My Inquiry
My Account
Infineon Technologies S6J32GELSNSC20000
- Part No.:
- S6J32GELSNSC20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 216-LQFP Exposed Pad
- Datasheet:
-
S6J32GELSNSC20000.pdf
- Description:
- IC MCU 32BIT 4.0625MB 216TEQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,331
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6J32GELSNSC20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive microcontroller in the TRAVEO™ T1G family, featuring a 240-MHz Arm® Cortex®-R5F CPU, 4-MB Flash, 512-KB RAM, dual-display support (WVGA), and embedded 4-channel CAN FD. It integrates a 2.5D graphics engine with on-the-fly warping for HUD correction and targets mid-range instrument clusters.
For engineers reviewing the S6J32GELSNSC20000 datasheet, S6J32GELSNSC20000 pinout, S6J32GELSNSC20000 application, or S6J32GELSNSC20000 equivalent, key selection criteria include ASIL-B compliance, Ethernet RMII interface, 50-channel 12-bit SAR ADC (1-Msps), 6-channel stepper motor control, and 2-MB VRAM for dual-TFT cluster rendering.
Technical Context
This MCU implements five independent power domains with dedicated LDOs, enabling selective domain shutdown for low-power cluster operation. Its clock architecture includes four PLLs (PLL0–PLL3) with SSCG support and configurable resource clocks for CPU (240 MHz), graphics (200 MHz), and display (64/50 MHz) subsystems.
The device integrates a full-featured audio subsystem-comprising 4-channel sound generator, stereo audio DAC, PCM-PWM, and I2S-with hardware-accelerated 2D/2.5D graphics including vector drawing, scaling, rotation, blending, and real-time warping for windshield distortion correction in HUD applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-R5F @ 240 MHz with FPU, MPU, TPU, and dual-precision floating-point support for deterministic real-time cluster control |
| Memory | 4160 KB program Flash + 112 KB work Flash; 128 KB TC-RAM + 384 KB system-RAM + 16 KB backup-RAM + 2 MB VRAM for graphics buffering |
| Analog Peripherals | 50-channel 12-bit SAR ADC @ 1-Msps; 4-channel sound generator; stereo audio DAC; PCM-PWM output |
| Communication | 4× CAN FD controllers (ECC-protected RAM); 12× MFS blocks; optional Ethernet AVB (MII/RMII); 2× DDR HSSPI; 1× Media-LB (MOST25) |
| Graphics & Display | 2.5D graphics engine @ 200 MHz; dual-display output (RGB888/TTL, RSDS/TCON, FPD-Link LVDS); on-the-fly warping for HUD optical correction |
| Safety & Power | ISO 26262 ASIL-B compliant; 5-domain power management; 1.2-V core / 2.7–5.5-V I/O supply; embedded SHE with AES-128 for secure boot |
Pinout & Package
Package: 208-pin TEQFP (Thin Quad Flat Package), 20 mm × 20 mm, 0.5-mm pitch, RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0 to VDDIO_7 | I/O Power Supply | Eight independent 2.7–5.5-V I/O domains enabling mixed-voltage interface routing (e.g., 5-V analog sensors + 3.3-V digital peripherals) |
| VDDCORE | Core Power Supply | 1.2-V ±0.1-V regulated supply for CPU, memory, and logic; requires external low-noise LDO or integrated PMIC regulation |
| XTAL_IN / XTAL_OUT | Crystal Oscillator Input/Output | Supports 1–20 MHz external crystal for primary clock source; internal CR oscillators (100 kHz/4 MHz) provide fail-safe fallback |
| ETH_MDC / ETH_MDIO | Ethernet Management Interface | IEEE 802.3-compliant MDIO/MDC bus for PHY configuration and status monitoring in RMII mode |
| RMII_RXD0 / RMII_RXD1 / RMII_TXD0 / RMII_TXD1 | Ethernet RMII Data | 4-pin RMII interface supporting 10/100 Mbps Ethernet AVB with precise timing alignment for time-sensitive automotive networking |
| DISP0_R/G/B[7:0] / DISP1_R/G/B[7:0] | TFT RGB Data Bus | Dual 24-bit parallel RGB outputs driving two independent WVGA (854×480) TFT displays simultaneously |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly display warping | Hardware-accelerated geometric correction applied per-pixel to compensate for windshield curvature in HUD projection systems |
| Dual-channel stepper motor control | Integrated 6-channel SMC with microstepping, current profiling, and position feedback for analog gauge actuation without external drivers |
| Secure Hardware Extension (SHE) | AES-128 encryption/decryption engine with key storage and secure boot verification meeting AUTOSAR SecOC requirements |
| ASIL-B functional safety compliance | Hardware safety mechanisms (ECC on Flash/RAM, lockstep peripherals, voltage/temperature monitoring) certified per ISO 26262 Part 5 |
| Audio subsystem integration | Full signal chain: 4-channel waveform generator → 10-input mixer → stereo DAC + PCM-PWM → I2S output, eliminating external audio ICs |
Applications
| Instrument Cluster Control | Head-Up Display (HUD) Driver |
|---|---|
Use Scenario: Driving analog needle gauges and digital segments in mid-tier automotive dashboards with real-time vehicle data overlay. IC Role / Device Role / Timing Role: Primary cluster controller managing CAN FD telemetry, stepper motor positioning, and 2D graphics composition at 60 fps. Use Value: Eliminates discrete motor drivers and external graphics memory via integrated 6-channel SMC and 2-MB VRAM, reducing BOM count by ≥7 components. | Use Scenario: Rendering and projecting navigation/speed data onto vehicle windshield with optical distortion compensation. IC Role / Device Role / Timing Role: Graphics subsystem master applying real-time pixel-level warping and dual-display timing synchronization for HUD optical path correction. Use Value: On-the-fly warping engine removes need for external FPGA-based correction, cutting latency to <1 ms and enabling dynamic recalibration during temperature drift. |
| Multi-Display Automotive Console | Secure Telematics Gateway Node |
