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Infineon Technologies S6J32GELTNSC20000
- Part No.:
- S6J32GELTNSC20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 216-LQFP Exposed Pad
- Datasheet:
-
S6J32GELTNSC20000.pdf
- Description:
- IC MCU 32BIT 4.0625MB 216TEQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,403
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Product details
Overview
S6J32GELTNSC20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive microcontroller in the TRAVEO™ T1G family, featuring a 240-MHz Arm® Cortex®-R5F CPU, 4-MB Flash, 512-KB RAM, dual-display support (WVGA), and embedded 4-channel CAN FD. It integrates a 2.5D graphics engine with on-the-fly warping for HUD correction and targets mid-range instrument clusters.
For engineers reviewing the S6J32GELTNSC20000 datasheet, S6J32GELTNSC20000 pinout, S6J32GELTNSC20000 application, or S6J32GELTNSC20000 equivalent, key selection criteria include ASIL-B compliance, Ethernet RMII interface, 50-channel 12-bit SAR ADC (1-Msps), 216-pin TEQFP package, and integrated stepper motor controller for gauge driving.
Technical Context
This MCU implements five independent power domains with dedicated LDOs, supports 1.2-V core and 2.7–5.5-V I/O supply ranges, and features four PLLs (including SSCG) for precise clock tree management across CPU, graphics, display, and peripheral subsystems.
The device integrates a dual-channel DDR HSSPI, optional HyperBus™ interface (2 channels), Media-LB (MOST25), and two independent display controllers-each with configurable clock sources (64 MHz / 50 MHz), TTL RGB888, RSDS/TCON, and FPD-Link LVDS outputs-enabling simultaneous TFT and HUD rendering.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm® Cortex®-R5F @ 240 MHz with FPU, MPU, and TPU for real-time deterministic execution |
| Memory | 4160 KB program Flash + 112 KB work Flash; 384 KB system RAM + 2 MB VRAM for graphics buffering |
| Analog Peripherals | 50-channel 12-bit SAR ADC @ 1-Msps; 4-channel sound waveform generator + stereo audio DAC |
| Connectivity | 4× CAN FD controllers (ECC-protected RAM); 1× Ethernet AVB with RMII; 12× MFS serial blocks |
| Graphics & Display | 2.5D graphics engine with warp/scale/rotate/blend; dual-display output (WVGA 854×480 each) |
| Safety & Security | ASIL-B compliant per ISO 26262; optional SHE with AES-128 encryption; flash retention ≥20 years |
| Package | 216-pin TEQFP (24×24 mm, 0.5-mm pitch), RoHS-compliant, automotive-grade (-40°C to +125°C) |
Pinout & Package
216-pin Thin Quad Flat Package (TEQFP) with 0.5-mm pitch, 24 mm × 24 mm body, and exposed thermal pad. Pin assignment validated per Infineon Document No. 002-10689 Rev. *Q, Section 4.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_7 | I/O Power Supply | Eight independent 2.7–5.5 V domains enabling mixed-voltage interface operation |
| VDDCORE | Core Power Supply | 1.2 V ±0.1 V regulated input for CPU, memory, and logic subsystems |
| CLKIN | External Clock Input | Accepts 1–25 MHz crystal or oscillator for primary clock source feeding PLL0 |
| RMII_RXD0/RMII_RXD1 | Ethernet RMII Data Input | 2-bit receive data path for 10/100 Mbps Ethernet with synchronous sampling at REF_CLK |
| DISP0_R/G/B[7:0] | TTL RGB888 Output (Channel 0) | 24-bit parallel pixel bus supporting WVGA (854×480) at 60 fps for primary TFT display |
| SMC_A/B/C/D[0:5] | Stepper Motor Control Outputs | Six independent 4-phase drive signals for analog gauge needle positioning (12 total phases) |
Key Features
| Feature | Design Value |
|---|---|
| On-the-fly display warping | Real-time geometric correction of HUD output to compensate for windshield curvature without CPU overhead |
| Dual-display timing control | Independent pixel clocks (64 MHz / 50 MHz) and sync generators enabling asynchronous dual-TFT operation |
| Integrated CAN FD message RAM | 16 KB ECC-protected RAM per channel (128 message buffers) eliminating external SRAM for protocol stack |
| Hardware-accelerated graphics | 2.5D engine performs vector drawing, blending, and rotation in dedicated hardware, freeing CPU cycles |
| Automotive power domain isolation | Five independently controllable domains (CPU, graphics, display, peripherals, I/O) enable fine-grained low-power mode sequencing |
Applications
| Instrument Cluster Control | Head-Up Display (HUD) System |
|---|---|
Use Scenario: Driving digital speedometer, tachometer, fuel, and warning indicators in mid-tier vehicles. IC Role / Device Role / Timing Role: Primary cluster controller managing six analog gauges via SMC, rendering dual-TFT displays, and processing CAN FD vehicle data. Use Value: Eliminates discrete graphics processor and external display controller; reduces BOM count by integrating VRAM and warping logic. | Use Scenario: Projecting speed, navigation, and ADAS alerts onto windshield with optical distortion compensation. IC Role / Device Role / Timing Role: Graphics subsystem renders warped video frames at 60 fps while synchronizing with HUD projector timing via programmable display clock. Use Value: On-the-fly warping avoids post-processing latency and external FPGA, ensuring sub-frame jitter <1 µs. |
| Automotive Audio Interface | Multi-Protocol Gateway Node |
