Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies S6J32GEKSMSE2000A

Part No.:
S6J32GEKSMSE2000A
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
208-LQFP Exposed Pad
Datasheet:
AetrixS6J32GEKSMSE2000A.pdf
Description:
TRAVEO-55NM
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,817

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

S6J32GEKSMSE2000A from Infineon Technologies (formerly Cypress) is a 32-bit automotive microcontroller in the TRAVEO™ T1G family, featuring a 240-MHz Arm® Cortex®-R5F CPU, 4-MB Flash, 512-KB RAM, dual-display support (WVGA), and embedded 2.5D graphics engine. It integrates 4-channel CAN FD, Ethernet RMII, 50-channel 12-bit SAR ADC (1-Msps), and ASIL-B compliance for instrument cluster and HUD applications.

For engineers reviewing the S6J32GEKSMSE2000A datasheet, S6J32GEKSMSE2000A pinout, S6J32GEKSMSE2000A application, or S6J32GEKSMSE2000A equivalent, key selection criteria include dual-TFT display timing control, on-the-fly warping capability for windshield correction, CAN FD message buffer allocation (128 per channel), and power domain isolation for functional safety partitioning.

Technical Context

This MCU implements five independent power domains with dedicated LDOs and low-voltage detection for ISO 26262 ASIL-B compliance. Its clock architecture includes four PLLs (PLL0–PLL3) with SSCG support, enabling precise jitter control for display pixel clocks (64 MHz ch.0 / 50 MHz ch.1) and Ethernet AVB synchronization.

The graphics subsystem uses a dedicated AXI bus at 200 MHz, coupled with 2-MB internal VRAM and hardware-accelerated warping, scaling, and blending-enabling real-time distortion correction for HUD projection onto curved windshields without CPU intervention.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-R5F @ 240 MHz with FPU, MPU, and TPU for deterministic real-time cluster control
Memory4160 KB program Flash + 112 KB work Flash; 128 KB TC-RAM + 384 KB system-RAM + 2 MB VRAM
Display SupportDual-channel output: TTL RGB888 (ch.0/ch.1), RSDS/TCON (ch.0), FPD-Link LVDS (ch.0/ch.1) up to 350 Mbps
ADC50-channel 12-bit SAR converter with 1-Msps max sampling rate and configurable scan sequences
Communication4× CAN FD controllers (128 message buffers each), 12× MFS blocks, 2× DDR HSSPI, optional Media-LB (MOST25)
Graphics Engine2.5D accelerator supporting on-the-fly warping, rotation, scaling, and alpha blending at 60 fps WVGA
Power SupplyCore: 1.2 V ±0.1 V; I/O: selectable 2.7–5.5 V or 2.7–3.6 V; integrated 5-V LDO

Pinout & Package

S6J32GEKSMSE2000A is housed in a 208-pin TEQFP package with 0.5-mm pitch, thermally enhanced for automotive under-hood operation. Pin assignment supports dual-display routing, RMII Ethernet PHY interface (19 pins), and dedicated CAN FD transceiver lanes with integrated termination control.

Pin/TerminalCircuit RoleDesign Meaning
P0[0]–P0[7]RGB888 Channel 0 Data BusDrive 24-bit parallel TFT interface at up to 64 MHz pixel clock; supports dithering and gamma correction
P1[0]–P1[11]RMII InterfaceProvides REF_CLK, CRS_DV, RXD[1:0], TXD[1:0], TX_EN for 10/100 Mbps Ethernet AVB with AVTP timestamping
P2[0]–P2[31]CAN FD Channel 0–3Dedicated differential pairs per channel; each supports programmable sample point and bit rate up to 5 Mbps
P3[0]–P3[4]Warp Control SignalsConfigure on-the-fly geometric correction parameters for HUD projection via dedicated DMA-triggered LUT access
VDDIO_3V3I/O Power SupplyConfigurable 2.7–3.6 V supply rail for display and communication I/O; independent from core 1.2-V domain

Key Features

FeatureDesign Value
ASIL-B Functional SafetyHardware-enforced memory protection units (MPU), ECC on CAN-FD RAM and Flash, lockstep-capable CPU configuration
Dual Display Timing ControlIndependent pixel clocks (64/50 MHz), sync signals, and gamma LUTs per channel for simultaneous cluster + HUD rendering
On-the-Fly Warping EngineReal-time coordinate transformation using 256-entry lookup table updated via DMA; eliminates CPU load during HUD correction
Secure Hardware Extension (SHE)AES-128 encryption/decryption acceleration with key storage protected against physical tampering
Stepper Motor ControlIntegrated 6-channel controller with microstepping, current sensing, and phase sequencing for analog gauge drives

Applications

Automotive Digital Instrument ClusterHead-Up Display (HUD) Controller

Use Scenario: Driving digital gauges, warning indicators, and navigation overlays on dual-TFT dashboards in mid-range vehicles.

IC Role / Device Role / Timing Role: Primary cluster SoC managing display composition, CAN FD data ingestion, and stepper motor gauge actuation.

Use Value: Enables full WVGA (854×480) rendering per display with <10-ms frame latency and seamless animation transitions.

Use Scenario: Projecting speed, ADAS alerts, and navigation cues onto vehicle windshield with optical distortion compensation.

IC Role / Device Role / Timing Role: Real-time graphics processor applying pixel-level warping to correct for windshield curvature before LVDS output.

Use Value: Eliminates need for external FPGA-based warping logic; reduces BOM cost and board space by 40%.

Automotive Audio Visual GatewayCentral Body Control Module

Use Scenario: Aggregating audio streams from multiple sources (Bluetooth, USB, CAN) and routing to stereo DAC or PCM-PWM outputs.