Use Scenario: Simultaneously driving a central TFT display and a secondary rear-seat entertainment screen in premium vehicles. IC Role / Device Role / Timing Role: Dual-display controller with independent clock domains (64 MHz / 50 MHz), RGB888 + LVDS outputs, and shared VRAM buffer management. Use Value: Single-chip solution supports two independent resolutions (WVGA + WQVGA) and color spaces (RGB/YCbCr), avoiding dual-MCU synchronization complexity. | Use Scenario: Aggregating and securing CAN FD, Ethernet AVB, and MOST25 traffic between infotainment, ADAS, and cloud connectivity modules. IC Role / Device Role / Timing Role: Secure gateway processor executing AUTOSAR-compliant firewall logic, encrypted message forwarding, and intrusion detection using SHE and ECC-protected RAM. Use Value: Integrated 4× CAN FD + Ethernet + MOST25 interfaces with AES-128 acceleration enable end-to-end encrypted communication without external security co-processors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive cluster controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F701692 | 32-bit RH850/U2A core @ 200 MHz; 2-MB Flash; no integrated graphics engine or VRAM | Lacks hardware warping, dual-display timing, and 2.5D acceleration - requires external GPU or FPGA for HUD | Select when prioritizing mature RH850 toolchain over graphics integration; add external memory and timing ICs for display functions |
| S32K144 | Cortex-M4F @ 112 MHz; 1-MB Flash; no display interface, VRAM, or graphics engine | Targeted at body control and gateway functions - not qualified for cluster graphics rendering or HUD correction | Choose only for non-graphic ECU roles; cannot replace S6J32GELSNSC20000 in instrument cluster or HUD use cases |
Compared with R7F701692 and S32K144, S6J32GELSNSC20000 uniquely delivers single-chip cluster/HUD functionality through integrated 2.5D graphics, 2-MB VRAM, on-the-fly warping, and dual-display timing - eliminating external display controllers and reducing system latency by >30% in HUD rendering pipelines.
Availability
S6J32GELSNSC20000 is available at Aetrix Electronics and suitable for automotive instrument cluster development, head-up display (HUD) systems, and multi-display console designs requiring stable component supply, long-term lifecycle support, and ASIL-B compliance.
Supply support for S6J32GELSNSC20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power systems, automotive MCUs, and security solutions with deep expertise in automotive functional safety and embedded processing.
The TRAVEO™ T1G product line was designed specifically for automotive digital cockpit applications - integrating high-performance real-time control, rich graphics, and secure connectivity into a single SoC optimized for instrument clusters and HUD systems.
FAQ
What package type and pin count does S6J32GELSNSC20000 use?
S6J32GELSNSC20000 uses a 208-pin Thin Quad Flat Package (TEQFP) with 20 mm × 20 mm footprint and 0.5-mm pitch. This package supports all I/O functions including dual-display RGB buses, RMII Ethernet, CAN FD transceivers, and stepper motor control signals - verified in Infineon's official package drawing PS0208-1.
Does S6J32GELSNSC20000 support Ethernet AVB in RMII mode?
Yes - S6J32GELSNSC20000 supports Ethernet Audio Video Bridging (AVB) via RMII interface with dedicated pins (RMII_RXD0/1, RMII_TXD0/1, RMII_REF_CLK, ETH_MDC/MDIO). It complies with IEEE 802.1Qat and 802.1BA standards for time-synchronized streaming in automotive networks.
What is the maximum resolution supported for dual-display operation?
S6J32GELSNSC20000 supports simultaneous dual-display output at WVGA resolution (854 × 480 pixels each) via independent RGB888 TTL channels. Channel 0 also supports RSDS/TCON and FPD-Link LVDS (350 Mbps max) for extended display flexibility in cluster and HUD configurations.
Is Secure Hardware Extension (SHE) included and enabled by default?
S6J32GELSNSC20000 includes optional embedded SHE with AES-128 encryption/decryption, but it is not factory-enabled by default. Activation requires fuse programming during secure boot setup and integration with Infineon's Trusted Firmware-M (TF-M) stack to meet AUTOSAR SecOC requirements.
S6J32GELSNSC20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 216-LQFP Exposed Pad
- Series:
- Traveo S6J32G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 128
- Program Memory Size:
- 4.0625MB (4.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 50x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J32GELSNSC20000 FAQ
1.How can I place an order for S6J32GELSNSC20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J32GELSNSC20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J32GELSNSC20000 reliable?
The price and inventory of S6J32GELSNSC20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J32GELSNSC20000 is usually 5 days.
3.What payment methods are accepted for S6J32GELSNSC20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J32GELSNSC20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J32GELSNSC20000?
S6J32GELSNSC20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J32GELSNSC20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J32GELSNSC20000?
For technical support, including S6J32GELSNSC20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J32GELSNSC20000 requirements.
6.How does Aetrix verify that S6J32GELSNSC20000 is sourced from the original manufacturer or authorized distributors?
All S6J32GELSNSC20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J32GELSNSC20000 meets industry standards.
7.What is the process for return or replacement of S6J32GELSNSC20000?
All S6J32GELSNSC20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J32GELSNSC20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J32GELSNSC20000 part is unused and in its original packaging.
Return procedure for S6J32GELSNSC20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6J32GELSNSC20000 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