Use Scenario: Generating high-fidelity chimes, alerts, and voice prompts using internal audio resources. IC Role / Device Role / Timing Role: Sound subsystem combines 4-channel waveform generator, 10-input mixer, stereo DAC, and I2S0 interface for audio output. Use Value: Replaces external audio codec IC; supports PCM-PWM for direct speaker drive without amplification stage. | Use Scenario: Bridging CAN FD, Ethernet AVB, and MOST25 networks in domain controller architecture. IC Role / Device Role / Timing Role: Protocol translation hub with hardware-accelerated packet filtering, timestamping, and buffer management across three physical layers. Use Value: Enables time-synchronized communication between chassis, infotainment, and ADAS domains without software protocol stack overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive cluster controller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7016882AFP#AA0 | 32-bit RH850/U2A core @ 200 MHz; 2-MB Flash; no integrated graphics engine or VRAM | Requires external GPU and display controller for dual-TFT; lacks on-the-fly warping | Select when prioritizing functional safety certification depth over integrated graphics capability |
| TC377TP-64F200N-DC | TriCore™ AURIX™ TC3xx @ 200 MHz; 4-MB Flash; 2-MB RAM; no native RMII or HyperBus | Supports Ethernet MAC but requires external PHY; no built-in display controller or warping engine | Select when needing higher ASIL-D readiness and complex motor control over HUD-specific features |
Compared with R7F7016882AFP#AA0 and TC377TP-64F200N-DC, S6J32GELTNSC20000 uniquely integrates dual-display timing, hardware warping, and 2.5D graphics in a single die-reducing system latency, PCB area, and inter-chip signal integrity risk for HUD-centric designs.
Availability
S6J32GELTNSC20000 is available at Aetrix Electronics and suitable for automotive instrument cluster development, head-up display integration, and multi-protocol gateway design requiring stable component supply across extended production lifecycles.
Supply support for S6J32GELTNSC20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T1G product line was designed specifically for automotive digital cockpit applications-including instrument clusters and HUDs-emphasizing integrated graphics, real-time connectivity, and functional safety compliance.
FAQ
What is the maximum operating temperature range for S6J32GELTNSC20000?
The device is qualified for automotive grade AEC-Q100 Grade 2, with guaranteed operation from –40 °C to +125 °C ambient temperature. Junction temperature limits are defined in Section 8.2 of the datasheet, where maximum Tj is 150 °C under specified thermal conditions and power dissipation profiles.
Does S6J32GELTNSC20000 support AUTOSAR 4.x?
Yes, the S6J32GELTNSC20000 supports AUTOSAR 4.0.3 as confirmed in Table 2-1 of the datasheet. Its memory protection unit (MPU), interrupt controller, and CAN FD peripherals meet required AUTOSAR OS and BSW module prerequisites, and Infineon provides certified MCAL drivers for this series.
Is the HyperBus™ interface enabled on this specific part number?
Yes, S6J32GELTNSC20000 includes two HyperBus™ channels (RPC2), as indicated in Table 2-2 for function digit "G" revision N. This enables high-speed x8 octal SPI-like access to external NOR/NAND Flash or PSRAM up to 333 MT/s, supporting boot-from-external-memory configurations.
How many CAN FD message buffers are allocated per channel?
Each of the four CAN FD controllers has 16 KB of dedicated ECC-protected RAM, configured as 128 message buffers per channel (as stated in Section 2.1 Function List). Buffer size and layout are configurable via register settings, supporting standard and extended identifiers with flexible TX/RX allocation.
S6J32GELTNSC20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 216-LQFP Exposed Pad
- Series:
- Traveo S6J32G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit Single-Core
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 128
- Program Memory Size:
- 4.0625MB (4.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 128K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 5.5V
- Data Converters:
- A/D 50x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J32GELTNSC20000 FAQ
1.How can I place an order for S6J32GELTNSC20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J32GELTNSC20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J32GELTNSC20000 reliable?
The price and inventory of S6J32GELTNSC20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J32GELTNSC20000 is usually 5 days.
3.What payment methods are accepted for S6J32GELTNSC20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J32GELTNSC20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J32GELTNSC20000?
S6J32GELTNSC20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J32GELTNSC20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J32GELTNSC20000?
For technical support, including S6J32GELTNSC20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J32GELTNSC20000 requirements.
6.How does Aetrix verify that S6J32GELTNSC20000 is sourced from the original manufacturer or authorized distributors?
All S6J32GELTNSC20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J32GELTNSC20000 meets industry standards.
7.What is the process for return or replacement of S6J32GELTNSC20000?
All S6J32GELTNSC20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J32GELTNSC20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J32GELTNSC20000 part is unused and in its original packaging.
Return procedure for S6J32GELTNSC20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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