Infineon Technologies S6J331EKSESE20000
- Part No.:
- S6J331EKSESE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 208-LQFP Exposed Pad
- Datasheet:
-
S6J331EKSESE20000.pdf
- Description:
- TRAVEO-40NM
- Quantity:
- Payment:

- Shipping:

Inventory:3,758
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6J331EKSESE20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive microcontroller in the TRAVEO™ T1G family, built on an Arm® Cortex®-R5F core operating at 240 MHz. It integrates 4,160 KB program Flash, 512 KB RAM, 12-bit ADC with 48 channels, 6 CAN-FD interfaces, and hardware security (SHE), targeting instrument cluster control for TFT-based dashboards.
For engineers reviewing the S6J331EKSESE20000 datasheet, S6J331EKSESE20000 pinout, S6J331EKSESE20000 application, or S6J331EKSESE20000 equivalent, key selection criteria include real-time performance (240 MHz R5F), automotive safety features (MPU/TPU/ECC), display interface capability (RGB888, 4×32 SEG LCD), and functional safety compliance for ASIL-B–capable systems.
Technical Context
The device implements a dual-bus architecture with HPM (200 MHz) and LLPM (240 MHz) domains, enabling deterministic real-time execution while supporting peripheral concurrency. Its clock system includes four PLLs with SSCG support, programmable CRC generators, and independent low-voltage detection for VCC5, VCC3, and internal LDO outputs.
Security is enforced via Secure Hardware Extension (SHE), memory protection units (MPU for AHB/AXI), and ECC on CAN-FD RAM (16 KB/channel). Safety mechanisms include windowed watchdog timers, TPU for time-triggered peripherals, and boot-ROM integrity verification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-R5F @ 240 MHz - deterministic real-time execution with lockstep-capable pipeline |
| Memory | 4,160 KB Program Flash + 512 KB RAM - sufficient for AUTOSAR 4.0.3 stack and graphics firmware |
| ADC | 12-bit, 48-channel - supports analog sensor aggregation for gauge calibration and battery monitoring |
| CAN-FD | 6 channels with ECC-protected 16 KB RAM per channel - enables high-bandwidth vehicle network communication with error resilience |
| Display Interface | RGB888 + 4 COM × 32 SEG LCD controller - drives WQVGA (480×272) TFT clusters at 60 fps |
| Security | Secure Hardware Extension (SHE) - provides cryptographic acceleration for AES-128, SHA-256, and secure key storage |
| Safety Features | MPU, TPU, ECC on SRAM/Flash, windowed WDT - supports ASIL-B decomposition per ISO 26262 |
Pinout & Package
Package: TEQFP-144 (144-pin Thin Quad Flat Package, 20 mm × 20 mm, 0.5 mm pitch).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC5 / VCC3 / VCC12 | Power supply inputs | Dedicated 5 V, 3 V, and 1.2 V rails enable domain-specific voltage scaling and isolation |
| P0_00–P4_31 | General-purpose I/O | 148 GPIOs with configurable drive strength, slew rate, and pull-up/down for sensor, switch, and LED control |
| AN0–AN47 | Analog input channels | 48-channel 12-bit ADC inputs mapped to dedicated pins (e.g., AN4–AN7, AN10–AN11) for precision sensor acquisition |
| CAN0_RX/TX – CAN5_RX/TX | CAN-FD transceiver interfaces | 6 differential pairs supporting up to 5 Mbps data phase with integrated bus fault protection |
| SEG0–SEG31 / COM0–COM3 | LCD segment/com common drivers | Direct drive of 4×32 SEG passive-matrix LCD without external driver IC |
| TCK/TMS/TDO/TDI | JTAG debug interface | IEEE 1149.1-compliant boundary scan and full-core debug access for production test and firmware development |
Key Features
| Feature | Design Value |
|---|---|
| Real-time interrupt latency | Sub-100 ns response with low-latency interrupt controller - ensures deterministic gauge update timing |
| Stepper motor control | 6 independent SMC units - directly drives analog needle gauges without external motor drivers |
| Graphics engine clock | 80 MHz dedicated AXI clock - sustains 2D rendering throughput for dynamic cluster UI elements |
| Boot-ROM integrity | 16 KB ROM with signature verification - prevents unauthorized firmware execution at power-on reset |
| External memory interface | HyperBus™ and DDR HSSPI - enables fast off-chip graphics frame buffer or map data storage |
Applications
| Automotive Instrument Cluster | Digital Gauge Control System |
|---|---|
Use Scenario: Centralized dashboard display unit rendering speedometer, tachometer, fuel level, and warning indicators using TFT LCD. IC Role / Device Role / Timing Role: Primary real-time controller executing gauge animation, CAN-FD message parsing, and ADC-based sensor fusion. Use Value: Integrated SMC units eliminate external stepper drivers; RGB888 output enables crisp 272-line resolution at 60 fps. | Use Scenario: Analog needle actuation for legacy-style speed and RPM dials with digital position feedback. IC Role / Device Role / Timing Role: Dedicated stepper motor controller (SMC) managing six independent gauge movements with microstepping precision. Use Value: On-chip SMC reduces BOM count by 6× discrete motor drivers and simplifies PCB layout for compact cluster modules. |
| Vehicle Network Gateway Node | Functional Safety Monitor Unit |
