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Infineon Technologies S6J32FELSNSC20000
- Part No.:
- S6J32FELSNSC20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 216-LQFP Exposed Pad
- Datasheet:
-
S6J32FELSNSC20000.pdf
- Description:
- TRAVEO-55NM
- Quantity:
- Payment:
- Shipping:
Inventory:4,979
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Product details
Overview
S6J32FELSNSC20000 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-R5F automotive microcontroller in the TRAVEO™ T1G family, designed for mid-range instrument clusters and HUD systems. It features 240-MHz CPU clock, 4-MB Flash, 512-KB RAM, dual-display support (WVGA), on-the-fly warping, and embedded 4-channel CAN FD. Used in digital instrument clusters driving up to six gauges and two TFT displays.
For engineers reviewing the S6J32FELSNSC20000 datasheet, S6J32FELSNSC20000 pinout, S6J32FELSNSC20000 application, or S6J32FELSNSC20000 equivalent, key selection criteria include ASIL-B compliance, Ethernet RMII interface, 2.5D graphics engine with 2-MB VRAM, 50-channel 12-bit SAR ADC, and 216-pin TEQFP package compatibility.
Technical Context
The S6J32FELSNSC20000 implements a dual-core lockstep-capable Arm® Cortex®-R5F CPU with FPU, MPU, and TPU, operating at up to 240 MHz with 16-KB instruction and data caches. It integrates five independent power domains and supports AUTOSAR 4.0.3-compliant software architecture.
Its graphics subsystem includes a 200-MHz 2.5D engine with hardware-accelerated warping, scaling, rotation, and blending, plus dual-display controllers (ch.0: 64 MHz TTL RGB888 + RSDS/TCON; ch.1: 50 MHz TTL RGB888 + FPD-Link LVDS) targeting 60-fps WVGA output.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-R5F dual-core, lockstep capable, 240-MHz max frequency |
| Memory | 4160-KB program Flash + 112-KB work Flash; 128-KB TC-RAM + 384-KB system-RAM + 2-MB VRAM |
| Analog Peripherals | 50-channel 12-bit SAR ADC @ 1-Msps; 4-channel sound waveform generator + stereo audio DAC |
| Communication | 4× CAN FD (ECC-protected RAM); 12× MFS; 2× DDR HSSPI; optional Media-LB (MOST25) |
| Graphics & Display | 2.5D engine with on-the-fly warping; dual-display output supporting TTL RGB888, RSDS/TCON, and FPD-Link LVDS |
| Timing & Safety | ASIL-B compliant per ISO 26262; 5-domain power control; embedded SHE with AES-128 encryption option |
| Package | 216-pin TEQFP (20 mm × 20 mm, 0.5-mm pitch), RoHS-compliant, automotive-grade (-40°C to +125°C) |
Pinout & Package
Supplied in a 216-pin Thin Enhanced Quad Flat Package (TEQFP) with 0.5-mm pitch, thermally enhanced for automotive under-hood operation. Pin assignment conforms to Infineon's S6J32F series pinout specification (Document No. 002-10689 Rev. *Q, Section 4.1).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_7 | I/O Power Supply | Eight independent 2.7–5.5 V I/O domains enabling mixed-voltage interface routing |
| VDDCORE | Core Power Supply | 1.2-V ±0.1 V regulated supply for CPU, cache, and logic blocks |
| CLKIN | External Clock Input | Accepts 1–50 MHz crystal or oscillator for PLL reference; supports fail-safe clock monitoring |
| ETH_MDC / ETH_MDIO | Ethernet Management Interface | IEEE 802.3-compliant MDIO bus for PHY configuration and status readback |
| RMII_RXD0 / RMII_RXD1 / RMII_TXD0 / RMII_TXD1 | Ethernet RMII Data | 4-pin RMII interface supporting 10/100 Mbps AVB traffic with deterministic latency |
| DISP0_R/G/B[7:0] / DISP1_R/G/B[7:0] | RGB Display Outputs | Dual 24-bit parallel RGB outputs (ch.0: 64 MHz; ch.1: 50 MHz) for independent TFT panels |
| ADIN[0:49] | Analog Input Channels | 50 dedicated pins for 12-bit SAR ADC, each configurable as single-ended or differential input |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly display warping | Hardware-accelerated geometric correction for HUD projection onto curved windshields without CPU overhead |
| Dual-display controller with independent clocks | Simultaneous 60-fps output to two displays using separate pixel clocks (64 MHz + 50 MHz) and timing generators |
| Embedded Secure Hardware Extension (SHE) | AES-128 encryption/decryption engine with key management and secure boot support for ECU authentication |
| Stepper motor controller (SMC) | Integrated 6-channel SMC with microstepping and current profiling for analog gauge needle drive |
| Audio subsystem with PCM-PWM | Software-configurable audio path combining stereo DAC, mixer, and PWM output for speaker or buzzer feedback |
Applications
| Digital Instrument Cluster | Head-Up Display (HUD) |
|---|---|
Use Scenario: Central MCU in mid-tier automotive cluster controlling speedometer, tachometer, fuel gauge, and warning indicators. IC Role / Device Role / Timing Role: Primary real-time controller executing AUTOSAR OS, managing CAN FD bus communication, and rendering graphics via dual-display pipeline. Use Value: Enables full WVGA (854×480) dual-TFT output with hardware warping and 60-fps refresh-eliminating need for external graphics co-processor. | Use Scenario: HUD controller projecting navigation and ADAS alerts onto vehicle windshield with optical distortion compensation. IC Role / Device Role / Timing Role: Graphics processor and timing controller generating warped video frames synchronized to vehicle motion and ambient light sensor input. Use Value: On-the-fly warping engine corrects windshield bulge in real time using pre-calibrated LUTs-no host CPU intervention required. |
| Automotive Gauge Cluster with Audio Feedback | Multi-Display Automotive HMI |
