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Infineon Technologies S6J32MEKSMSE20000
- Part No.:
- S6J32MEKSMSE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 208-LQFP Exposed Pad
- Datasheet:
-
S6J32MEKSMSE20000.pdf
- Description:
- TRAVEO-55NM
- Quantity:
- Payment:
- Shipping:
Inventory:3,576
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Product details
Overview
S6J32MEKSMSE20000 from Infineon Technologies (formerly Cypress) is a 32-bit Arm® Cortex®-R5F microcontroller in the TRAVEO™ T1G family, operating up to 240 MHz with integrated 2D graphics engine, CAN-FD (4 channels), Ethernet AVB MAC (optional), and Secure Hardware Extension (SHE). It features 120 GPIOs, 50-channel 12-bit ADC, 16-channel DMA, and HyperBus™ memory interface - deployed in automotive instrument clusters requiring real-time display rendering, safety-critical communication, and secure boot.
For engineers reviewing the S6J32MEKSMSE20000 datasheet, S6J32MEKSMSE20000 pinout, S6J32MEKSMSE20000 application, or S6J32MEKSMSE20000 equivalent, key selection criteria include R5F core timing compliance, CAN-FD message buffer allocation (128 per channel), SHE cryptographic acceleration support, and dual-display timing generator (TCON) configuration for TTL/RSDS outputs.
Technical Context
The device implements a dual-core lockstep-capable Arm Cortex-R5F CPU with FPU, MPU, TPU, and ECC-protected RAM subsystems, targeting ASIL-B functional safety. Its clock architecture includes four independent PLLs (PLL0–PLL3) with spread-spectrum clock generation (SSCG), plus dedicated graphic AXI and display clocks (64 MHz ch.0 / 50 MHz ch.1).
Communication subsystems integrate four CAN-FD controllers with 128-message RAM per channel, optional Ethernet AVB MAC supporting time-synchronized audio/video streaming, and 12 multi-protocol serial interfaces configurable as UART, CSIO, LIN, or I²C - all accessible via AHB/AXI interconnect with hardware-level arbitration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-R5F @ 240 MHz with double/single-precision FPU, lockstep mode, and memory protection unit (MPU) |
| Graphics Engine | Dedicated 2D engine with vector drawing, warping, scale/rotate/blend; supports WVGA (800×480) at 60 fps |
| CAN-FD Interface | 4 independent channels, each with 128-message RAM buffer and bit-rate switching up to 5 Mbps data phase |
| Memory Interface | Cypress HyperBus™ (RPC2) supporting 333 MB/s read throughput; dual quad-SPI Flash interface |
| Security | Secure Hardware Extension (SHE) for AES-128, SHA-256, and secure key storage; CRC generator (4 units) |
| Analog Peripherals | 12-bit ADC with 50 input channels, ±1 LSB INL; real-time clock with automatic calibration; 16-channel DMA |
| Display Outputs | Up to 2 simultaneous outputs: TTL (RGB888), RSDS/TCON, or optional FPD-Link LVDS (350 Mbps) |
Pinout & Package
Package: 200-pin LQFP (24 mm × 24 mm, 0.5 mm pitch), RoHS-compliant, moisture sensitivity level 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_3V3 | I/O Power Supply | 3.3 V ±0.3 V supply for GPIO, serial interfaces, and display output drivers |
| VDDA_5V | Analog Power Supply | 5.0 V ±0.5 V supply for ADC reference and internal LDO regulation |
| CLKIN | External Clock Input | Accepts 1–25 MHz crystal or CMOS clock for PLL0 reference; enables precise timing for CAN-FD and AVB |
| TX0_CANFD0 | CAN-FD Channel 0 Transmit | Differential output driving ISO 11898-2 compliant bus; supports bit-rate switching up to 5 Mbps |
| RX0_CANFD0 | CAN-FD Channel 0 Receive | Differential input with built-in termination; synchronized sampling for deterministic latency |
| ETH_MDC | Ethernet Management Data Clock | MDIO/MDC interface for PHY register access; required for AVB time synchronization setup |
| HS_SPI0_IO0 | HyperBus™ Data Line 0 | Bi-directional DQ0 line for RPC2 interface; operates at 166 MHz DDR for 333 MB/s peak bandwidth |
Key Features
| Feature | Design Value |
|---|---|
| Real-time Graphics Rendering | On-chip 2D engine eliminates external GPU need for WVGA instrument cluster UIs; reduces BOM cost and board space |
| Functional Safety Support | TPU, MPU, ECC on RAM, and watchdog with window function enable ASIL-B compliance without external safety monitor |
| High-Speed Memory Access | HyperBus™ interface cuts pin count by 50% vs parallel NOR Flash while delivering >3× read bandwidth for fast boot and OTA updates |
| Secure Boot Enforcement | SHE accelerates AES-128 decryption and SHA-256 hashing in hardware, enabling verified boot within 150 ms |
| Dual-Display Timing Control | Integrated TCON supports simultaneous TTL + RSDS outputs for primary cluster and HUD projection with frame-synced timing |
Applications
| Automotive Instrument Cluster | Industrial HMI Panel |
|---|---|
Use Scenario: Digital dashboard with animated gauges, warning indicators, and navigation overlays. IC Role / Device Role / Timing Role: Primary MCU executing AUTOSAR-compliant software stack, driving dual-display TCON, and managing CAN-FD messages from ECU networks. Use Value: Integrated 2D engine renders vector-based UIs at 60 fps without external memory bandwidth bottleneck; SHE secures firmware updates against tampering. | Use Scenario: Factory-floor operator interface with touch-responsive controls, real-time sensor visualization, and alarm logging. IC Role / Device Role / Timing Role: Real-time controller interfacing with industrial sensors via 50-channel ADC and serial peripherals (UART/LIN/I²C), while driving LCD via TTL output. Use Value: 120 GPIOs and flexible multi-function serial interface eliminate external level shifters and protocol translators; ECC RAM ensures data integrity during long-term operation. |
| Automotive Head-Up Display (HUD) | Connected Vehicle Gateway |
Use Scenario: Projection-based HUD displaying speed, ADAS alerts, and AR navigation cues onto windshield. IC Role / Device Role / Timing Role: Graphics co-processor generating overlay frames synchronized to vehicle motion data from CAN-FD, using RSDS output for low-noise video transmission. Use Value: Dedicated display clock (50 MHz ch.1) and RSDS driver meet EMI requirements for optical projection; low-latency interrupt handling (<1 µs) ensures jitter-free rendering. | Use Scenario: In-vehicle gateway aggregating CAN-FD, Ethernet AVB, and LIN traffic for cloud telemetry and OTA update distribution. IC Role / Device Role / Timing Role: Network bridge with four CAN-FD channels, optional AVB MAC, and secure boot enforcing signed firmware images before execution. Use Value: SHE accelerates cryptographic verification of OTA payloads; 16-channel DMA offloads packet routing from CPU, sustaining 100 Mbps AVB throughput. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| R7F701692 | Renesas RH850/U2A core @ 200 MHz; no integrated 2D graphics engine; 32-channel ADC; 2 CAN-FD channels | Lacks on-chip graphics acceleration - requires external GPU or software rendering for complex UIs | Select when cost-sensitive designs prioritize CAN-FD + Ethernet but omit high-fps display rendering |
| S32K344 | NXP S32K3 core @ 320 MHz; ASIL-D ready; 4 CAN-FD, 2x Ethernet AVB; no HyperBus™ or dedicated 2D engine | Higher safety certification tier but no integrated graphics - targets gateway/routing over display-centric use cases | Select when functional safety beyond ASIL-B and dual Ethernet AVB are mandatory, and graphics handled externally |
Compared with R7F701692 and S32K344, S6J32MEKSMSE20000 uniquely integrates real-time 2D graphics, HyperBus™ memory interface, and SHE in a single die - making it optimal for cost-constrained, display-rich automotive clusters where pin count, boot security, and UI responsiveness are critical.
Availability
S6J32MEKSMSE20000 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial HMIs, head-up displays, and connected vehicle gateways requiring stable component supply across extended product lifecycles.
Supply support for S6J32MEKSMSE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T1G family - including S6J32MEKSMSE20000 - was designed specifically for automotive human-machine interface applications demanding integrated graphics, functional safety, and secure communication in compact form factors.
FAQ
What is the maximum operating frequency of the Arm Cortex-R5F core in S6J32MEKSMSE20000?
The Arm Cortex-R5F core operates at up to 240 MHz under specified voltage and temperature conditions (VDD = 1.2 V ±0.1 V, TA = –40°C to +125°C), with full cache and peripheral clocking enabled per AC characteristics in datasheet 002-05682 Rev. *R.
Does S6J32MEKSMSE20000 support AUTOSAR 4.x compliance out of the box?
Yes - the device includes hardware-enforced memory protection (MPU), time protection unit (TPU), and boot ROM with AUTOSAR 4.0.3-compatible startup code. Infineon provides certified AUTOSAR Basic Software modules (BSW) and MCAL drivers validated for this part number.
How many CAN-FD message buffers are allocated per channel, and are they configurable?
Each of the four CAN-FD channels has 128 dedicated message buffers implemented in ECC-protected RAM. Buffer size and priority are fully configurable via CCAN module registers, supporting mixed standard and extended ID filtering with hardware acceptance masking.
Is the HyperBus™ interface compatible with standard Octal SPI Flash devices?
No - HyperBus™ (RPC2) is a proprietary Infineon/Cypress interface requiring HyperFlash™ or HyperRAM™ devices. It is electrically and protocol-incompatible with Octal SPI; pin mapping, command set, and DDR timing differ fundamentally per datasheet section 8.7.
S6J32MEKSMSE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 208-LQFP Exposed Pad
- Series:
- Traveo S6J3200
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
- Peripherals:
- DMA, I2S, LCD, LVD, POR, PWM, WDT
- Number of I/O:
- 120
- Program Memory Size:
- 4.171875MB (4.171875M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 3M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.15V ~ 5.5V
- Data Converters:
- A/D 46x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J32MEKSMSE20000 FAQ
1.How can I place an order for S6J32MEKSMSE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J32MEKSMSE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J32MEKSMSE20000 reliable?
The price and inventory of S6J32MEKSMSE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J32MEKSMSE20000 is usually 5 days.
3.What payment methods are accepted for S6J32MEKSMSE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J32MEKSMSE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J32MEKSMSE20000?
S6J32MEKSMSE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J32MEKSMSE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J32MEKSMSE20000?
For technical support, including S6J32MEKSMSE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J32MEKSMSE20000 requirements.
6.How does Aetrix verify that S6J32MEKSMSE20000 is sourced from the original manufacturer or authorized distributors?
All S6J32MEKSMSE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J32MEKSMSE20000 meets industry standards.
7.What is the process for return or replacement of S6J32MEKSMSE20000?
All S6J32MEKSMSE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J32MEKSMSE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J32MEKSMSE20000 part is unused and in its original packaging.
Return procedure for S6J32MEKSMSE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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