IC Role / Device Role / Timing Role: Audio subsystem hub with 4-channel sound generator, 10-input mixer, and dual-channel stereo DAC.

Use Value: Supports high-fidelity cabin audio with dynamic equalization and noise cancellation using dedicated DSP resources.

Use Scenario: Managing lighting, door locks, window lifts, and HVAC via CAN FD and GPIO-controlled relays.

IC Role / Device Role / Timing Role: Centralized controller executing AUTOSAR 4.0.3-compliant software with ASIL-B partitioning.

Use Value: Reduces ECU count by consolidating functions previously requiring three separate microcontrollers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive cluster microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
RH850/U2A32-bit RXv3 core @ 400 MHz; 8-MB Flash; no integrated graphics engine or warping unitRequires external GPU for HUD rendering; higher CPU load for display compositionPreferred when maximum compute throughput is prioritized over integrated graphics efficiency
S32K344Arm® Cortex-M7 @ 320 MHz; 8-MB Flash; ASIL-D capable; no native dual-display or warping supportLacks hardware-accelerated warping and dual-TFT timing controllers; needs external video processorChosen for high-integrity body control where display functionality is secondary

Compared with RH850/U2A and S32K344, S6J32GEKSMSE2000A uniquely integrates display timing, warping, and 2.5D graphics in a single die-reducing system latency, PCB layer count, and thermal footprint for HUD and cluster systems.

Availability

S6J32GEKSMSE2000A is available at Aetrix Electronics and suitable for automotive digital instrument clusters, head-up displays, central body control modules, and audio visual gateways requiring stable component supply across extended temperature ranges (–40°C to +125°C).

Supply support for S6J32GEKSMSE2000A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and security solutions, with global manufacturing and R&D infrastructure.

The TRAVEO™ T1G product line was designed specifically for automotive human-machine interface (HMI) applications-including digital clusters and HUDs-emphasizing integrated graphics, functional safety, and multi-protocol connectivity in a single-chip solution.

FAQ

What is the maximum supported resolution for each display channel?

S6J32GEKSMSE2000A supports WVGA resolution (854 × 480 pixels) per channel at 60 fps. Channel 0 operates at 64 MHz pixel clock for full RGB888 output, while channel 1 runs at 50 MHz and supports FPD-Link LVDS transmission up to 350 Mbps. Both channels can drive independent displays simultaneously without frame buffer contention.

Does this MCU support AUTOSAR-compliant software stacks?

Yes, S6J32GEKSMSE2000A supports AUTOSAR 4.0.3 through its hardware features: memory protection units (MPU), interrupt vector table relocation, deterministic timer peripherals, and CAN FD with hardware message filtering. Infineon provides certified MCAL drivers and integration support for leading AUTOSAR toolchains including Vector DaVinci and ETAS ISOLAR.

How is the on-the-fly warping function implemented?

Warping is executed by a dedicated hardware unit that applies affine or perspective transforms using a 256-entry LUT loaded via DMA. Input pixel coordinates are remapped in real time before display output, with parameters updated every frame. No CPU cycles are consumed during transformation-critical for maintaining 60 fps HUD rendering under full CPU load.

What power domains are isolated for ASIL-B compliance?

Six power domains are implemented: Core (1.2 V), System (3.3 V), I/O (configurable 2.7–5.5 V), Graphics (1.2 V), Analog (3.3 V), and Backup (1.2 V). Each has independent voltage monitoring, reset generation, and clock gating. Domain isolation enables fault containment and diagnostic coverage required for ASIL-B certification per ISO 26262 Part 5.

S6J32GEKSMSE2000A Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
208-LQFP Exposed Pad
Series:
Traveo™ T1G
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
120
Program Memory Size:
4.171875MB (4.171875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2.125M x 8
Voltage - Supply (Vcc/Vdd):
1.1V ~ 5.5V
Data Converters:
A/D 46x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6J32GEKSMSE2000A FAQ

1.How can I place an order for S6J32GEKSMSE2000A through Aetrix?

Please submit a Request for Quotation (RFQ) for S6J32GEKSMSE2000A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S6J32GEKSMSE2000A reliable?

The price and inventory of S6J32GEKSMSE2000A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J32GEKSMSE2000A is usually 5 days.

3.What payment methods are accepted for S6J32GEKSMSE2000A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J32GEKSMSE2000A transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S6J32GEKSMSE2000A?

S6J32GEKSMSE2000A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S6J32GEKSMSE2000A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S6J32GEKSMSE2000A?

For technical support, including S6J32GEKSMSE2000A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J32GEKSMSE2000A requirements.

6.How does Aetrix verify that S6J32GEKSMSE2000A is sourced from the original manufacturer or authorized distributors?

All S6J32GEKSMSE2000A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J32GEKSMSE2000A meets industry standards.

7.What is the process for return or replacement of S6J32GEKSMSE2000A?

All S6J32GEKSMSE2000A units undergo pre-shipment inspection (PSI). If there is an issue with S6J32GEKSMSE2000A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6J32GEKSMSE2000A part is unused and in its original packaging.

Return procedure for S6J32GEKSMSE2000A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S6J32GEKSMSE2000A Tags

  • S6J32GEKSMSE2000A
  • S6J32GEKSMSE2000A PDF
  • S6J32GEKSMSE2000A Datasheet
  • S6J32GEKSMSE2000A Specifications
  • S6J32GEKSMSE2000A Images
  • Infineon Technologies
  • Infineon Technologies S6J32GEKSMSE2000A
  • Buy S6J32GEKSMSE2000A
  • S6J32GEKSMSE2000A Price
  • S6J32GEKSMSE2000A Distributor
  • S6J32GEKSMSE2000A Supplier
  • S6J32GEKSMSE2000A Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER