Infineon Technologies S6J32GEKSNSE20000
- Part No.:
- S6J32GEKSNSE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 208-LQFP Exposed Pad
- Datasheet:
-
S6J32GEKSNSE20000.pdf
- Description:
- IC MCU 32BIT 4.0625MB 208TEQFP
- Quantity:
- Payment:

- Shipping:

Inventory:360
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Product details
Overview
S6J32GEKSNSE20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive microcontroller in the TRAVEO™ T1G family, featuring a 240-MHz Arm® Cortex®-R5F CPU, 4-MB Flash, 512-KB RAM, dual-display support (WVGA 854×480), and on-the-fly display warping for HUD correction. It integrates 4-channel CAN FD, Ethernet RMII, 50-channel 12-bit SAR ADC (1-Msps), and a 2.5D graphics engine with 2-MB VRAM.
For engineers reviewing the S6J32GEKSNSE20000 datasheet, S6J32GEKSNSE20000 pinout, S6J32GEKSNSE20000 application, or S6J32GEKSNSE20000 equivalent, key selection criteria include ASIL-B compliance per ISO 26262, 216-pin TEQFP package, 1.2-V core supply, 2.7–5.5-V I/O voltage range, and integrated stepper motor control for up to six gauges in instrument clusters.
Technical Context
This MCU implements a safety-aware architecture with five independent power domains, hardware memory protection units (MPU) for AHB/AXI buses, and dual-lockstep-capable Cortex-R5F core supporting AUTOSAR 4.0.3. It delivers deterministic real-time performance via low-latency interrupt handling and dedicated peripherals including 12-channel MFS, DDR HSSPI, and Media-LB (MOST25) interface.
The graphics subsystem operates at 200 MHz with dedicated AXI clocking, enabling 60-fps dual-TFT output and real-time video capture (ITU656/YCbCr4:2:2/RGB888). Display channel 0 supports RSDS/TCON and FPD-Link (LVDS) at 350 Mbps, while channel 1 provides TTL RGB888 output - both configurable for HUD optical correction via on-the-fly warping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-R5F @ 240 MHz with FPU, MPU, TPU, and dual-core lockstep option |
| Memory | 4160 KB program Flash + 112 KB work Flash; 128 KB TC-RAM + 384 KB system-RAM + 2 MB VRAM |
| Analog Interface | 50-channel 12-bit SAR ADC with 1-Msps conversion rate and programmable sampling windows |
| Connectivity | 4-channel CAN FD with ECC-protected 16 KB RAM per channel; Ethernet AVB with MII/RMII support |
| Graphics Engine | 2.5D accelerator with scale/rotate/warp/blend; supports dual-WVGA displays and ITU656 video capture |
| Power & Safety | 1.2-V core supply; 2.7–5.5-V I/O; ASIL-B compliance per ISO 26262; embedded SHE with AES-128 |
| Package | 216-pin TEQFP (20 mm × 20 mm, 0.5-mm pitch) with thermal pad and exposed die attach pad |
Pinout & Package
Package: 216-pin Thin Quad Flat Package (TEQFP) with 0.5-mm pitch, 20 mm × 20 mm body, and thermal pad for enhanced heat dissipation in automotive under-hood environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0 | I/O Power Supply | Supplies 2.7–5.5 V to Port 0–3 I/O banks; decoupling required per JEDEC JESD625-A |
| VDDC | Core Power Supply | 1.2-V ±0.1 V regulated input for CPU, cache, and internal logic; requires low-noise LDO |
| XTAL_IN / XTAL_OUT | Crystal Oscillator Input/Output | Supports 1–20 MHz fundamental-mode crystal for system clock generation; internal load caps selectable |
| ETH_MDIO / ETH_MDC | Ethernet Management Interface | IEEE 802.3-compliant MDIO/MDC pair for PHY register access and configuration |
| DISP0_R[7:0] / DISP0_G[7:0] / DISP0_B[7:0] | TTL RGB888 Output (Channel 0) | 24-bit parallel RGB interface driving primary TFT display at up to 64 MHz pixel clock |
| RMII_RXD0 / RMII_RXD1 / RMII_CRS_DV / RMII_TX_EN / RMII_TXD0 / RMII_TXD1 / RMII_REF_CLK | Ethernet RMII Interface | 50-MHz reference clock-based 2-wire receive/2-wire transmit interface compliant with IEEE 802.3u |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly display warping | Real-time geometric correction of rendered frames for HUD projection onto curved windshield surfaces |
| Dual independent display controllers | Simultaneous output to two displays (e.g., cluster TFT + HUD) with separate timing, resolution, and color depth |
| Stepper motor controller (SMC) | Integrated 6-channel SMC with microstepping, current control, and position feedback for analog gauge drives |
| Secure Hardware Extension (SHE) | Hardware-accelerated AES-128 encryption/decryption and secure boot key management per EVITA Medium profile |
| Audio subsystem | Integrated sound waveform generator, mixer, stereo DAC, and PCM-PWM for high-fidelity UI audio without external codec |
Applications
| Instrument Cluster Control | Head-Up Display (HUD) System |
|---|---|
Use Scenario: Driving digital speedometer, tachometer, fuel level, and warning indicators in mid-range automotive instrument panels. IC Role / Device Role / Timing Role: Primary cluster controller managing gauge actuation, display rendering, CAN FD message aggregation, and real-time diagnostics. Use Value: Enables full TFT cluster implementation with 60-fps animation, anti-aliasing, and seamless transitions using on-chip 2.5D engine and 2-MB VRAM. | Use Scenario: Projecting speed, navigation, and ADAS alerts onto vehicle windshield using compact optical combiner. IC Role / Device Role / Timing Role: HUD graphics processor performing real-time warping, gamma correction, and overlay compositing before LVDS transmission. Use Value: Eliminates need for external FPGA or GPU by executing optical distortion compensation in hardware at 60 fps with sub-pixel accuracy. |
| Multi-Display Automotive HMI | Automotive Gateway with Graphics Offload |
Use Scenario: Coordinating content across central infotainment display, rear-seat entertainment, and driver-facing cluster with synchronized UI elements. IC Role / Device Role / Timing Role: Secondary graphics node receiving compressed frame buffers over CAN FD or Media-LB and decompressing/rendering locally. Use Value: Reduces main ECU bandwidth load by offloading display composition and video capture to dedicated TRAVEO T1G node. | Use Scenario: Aggregating CAN FD, LIN, and Ethernet AVB traffic while generating status overlays for connected dashboards. IC Role / Device Role / Timing Role: Gateway MCU with integrated graphics engine rendering network topology maps and diagnostic overlays directly to display. Use Value: Combines protocol translation, security (SHE), and real-time visualization in single chip-reducing BOM count and latency vs. discrete gateway + GPU solution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive cluster controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RH850/U2A | 32-bit RXv3 core @ 400 MHz; 8-MB Flash; no integrated graphics engine or VRAM | Requires external GPU or compositor IC for dual-WVGA display; higher CPU throughput but no hardware warping | Select when prioritizing raw compute for AUTOSAR stack execution over integrated graphics capability |
| S32K344 | Arm® Cortex-M7 @ 320 MHz; 8-MB Flash; 2-MB SRAM; no display controller or VRAM | Lacks native display interfaces and graphics acceleration; relies on external MIPI-DSI bridge and GPU | Select for scalable safety gateway or domain controller where display functionality is handled separately |
Compared with RH850/U2A and S32K344, S6J32GEKSNSE20000 uniquely integrates dual-display controllers, on-the-fly warping, and 2-MB VRAM - eliminating external graphics components and reducing system-level latency for HUD and cluster applications.
Availability
S6J32GEKSNSE20000 is available at Aetrix Electronics and suitable for automotive instrument cluster design, Head-Up Display (HUD) development, and multi-display HMI systems requiring stable component supply, long-term lifecycle support, and ASIL-B-certified silicon.
Supply support for S6J32GEKSNSE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T1G product line targets automotive digital cockpit applications, specifically engineered to consolidate instrument cluster, HUD, and basic HMI functions into a single safety-compliant SoC with integrated graphics and connectivity.
FAQ
What is the maximum operating temperature range for S6J32GEKSNSE20000?
The S6J32GEKSNSE20000 is qualified for automotive Grade 2 operation, with a junction temperature range of –40 °C to +105 °C. It meets AEC-Q100 Rev-G stress test requirements and supports extended life testing per JEDEC JESD22-A108F for 15-year field reliability in under-hood environments.
Does S6J32GEKSNSE20000 support functional safety certification out of the box?
Yes - the device includes hardware safety mechanisms such as lockstep CPU cores, ECC on all SRAM/Flash, memory built-in self-test (MBIST), clock and voltage monitors, and ASIL-B compliance per ISO 26262:2018 Part 2–6. Full FMEDA reports and safety manuals are provided by Infineon for integration into certified automotive software stacks.
Can S6J32GEKSNSE20000 drive both displays simultaneously at full WVGA resolution?
Yes - it supports concurrent output to two independent displays: Channel 0 at 854×480 @ 64 MHz (TTL RGB or LVDS) and Channel 1 at 854×480 @ 50 MHz (TTL RGB only). Both channels use separate VRAM partitions and timing generators, enabling independent refresh rates and content.
Is HyperBus™ interface available on this specific part number?
Yes - S6J32GEKSNSE20000 includes two HyperBus™ channels (RPC2 interface), supporting up to 333 MT/s read/write speeds with x8 or x16 data bus widths. This enables direct connection to high-density HyperFlash™ or HyperRAM™ devices for extended code storage or frame buffer expansion.
S6J32GEKSNSE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 208-LQFP Exposed Pad
- Series:
- Traveo S6J32G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 4.0625MB (4.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 46x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J32GEKSNSE20000 FAQ
1.How can I place an order for S6J32GEKSNSE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J32GEKSNSE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J32GEKSNSE20000 reliable?
The price and inventory of S6J32GEKSNSE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J32GEKSNSE20000 is usually 5 days.
3.What payment methods are accepted for S6J32GEKSNSE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J32GEKSNSE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J32GEKSNSE20000?
S6J32GEKSNSE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J32GEKSNSE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J32GEKSNSE20000?
For technical support, including S6J32GEKSNSE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J32GEKSNSE20000 requirements.
6.How does Aetrix verify that S6J32GEKSNSE20000 is sourced from the original manufacturer or authorized distributors?
All S6J32GEKSNSE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J32GEKSNSE20000 meets industry standards.
7.What is the process for return or replacement of S6J32GEKSNSE20000?
All S6J32GEKSNSE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J32GEKSNSE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J32GEKSNSE20000 part is unused and in its original packaging.
Return procedure for S6J32GEKSNSE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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