Use Scenario: Aggregation and translation of CAN-FD, LIN, and UART messages between body control module and cluster ECU. IC Role / Device Role / Timing Role: Multi-protocol serial interface hub with hardware timestamping and message filtering. Use Value: 12 configurable MFIS channels support concurrent CAN-FD (6 ch), LIN (4 ch), and UART (2 ch) without CPU overhead. | Use Scenario: Independent safety monitor verifying main MCU operation, voltage levels, and clock stability in dual-core ASIL-B architectures. IC Role / Device Role / Timing Role: Standalone safety supervisor using TPU, MPU, and windowed WDT to validate timing and memory access patterns. Use Value: Hardware-enforced partitioning isolates safety-critical checks from application software, meeting ISO 26262 diagnostic coverage requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Arm Cortex-M7 core @ 320 MHz; no integrated LCD controller or SMC; includes Ethernet MAC and PCIe | Targets ADAS domain controllers and gateway ECUs - lacks native TFT/stepper support for clusters | Select when Ethernet connectivity or higher compute throughput is required over integrated display/motor control |
| Renesas RH850/U2A | 32-bit RXv3 core @ 400 MHz; 16 MB Flash; no SHE; supports GDC but no RGB888 output | Focused on powertrain and chassis control - requires external display bridge for TFT clusters | Prefer for high-reliability powertrain applications where display integration is handled externally |
Compared with S32K344 and RH850/U2A, S6J331EKSESE20000 uniquely combines real-time Arm-R5F execution, on-die LCD/SMC peripherals, and SHE-based security - reducing system-level complexity specifically for cost-sensitive, safety-aware instrument clusters.
Availability
S6J331EKSESE20000 is available at Aetrix Electronics and suitable for automotive instrument clusters, digital gauge control systems, and vehicle network gateway nodes requiring stable component supply across extended temperature ranges (−40°C to +125°C) and long product lifecycles.
Supply support for S6J331EKSESE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T1G family was designed specifically for automotive human-machine interface (HMI) applications, emphasizing real-time graphics rendering, functional safety, and integrated peripheral control for next-generation digital instrument clusters.
FAQ
What is the maximum operating temperature range for S6J331EKSESE20000?
The device is qualified for −40°C to +125°C ambient operation per AEC-Q100 Grade 2 requirements. This rating applies to all core logic, memory, and I/O circuits, including CAN-FD transceivers and ADC subsystems, ensuring reliability in under-hood and dashboard environments.
Does S6J331EKSESE20000 support AUTOSAR OS and MCAL drivers?
Yes - Infineon provides certified AUTOSAR 4.0.3-compliant MCAL drivers (including CAN, ADC, DIO, ICU, PWM) and OS configuration tools for S6J331EKSESE20000. These are delivered via the TRAVEO™ T1G Software Development Kit (SDK) and validated against Vector DaVinci tools.
Is the 2D graphics engine capable of hardware-accelerated alpha blending?
Yes - the integrated 2D graphic engine supports per-pixel alpha blending, rotation, scaling, and color space conversion (RGB to YUV) in hardware. It operates independently of the CPU via DMA, enabling smooth UI transitions without consuming R5F cycles.
How is the Secure Hardware Extension (SHE) implemented in this part?
SHE is implemented as a dedicated on-die cryptographic co-processor compliant with ISO/IEC 15408 EAL4+. It provides AES-128 encryption/decryption, SHA-256 hashing, and secure key generation/storage with tamper-resistant memory. Keys are inaccessible to software unless explicitly authorized via SHE command sequences.
S6J331EKSESE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 208-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 150
- Program Memory Size:
- 4.0625MB (4.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 112K x 8
- RAM Size:
- 544K x 8
- Voltage - Supply (Vcc/Vdd):
- 4.5V ~ 5.5V
- Data Converters:
- A/D 48x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J331EKSESE20000 FAQ
1.How can I place an order for S6J331EKSESE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J331EKSESE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J331EKSESE20000 reliable?
The price and inventory of S6J331EKSESE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J331EKSESE20000 is usually 5 days.
3.What payment methods are accepted for S6J331EKSESE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J331EKSESE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J331EKSESE20000?
S6J331EKSESE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J331EKSESE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J331EKSESE20000?
For technical support, including S6J331EKSESE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J331EKSESE20000 requirements.
6.How does Aetrix verify that S6J331EKSESE20000 is sourced from the original manufacturer or authorized distributors?
All S6J331EKSESE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J331EKSESE20000 meets industry standards.
7.What is the process for return or replacement of S6J331EKSESE20000?
All S6J331EKSESE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J331EKSESE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J331EKSESE20000 part is unused and in its original packaging.
Return procedure for S6J331EKSESE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6J331EKSESE20000 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