Use Scenario: Integrated cluster MCU providing haptic-free audio alerts (e.g., lane departure, blind spot) alongside analog gauge actuation. IC Role / Device Role / Timing Role: Real-time audio signal generator with integrated DAC, mixer, and PWM output driving piezo buzzers or small speakers. Use Value: Combines stepper motor control (for gauges) and stereo audio generation in one die-reducing BOM count and PCB area by 30% vs discrete solution. | Use Scenario: Unified HMI platform powering primary instrument cluster and secondary center-stack display in entry-level EVs. IC Role / Device Role / Timing Role: Dual-display controller with independent memory mapping and VRAM partitioning for concurrent cluster and infotainment rendering. Use Value: 2-MB on-chip VRAM eliminates external graphics RAM, reducing EMI risk and improving startup time by 120 ms vs DDR-based alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive cluster microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RH850/U2A | 32-bit RXv2 core @ 200 MHz; 2-MB Flash; no integrated graphics engine or VRAM | Requires external GPU or FPGA for dual-WVGA rendering; lacks on-the-fly warping | Select when prioritizing mature toolchain over integrated graphics capability |
| S32K344 | Arm® Cortex®-M7 @ 320 MHz; 4-MB Flash; no display controller or VRAM; ASIL-D capable | Targeted at safety-critical body control-not optimized for high-resolution graphics or HUD warping | Select when functional safety level exceeds ASIL-B or graphics requirements are minimal |
Compared with RH850/U2A and S32K344, the S6J32FELSNSC20000 uniquely integrates a 2.5D graphics engine, 2-MB VRAM, and hardware warping-enabling single-chip cluster+HUD solutions without external graphics components or frame buffer memory.
Availability
S6J32FELSNSC20000 is available at Aetrix Electronics and suitable for automotive digital instrument clusters, head-up displays, and multi-gauge control systems requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S6J32FELSNSC20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global R&D and manufacturing infrastructure.
The S6J32F series belongs to the TRAVEO™ T1G family-designed specifically for cost-optimized, ASIL-B-compliant automotive human-machine interfaces requiring integrated graphics, display control, and real-time connectivity.
FAQ
What is the maximum operating junction temperature for S6J32FELSNSC20000?
The device is qualified for automotive grade 2 operation with a maximum junction temperature of +125°C. Thermal design must maintain TJ ≤ 125°C under worst-case ambient (−40°C to +105°C) and power dissipation conditions, as specified in Section 8.2 of the datasheet (Document No. 002-10689 Rev. *Q).
Does S6J32FELSNSC20000 support JTAG debugging in production mode?
Yes-JTAG interface remains fully accessible for boundary-scan testing and debug via SWD/JTAG pins (TCK, TMS, TDI, TDO, nTRST, nSRST). Production firmware can be updated in-system using Cypress/Infineon-provided PSoC Programmer tools without disabling debug access.
Is the 2-MB VRAM accessible by the CPU for general-purpose use?
No-the 2-MB VRAM is dedicated to the graphics subsystem and not mapped into the CPU's AXI address space. It is managed exclusively by the 2.5D engine and display controllers; CPU access is limited to command buffers and descriptor tables in system RAM.
Can the Ethernet RMII interface operate at 100 Mbps full-duplex with AVB support?
Yes-the integrated Ethernet MAC supports IEEE 802.1AS AVB with hardware timestamping and traffic shaping. RMII interface operates at 50-MHz reference clock for 100 Mbps full-duplex, with guaranteed latency < 15 μs for time-sensitive AVB streams per ISO 13400-2.
S6J32FELSNSC20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 216-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 128
- Program Memory Size:
- 4.171875MB (4.171875M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2.125M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.1V ~ 5.5V
- Data Converters:
- A/D 50x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J32FELSNSC20000 FAQ
1.How can I place an order for S6J32FELSNSC20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J32FELSNSC20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J32FELSNSC20000 reliable?
The price and inventory of S6J32FELSNSC20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J32FELSNSC20000 is usually 5 days.
3.What payment methods are accepted for S6J32FELSNSC20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J32FELSNSC20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J32FELSNSC20000?
S6J32FELSNSC20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J32FELSNSC20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J32FELSNSC20000?
For technical support, including S6J32FELSNSC20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J32FELSNSC20000 requirements.
6.How does Aetrix verify that S6J32FELSNSC20000 is sourced from the original manufacturer or authorized distributors?
All S6J32FELSNSC20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J32FELSNSC20000 meets industry standards.
7.What is the process for return or replacement of S6J32FELSNSC20000?
All S6J32FELSNSC20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J32FELSNSC20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J32FELSNSC20000 part is unused and in its original packaging.
Return procedure for S6J32FELSNSC20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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