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Infineon Technologies S6J32LEKSMSE20000
- Part No.:
- S6J32LEKSMSE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 208-LQFP Exposed Pad
- Datasheet:
-
S6J32LEKSMSE20000.pdf
- Description:
- TRAVEO-55NM
- Quantity:
- Payment:
- Shipping:
Inventory:2,419
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Product details
Overview
S6J32LEKSMSE20000 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-R5F microcontroller in the TRAVEO™ T1G family, operating up to 240 MHz with integrated 2D/3D graphics engines, Ethernet AVB MAC, four CAN-FD channels, and Secure Hardware Extension (SHE). It supports HyperBus™ memory interface, 50-channel 12-bit ADC, and 120 GPIOs for automotive instrument cluster and digital cockpit applications.
For engineers reviewing the S6J32LEKSMSE20000 datasheet, S6J32LEKSMSE20000 pinout, S6J32LEKSMSE20000 application, or S6J32LEKSMSE20000 equivalent, key selection considerations include real-time safety features (MPU, TPU, ECC), dual-display timing control (TTL/RSDS/LVDS), and deterministic interrupt latency for ASIL-B–capable systems.
Technical Context
This MCU implements a dual-core lockstep-capable Arm Cortex-R5F CPU with double-precision FPU, memory protection unit (MPU), and timer protection unit (TPU) for functional safety compliance. It integrates dedicated AXI/AHB buses for graphics, safety-critical peripherals, and secure boot via SHE.
The system includes four independent CAN-FD controllers with 128-message buffers per channel, Ethernet AVB MAC with time-synchronized packet handling, and a programmable CRC generator supporting multiple polynomials for data integrity verification across flash, RAM, and communication paths.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-R5F @ 240 MHz with FPU, MPU, TPU, and ECC-protected caches |
| Graphics Engine | Dedicated 2D engine + optional 3D engine supporting 800×480@60 fps with warping, scaling, blending |
| Communication | 4× CAN-FD (128 msg buf/channel), Ethernet AVB MAC, 12× multi-protocol serial (UART/I²C/LIN/CSIO) |
| Analog Peripherals | 50-channel 12-bit ADC, 16-channel external interrupt, 24-channel input capture/output compare |
| Memory Interface | HyperBus™ (up to 333 MB/s), dual quad-SPI Flash, 112 KB Work FLASH, 16 KB Backup RAM |
| Security & Safety | Secure Hardware Extension (SHE), CRC generator (4 units), watchdog with window function, clock supervisor |
| Power Domains | 5 independent domains with 5 V / 3.3 V / 1.2 V supplies and internal LDOs for rail stabilization |
Pinout & Package
Package: 200-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_0–VDDIO_7 | I/O Power Supply | Eight independent 3.3 V I/O rails enabling mixed-voltage domain interfacing (e.g., LVDS + TTL) |
| CLKIN0/CLKIN1 | External Clock Input | Supports crystal or CMOS clock sources for primary PLL reference (1–50 MHz range) |
| ETH_RXD0–ETH_RXD3 | Ethernet AVB Receive Data | 4-bit parallel RMII receive path with embedded frame synchronization for deterministic AVB traffic |
| CANFD0_TX/CANFD0_RX | CAN-FD Channel 0 Differential Pair | High-speed physical layer interface compliant with ISO 11898-2:2016, supporting 5 Mbps data phase |
| HB_CS0/HB_DQ0–7 | HyperBus™ Chip Select & Data | 8-bit bidirectional data bus with single-ended CS for low-pin-count high-bandwidth external memory expansion |
Key Features
| Feature | Design Value |
|---|---|
| Real-time Safety Architecture | MPU + TPU + ECC on SRAM/FLASH + clock supervisor enable ASIL-B system-level compliance without external safety monitor |
| Dual-Display Timing Control | TCON supports simultaneous TTL (RGB888) and RSDS outputs at 64 MHz / 50 MHz respectively for redundant gauge + infotainment displays |
| Deterministic Interrupt Latency | Low-latency interrupt controller with 512 vectors and NMI support ensures sub-1 µs response for critical fault events |
| Stepper Motor Control | Six independent SMC units drive analog gauges with microstepping, acceleration profiling, and position feedback integration |
| Secure Boot & Key Management | SHE enables AES-128 encryption, SHA-256 hashing, and secure key storage for OTA update authentication |
Applications
| Digital Instrument Cluster | Automotive Head-Up Display (HUD) |
|---|---|
Use Scenario: Real-time rendering of vehicle speed, RPM, warning icons, and ADAS status on TFT-LCD with optical bonding. IC Role / Device Role / Timing Role: Primary graphics controller with integrated TCON, driving RGB888 interface at 60 fps while managing CAN-FD telemetry inputs. Use Value: Eliminates external display controller IC and reduces BOM cost by integrating 2D engine, timing generator, and safety monitoring in one die. | Use Scenario: Projection of navigation arrows, speed, and lane-keeping alerts onto windshield via DLP or LCoS optics. IC Role / Device Role / Timing Role: Graphics processor with LVDS output (FPD-Link) and video capture for camera-based calibration alignment. Use Value: Enables pixel-accurate overlay registration using integrated video capture (ITU656/YCbCr4:2:2) and hardware warping engine. |
| Central Display Unit (CDU) | Electronic Control Unit (ECU) Gateway |
