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Infineon Technologies S6J32HELTNSC20000

Part No.:
S6J32HELTNSC20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
216-LQFP Exposed Pad
Datasheet:
AetrixS6J32HELTNSC20000.pdf
Description:
TRAVEO-55NM
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,216

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Product details

Overview

S6J32HELTNSC20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive microcontroller in the TRAVEO™ T1G family, featuring a 240-MHz Arm® Cortex®-R5F CPU, 4-MB Flash, 512-KB RAM, dual-display support (WVGA), and embedded 2.5D graphics engine. It integrates 4-channel CAN FD, Ethernet RMII, 50-channel 12-bit SAR ADC (1-Msps), and ASIL-B compliance for mid-range instrument clusters and HUD systems.

For engineers reviewing the S6J32HELTNSC20000 datasheet, S6J32HELTNSC20000 pinout, S6J32HELTNSC20000 application, or S6J32HELTNSC20000 equivalent, key selection criteria include dual-TFT display timing control, on-the-fly warping capability for windshield correction, real-time stepper motor gauge control, and secure boot via optional SHE AES-128 encryption.

Technical Context

This MCU implements five independent power domains with dedicated LDOs, enabling selective domain shutdown for low-power cluster operation. Its clock architecture includes four PLLs (PLL0–PLL3) with spread-spectrum clock generation (SSCG), supporting precise timing for display refresh (64 MHz ch.0 / 50 MHz ch.1), graphics engine (200 MHz), and CPU (240 MHz).

The integrated 2.5D graphics subsystem handles dual-channel TTL RGB888 output, RSDS/TCON, and FPD-Link LVDS (350 Mbps), with hardware-accelerated warping, scaling, rotation, and blending-optimized for HUD optical distortion correction and real-time gauge animation without CPU load.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm® Cortex®-R5F @ 240 MHz with FPU, MPU, TPU, and dual-precision floating-point support for deterministic real-time cluster control.
Memory4160 KB program Flash + 112 KB work Flash + 384 KB system RAM + 2 MB VRAM - enables full WVGA dual-display frame buffering and firmware over-the-air updates.
Display InterfaceDual-channel: ch.0 supports TTL RGB888 + RSDS/TCON + FPD-Link LVDS; ch.1 supports TTL RGB888 - drives two independent TFTs at 60 fps.
ADC50-channel 12-bit SAR ADC with 1-Msps conversion rate - supports simultaneous sampling of analog sensor inputs (e.g., temperature, voltage, pedal position) in cluster HMI.
Connectivity4× CAN FD controllers (ECC-protected RAM per channel), 1× Ethernet AVB (MII/RMII), 12× MFS serial blocks - meets automotive backbone and domain controller communication requirements.
Safety & SecurityASIL-B compliant per ISO 26262; optional Secure Hardware Extension (SHE) with AES-128 encryption - enables secure boot, firmware authentication, and key management.
Power SupplyCore: 1.2 V ±0.1 V; I/O: 2.7–5.5 V (flexible for 5-V legacy gauges or 3.3-V displays); internal LDOs with low-voltage detection - simplifies multi-rail automotive power design.

Pinout & Package

Package: 216-pin TEQFP (Thin Quad Flat Package), 1.0 mm pitch, RoHS-compliant, automotive-grade (–40°C to +125°C ambient).

Pin/TerminalCircuit RoleDesign Meaning
VDDIO_0–VDDIO_7I/O Power SupplyEight independent 2.7–5.5 V I/O rails - enable mixed-voltage interface (e.g., 5-V stepper drivers + 3.3-V sensors + 1.8-V FPD-Link).
VDDCORECore Power Supply1.2 V ±0.1 V supply for CPU, memory, and logic - requires low-noise regulation for timing-critical graphics and ADC operation.
CLKINExternal Clock InputAccepts 1–50 MHz crystal or oscillator input - used as reference for PLL0/PLL1 to generate CPU, graphics, and display clocks.
RMII_RXD0/RMII_RXD1Ethernet RMII Data Input2-bit parallel receive data path for 10/100 Mbps Ethernet AVB - supports time-sensitive networking for HUD firmware updates and diagnostics.
RGB[23:0]Parallel Display Output24-bit TTL RGB888 bus (ch.0) - directly drives WVGA (854×480) TFT without external timing controller.
LVDS_CLK/LVDS_DATA[3:0]FPD-Link LVDS Output5-lane LVDS interface (clock + 4 data) at up to 350 Mbps - connects to HUD projection module with EMI-resistant differential signaling.

Key Features

FeatureDesign Value
On-the-fly Warping EngineHardware-accelerated pixel remapping for real-time HUD image correction against windshield curvature - eliminates CPU overhead and ensures consistent 60-fps overlay.
Stepper Motor Controller (SMC)Six independent channels with microstepping and current control - drives analog gauges (speedometer, tachometer) with smooth motion and zero software intervention.
Dual-Channel Display Timing GeneratorIndependent programmable clocks (64 MHz ch.0 / 50 MHz ch.1) and sync signals - enables asynchronous dual-display operation (e.g., cluster + HUD) with precise frame alignment.
Audio SubsystemIntegrated sound waveform generator (4 ch), mixer (10-in), stereo DAC, and PCM-PWM - delivers high-fidelity audio feedback (e.g., warning tones, voice prompts) without external codec.
Secure Boot with SHEHardware-based AES-128 encryption/decryption and secure key storage - enforces authenticated firmware loading and prevents unauthorized code execution in safety-critical clusters.

Applications

Instrument Cluster ControlHead-Up Display (HUD) System

Use Scenario: Driving digital speedometer, tachometer, fuel level, and warning indicators in mid-tier automotive dashboards.

IC Role / Device Role / Timing Role: Primary cluster controller managing gauge animation, sensor data acquisition, CAN FD message routing, and real-time display rendering.

Use Value: Integrated 6-channel SMC eliminates external motor drivers; 50-channel ADC enables direct connection to all analog sensors; dual-display engine synchronizes cluster and HUD content.

Use Scenario: Projecting navigation, ADAS alerts, and vehicle status onto windshield with optical distortion compensation.

IC Role / Device Role / Timing Role: HUD graphics processor generating warped video frames at 60 fps, driving FPD-Link LVDS interface, and receiving camera/video capture input.

Use Value: On-the-fly warping engine corrects for windshield bulge in real time; 2 MB VRAM stores full-resolution HUD frames; LVDS output ensures noise-immune transmission to projector.

Automotive Domain ControllerMulti-Display Infotainment Gateway

Use Scenario: Consolidating body control, lighting, and HVAC functions into a single ECU with CAN FD and Ethernet connectivity.

IC Role / Device Role / Timing Role: Central domain controller executing AUTOSAR 4.0.3 stack, managing multiple CAN FD buses, and coordinating Ethernet AVB traffic for OTA updates.

Use Value: Four CAN FD controllers with ECC-protected message RAM ensure robust inter-domain communication; Ethernet RMII enables secure firmware delivery and diagnostic logging.

Use Scenario: Driving primary instrument cluster and secondary center-stack display simultaneously with synchronized UI elements.

IC Role / Device Role / Timing Role: Dual-display graphics controller rendering independent UI layers (e.g., cluster gauges + infotainment menus) with shared VRAM and unified timing.

Use Value: Dual-channel TTL RGB888 + LVDS outputs drive both displays natively; 2.5D engine enables smooth transitions and overlays without GPU offload.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive cluster controller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
RH850/U2A32-bit RH850 core @ 400 MHz; 8 MB Flash; no integrated graphics engine or VRAM; relies on external GPU for display.Requires external display controller and video memory; better suited for non-graphic-intensive cluster designs with higher CPU throughput needs.Select when prioritizing raw CPU performance and functional safety (ASIL-D) over integrated graphics and dual-display timing control.
S32K344Arm® Cortex®-M7 @ 320 MHz; 8 MB Flash; no native display interface; supports MIPI DSI via external bridge; lacks on-the-fly warping.Needs external display bridge IC and external VRAM; targets entry-level clusters without HUD or advanced graphics.Select for cost-sensitive, single-display applications where Ethernet AVB and CAN FD are required but graphics acceleration is handled externally.

Compared with RH850/U2A and S32K344, S6J32HELTNSC20000 uniquely integrates dual-display timing, hardware warping, and 2 MB VRAM - reducing BOM count and latency for HUD and cluster convergence, while maintaining ASIL-B compliance and automotive temperature range.

Availability

S6J32HELTNSC20000 is available at Aetrix Electronics and suitable for automotive instrument clusters, head-up display systems, and domain controllers requiring stable component supply, long-term lifecycle support, and ASIL-B certified silicon.

Supply support for S6J32HELTNSC20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global R&D and manufacturing infrastructure.

The TRAVEO™ T1G product line was developed by Cypress (acquired by Infineon in 2020) specifically for automotive human-machine interface applications - targeting mid-range digital clusters and HUDs with integrated graphics, real-time control, and functional safety.

FAQ

What is the maximum operating temperature range for S6J32HELTNSC20000?

The S6J32HELTNSC20000 is qualified for automotive grade AEC-Q100 Grade 2, with an operating ambient temperature range of –40°C to +125°C. This rating applies to the full device including CPU, graphics engine, and I/O peripherals, and is validated across all supported voltage and frequency configurations per the datasheet's Operation Assurance Conditions section.

Does S6J32HELTNSC20000 support JTAG debugging and flash programming in-system?

Yes, S6J32HELTNSC20000 includes a standard 5-pin JTAG interface (TCK, TMS, TDI, TDO, TRST#) compliant with IEEE 1149.1. It supports full boundary-scan testing, real-time CPU debugging, and in-system programming of Flash memory using Cypress/Infineon-provided tools such as the KitProg3 debugger and PSoC Programmer software.

How is the 2.5D graphics engine utilized in cluster applications?

The 2.5D graphics engine executes vector drawing, scaling, rotation, and alpha blending in hardware, enabling smooth gauge needle animation, dynamic background transitions, and layered UI elements. It operates independently of the CPU using dedicated AXI bus and 2 MB VRAM, allowing concurrent application processing and real-time rendering at 60 fps without frame drops or CPU load spikes.

Is Ethernet RMII functionality enabled by default on S6J32HELTNSC20000?

Yes, Ethernet RMII is enabled on S6J32HELTNSC20000 per its function digit "H" designation (Table 2-2). The RMII interface uses pins RMII_TX_EN, RMII_TXD[1:0], RMII_RXD[1:0], and RMII_CRS_DV, and supports 10/100 Mbps AVB with IEEE 802.1AS time synchronization - configurable via the Ethernet MAC registers and supported in Infineon's TRAVEO™ T1G AUTOSAR MCAL stack.

S6J32HELTNSC20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
216-LQFP Exposed Pad
Series:
Traveo™ T1G
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
4.171875MB (4.171875M x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2.125M x 8
Voltage - Supply (Vcc/Vdd):
1.1V ~ 5.5V
Data Converters:
A/D 50x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6J32HELTNSC20000 FAQ

1.How can I place an order for S6J32HELTNSC20000 through Aetrix?

Please submit a Request for Quotation (RFQ) for S6J32HELTNSC20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S6J32HELTNSC20000 reliable?

The price and inventory of S6J32HELTNSC20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J32HELTNSC20000 is usually 5 days.

3.What payment methods are accepted for S6J32HELTNSC20000?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J32HELTNSC20000 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S6J32HELTNSC20000?

S6J32HELTNSC20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S6J32HELTNSC20000 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S6J32HELTNSC20000?

For technical support, including S6J32HELTNSC20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J32HELTNSC20000 requirements.

6.How does Aetrix verify that S6J32HELTNSC20000 is sourced from the original manufacturer or authorized distributors?

All S6J32HELTNSC20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J32HELTNSC20000 meets industry standards.

7.What is the process for return or replacement of S6J32HELTNSC20000?

All S6J32HELTNSC20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J32HELTNSC20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6J32HELTNSC20000 part is unused and in its original packaging.

Return procedure for S6J32HELTNSC20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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