pin assignments are defined across eight functional groups: power/ground, clock inputs, JTAG debug, CAN FD transceivers, RMII Ethernet, dual display interfaces (RGB888, RSDS, LVDS), video capture (ITU656), and peripheral I/O (ADC, PWM, stepper motor control).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0 – VDDIO_7 | I/O Power Supply Banks | Eight independent 2.7–5.5 V banks supporting mixed-voltage interface operation |
| P00 – P15 | General-Purpose I/O | Configurable as GPIO, ADC input, CAN FD TX/RX, or display data lines (RGB888) |
| ETH_MDC / ETH_MDIO | Ethernet Management Interface | IEEE 802.3-compliant MDIO bus for PHY configuration and status monitoring |
| DISP0_R0–R7 / G0–G7 / B0–B7 | Display Channel 0 RGB Data | 24-bit parallel RGB888 output driving primary TFT at up to 64 MHz pixel clock |
| VCAP_D0–D7 | Video Capture Input | 8-bit ITU-R BT.656 YCbCr4:2:2 or RGB666 input for camera feed processing |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly Display Warping | Hardware-accelerated geometric correction for HUD projection onto curved windshields without CPU overhead |
| Dual Independent Display Timing | Separate 64 MHz (ch.0) and 50 MHz (ch.1) pixel clocks enabling asynchronous dual-TFT operation |
| Integrated Stepper Motor Control | Six-channel controller with microstepping support for analog gauge needle actuation in instrument clusters |
| Secure Boot & SHE Acceleration | Embedded Secure Hardware Extension enabling AES-128 encryption/decryption and secure key storage |
| Real-Time Audio Processing | Dedicated sound mixer (10 inputs), waveform generator (4 ch), and stereo DAC for cabin audio feedback |
Applications
| Instrument Cluster Control | Head-Up Display (HUD) System |
|---|---|
Use Scenario: Driving digital gauges, warning indicators, and trip computer in mid-tier automotive dashboards. IC Role / Device Role / Timing Role: Primary cluster SoC managing display rendering, CAN FD gauge communication, and stepper motor control. Use Value: Enables full WVGA dual-display output with real-time warping and 60-fps refresh-eliminating need for external graphics co-processor. | Use Scenario: Projecting speed, navigation, and ADAS alerts onto vehicle windshield via optical combiner. IC Role / Device Role / Timing Role: Graphics subsystem controller performing on-the-fly warping and dual-channel timing synchronization. Use Value: Hardware warping engine corrects image distortion from windshield curvature at pixel level, reducing latency vs. software-based solutions. |
| Automotive Infotainment Gateway | ADAS Camera Interface Module |
Use Scenario: Bridging CAN FD, MOST25, and Ethernet AVB networks between head unit, telematics, and body control modules. IC Role / Device Role / Timing Role: Network convergence hub with protocol translation and time-synchronized packet routing. Use Value: Integrated 4× CAN FD + Media-LB + Ethernet RMII allows single-chip gateway implementation with deterministic latency under AUTOSAR OS. | Use Scenario: Capturing and preprocessing forward-facing camera video for lane departure or AEB systems. IC Role / Device Role / Timing Role: Video capture unit (ITU656/YCbCr4:2:2) feeding preprocessed frames to host processor via AXI. Use Value: On-chip video capture at up to 800×480@60fps with hardware color space conversion reduces bandwidth demand on main ECU. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive cluster microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RH850/U2A | 32-bit RXv3 core @ 400 MHz; 8 MB Flash; no integrated graphics engine or VRAM | Requires external GPU for dual-TFT; stronger real-time interrupt handling but lacks on-the-fly warping | Select when deterministic interrupt latency <1 µs is critical and graphics are handled externally |
| S32K344 | Arm® Cortex-M7 @ 320 MHz; 8 MB Flash; no display controller or video capture unit | Targeted at domain controllers-not instrument clusters; relies on external display bridge ICs | Select for safety-critical chassis control where display functionality is delegated to separate SoC |
Compared with RH850/U2A and S32K344, S6J32FEKSNSE20000 uniquely integrates display timing, warping, and VRAM in a single die-reducing BOM count and inter-chip latency for HUD and cluster applications requiring sub-16-ms frame rendering.
Availability
S6J32FEKSNSE20000 is available at Aetrix Electronics and suitable for automotive instrument cluster design, Head-Up Display (HUD) development, and ADAS camera interface modules requiring stable component supply and long-term lifecycle support.
Supply support for S6J32FEKSNSE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T1G product line was designed specifically for automotive digital cockpit applications-including instrument clusters, HUDs, and central display units-emphasizing integrated graphics, functional safety, and multi-protocol connectivity.
FAQ
Does S6J32FEKSNSE20000 support AUTOSAR-compliant CAN FD drivers?
Yes. The device includes four fully compliant CAN FD controllers with message RAM protected by ECC, supporting AUTOSAR 4.0.3-compliant driver stacks. Each channel provides 128 message buffers and bit rates up to 5 Mbps, with built-in protocol handling for FD frame formatting, CRC calculation, and error confinement.
What display interfaces does S6J32FEKSNSE20000 natively support?
S6J32FEKSNSE20000 supports TTL RGB888 (24-bit), RSDS/TCON, and FPD-Link (LVDS) outputs across two independent display channels. Channel 0 supports all three interfaces simultaneously; channel 1 supports RGB888 and LVDS. Maximum pixel clock is 64 MHz (ch.0) and 50 MHz (ch.1), enabling dual-WVGA displays at 60 fps.
Is the Secure Hardware Extension (SHE) enabled by default in S6J32FEKSNSE20000?
No. SHE is an optional feature enabled during chip configuration via fuse settings and boot ROM initialization. Once activated, it provides AES-128 encryption/decryption, secure key storage, and secure boot verification-but requires integration with Infineon's Trusted Firmware-A port and SHE middleware stack.
Can S6J32FEKSNSE20000 drive both displays and perform video capture concurrently?
Yes. The device supports simultaneous operation of dual-display output (ch.0 and ch.1) and ITU-R BT.656 video capture at up to 800×480@60fps. This is enabled by independent AXI bus masters for display controller and video capture unit, with dedicated 2 MB VRAM allocation preventing resource contention.
S6J32FEKSNSE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 208-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 4.171875MB (4.171875M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2.125M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.1V ~ 5.5V
- Data Converters:
- A/D 46x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J32FEKSNSE20000 FAQ
1.How can I place an order for S6J32FEKSNSE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J32FEKSNSE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J32FEKSNSE20000 reliable?
The price and inventory of S6J32FEKSNSE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J32FEKSNSE20000 is usually 5 days.
3.What payment methods are accepted for S6J32FEKSNSE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J32FEKSNSE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J32FEKSNSE20000?
S6J32FEKSNSE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J32FEKSNSE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J32FEKSNSE20000?
For technical support, including S6J32FEKSNSE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J32FEKSNSE20000 requirements.
6.How does Aetrix verify that S6J32FEKSNSE20000 is sourced from the original manufacturer or authorized distributors?
All S6J32FEKSNSE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J32FEKSNSE20000 meets industry standards.
7.What is the process for return or replacement of S6J32FEKSNSE20000?
All S6J32FEKSNSE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J32FEKSNSE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J32FEKSNSE20000 part is unused and in its original packaging.
Return procedure for S6J32FEKSNSE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6J32FEKSNSE20000 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