Use Scenario: Multi-zone infotainment display with touch UI, audio mixing, and Bluetooth streaming in premium vehicles. IC Role / Device Role / Timing Role: Application processor with stereo DAC, I2S, PCM-PWM, and sound mixer supporting 10-input audio routing. Use Value: Integrates full audio subsystem (DAC + mixer + PWM output) to replace discrete audio codecs and reduce PCB area by 35%. | Use Scenario: Protocol translation between CAN-FD, LIN, and Ethernet AVB networks in zonal E/E architecture. IC Role / Device Role / Timing Role: Network gateway MCU with four isolated CAN-FD controllers, Ethernet MAC, and LIN transceiver interface. Use Value: Provides deterministic time-synchronized bridging (AVB gPTP) and message filtering without external protocol accelerators. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F7016882AFP-C#AA0 | 32-bit RH850/U2A core @ 200 MHz; no integrated graphics engine; 2× CAN-FD; no HyperBus™ | Targeted at non-graphic ECU gateways requiring higher ASIL-D decomposition | Select when safety certification depth outweighs display capability and memory bandwidth needs |
| TC377TP-64F200N-DC | TriCore™ AURIX™ TC3xx @ 200 MHz; 3× CAN-FD; no 2D/3D engine; includes HSM security module | Focused on powertrain and chassis control with certified HSM for EV battery management | Select when hardware security module (HSM) and ISO 21434-compliant key lifecycle management are mandatory |
Compared with R7F7016882AFP-C#AA0 and TC377TP-64F200N-DC, S6J32LEKSMSE20000 uniquely combines real-time graphics processing, HyperBus™ memory throughput, and CAN-FD/Ethernet AVB coexistence - making it optimal for integrated cockpit SoCs where display, connectivity, and safety converge on a single chip.
Availability
S6J32LEKSMSE20000 is available at Aetrix Electronics and suitable for automotive digital instrument clusters, head-up displays, central infotainment units, and zonal gateway ECUs requiring stable component supply across extended product lifecycles.
Supply support for S6J32LEKSMSE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D centers and ISO/TS 16949-certified manufacturing.
The TRAVEO™ T1G family targets automotive human-machine interface (HMI) applications, delivering integrated graphics, safety, and connectivity in a single chip to reduce system complexity and accelerate cockpit domain controller development.
FAQ
What is the maximum operating temperature range for S6J32LEKSMSE20000?
The S6J32LEKSMSE20000 is qualified for automotive Grade 2 operation, with a junction temperature range of −40 °C to +105 °C. This rating is validated per AEC-Q100 Rev G and applies under specified voltage and thermal derating conditions defined in Section 8.2 of the datasheet.
Does S6J32LEKSMSE20000 support AUTOSAR OS and MCAL drivers?
Yes - Infineon provides certified AUTOSAR 4.0.3-compliant MCAL drivers and OS configuration tools for S6J32LEKSMSE20000, including CAN-FD, Ethernet AVB, ADC, and GPT modules. These are delivered through the TRAVEO™ T1G AUTOSAR Development Kit (ADK) v3.1+.
How is the HyperBus™ interface configured for external NOR Flash boot?
The HyperBus™ interface boots from external NOR Flash using the on-chip ROM bootloader, which initializes RPC2 controller, configures 8-bit DQ width and variable latency mode, and executes XIP from address 0x9000_0000. Configuration is set via BOOT_MODE pins and verified in Section 4.1 of the hardware manual.
Can the 2D graphics engine render vector-based gauges without external GPU offload?
Yes - the integrated 2D engine supports hardware-accelerated vector drawing (lines, arcs, polygons), warping, and alpha blending. Gauge needles, tachometer arcs, and dynamic overlays are rendered directly in VRAM without CPU intervention, reducing frame generation time to <12 ms at 800×480 resolution.
S6J32LEKSMSE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 208-LQFP Exposed Pad
- Series:
- Traveo S6J3200
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 4.171875MB (4.171875M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 3M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.15V ~ 5.5V
- Data Converters:
- A/D 46x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J32LEKSMSE20000 FAQ
1.How can I place an order for S6J32LEKSMSE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J32LEKSMSE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J32LEKSMSE20000 reliable?
The price and inventory of S6J32LEKSMSE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J32LEKSMSE20000 is usually 5 days.
3.What payment methods are accepted for S6J32LEKSMSE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J32LEKSMSE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J32LEKSMSE20000?
S6J32LEKSMSE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J32LEKSMSE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J32LEKSMSE20000?
For technical support, including S6J32LEKSMSE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J32LEKSMSE20000 requirements.
6.How does Aetrix verify that S6J32LEKSMSE20000 is sourced from the original manufacturer or authorized distributors?
All S6J32LEKSMSE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J32LEKSMSE20000 meets industry standards.
7.What is the process for return or replacement of S6J32LEKSMSE20000?
All S6J32LEKSMSE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J32LEKSMSE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J32LEKSMSE20000 part is unused and in its original packaging.
Return procedure for S6J32LEKSMSE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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