Infineon Technologies S6J332CKSESE20000
- Part No.:
- S6J332CKSESE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 208-LQFP Exposed Pad
- Datasheet:
-
S6J332CKSESE20000.pdf
- Description:
- TRAVEO-40NM
- Quantity:
- Payment:

- Shipping:

Inventory:3,817
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6J332CKSESE20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive microcontroller in the TRAVEO™ T1G family, built around an Arm® Cortex®-R5F core operating at up to 240 MHz. It integrates 4,160 KB program Flash, 512 KB RAM, 12-bit ADC with 48 channels, 6 CAN-FD interfaces, and supports instrument cluster applications with TFT display control via RGB888 output and LCD controller (4 COM × 32 SEG).
For engineers reviewing the S6J332CKSESE20000 datasheet, S6J332CKSESE20000 pinout, S6J332CKSESE20000 application, or S6J332CKSESE20000 equivalent, key selection criteria include real-time safety features (MPU, TPU, ECC), secure hardware extension (SHE), automotive network support (CAN-FD, optional Ethernet AVB), and graphics engine clocking at 80 MHz for WQVGA 480×272 displays at 60 fps.
Technical Context
The S6J332CKSESE20000 implements a dual-domain power architecture with five independent power domains and supports AUTOSAR 4.0.3 compliance. Its HPM bus runs at 200 MHz and LLPM bus at 240 MHz, enabling deterministic real-time execution across safety-critical subsystems.
It features three PLLs (PLL0–2) with SSCG capability, programmable CRC generators (4 units), and a dedicated low-latency interrupt controller. The device includes a JTAG debug interface, 16-channel DMA, and hardware watchdog with window function - all aligned to ISO 26262 ASIL-B functional safety requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-R5F @ 240 MHz - enables hard real-time deterministic response for instrument cluster UI rendering and gauge control. |
| Memory | 4,160 KB Program Flash + 512 KB RAM - supports complex AUTOSAR-compliant firmware with overlay management and OTA update staging. |
| ADC | 12-bit, 48-channel - provides high-resolution sensor acquisition for vehicle speed, temperature, and battery monitoring. |
| CAN-FD Interfaces | 6 channels with ECC-protected RAM (16 KB/ch) - delivers robust in-vehicle networking for cluster-to-ECU data exchange at up to 5 Mbps. |
| Graphics Engine | 2D engine @ 80 MHz clock, RGB888 TTL output - drives WQVGA (480×272) displays at 60 fps with minimal external memory footprint. |
| Safety Features | MPU, TPU, ECC on Flash/SRAM, CRC generator - meets ASIL-B requirements for fault detection and memory integrity protection. |
| Security | Secure Hardware Extension (SHE) - enables secure boot, cryptographic key storage, and encrypted firmware updates. |
Pinout & Package
This device is packaged in a 176-pin TEQFP (Thin Quad Flat Package) with 0.4 mm pitch, thermally enhanced for automotive under-hood operation. Pin assignments are defined per the official Infineon datasheet (Document No. 002-10635 Rev. *Q), Section 4.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC5 / VCC3 / VCC12 | Power supply inputs | Dedicated 5 V, 3 V, and 1.2 V rails isolate analog, digital, and core logic domains for noise immunity and safety domain separation. |
| TX0_0 / RX0_0 … TX5_1 / RX5_1 | CAN-FD transceiver I/O | 6 independent differential CAN-FD channel pairs support concurrent communication with body, powertrain, and ADAS ECUs. |
| SEG0–SEG31 / COM0–COM3 | LCD segment/com drive outputs | Direct drive of 4×32-segment LCD panels without external driver IC, reducing BOM count and PCB area. |
| RGB[23:0] | Parallel RGB888 video output | 24-bit TTL-level pixel data bus synchronized to display clock (up to 25 MHz) for direct TFT panel interfacing. |
| TCK / TMS / TDI / TDO | JTAG debug interface | Standard 4-wire boundary-scan and debug access compliant with IEEE 1149.1 for production test and field diagnostics. |
Key Features
| Feature | Design Value |
|---|---|
| ARM Cortex-R5F with FPU & MPU | Enables deterministic real-time task scheduling and memory partitioning for ASIL-B software partitions. |
| 6-channel CAN-FD with ECC RAM | Each channel includes 16 KB message RAM with error correction, eliminating packet loss in noisy automotive environments. |
| Integrated 2D graphics engine | Offloads CPU from pixel composition tasks, enabling smooth animation and gauge transitions at 60 fps on WQVGA displays. |
| Secure Hardware Extension (SHE) | Provides AES-128 encryption, SHA-256 hashing, and secure key storage for secure boot and firmware authentication. |
| Real-time clock with automatic calibration | Maintains accurate timekeeping across temperature ranges without external crystal, reducing component count and cost. |
Applications
| Instrument Cluster Control | Digital Gauge Management |
|---|---|
Use Scenario: Centralized dashboard display unit rendering speed, RPM, fuel level, warning icons, and ADAS status on TFT or segmented LCD. IC Role / Device Role / Timing Role: Primary real-time controller executing AUTOSAR-compliant instrument cluster software stack with graphics rendering and CAN-FD gateway functions. Use Value: Integrated 2D engine and 60 fps display timing eliminate need for external GPU; 48-channel ADC enables direct sensor fusion without signal conditioning ICs. | Use Scenario: Driving stepper motors for analog-style speedometer, tachometer, and fuel/temperature needles in premium vehicles. IC Role / Device Role / Timing Role: Dedicated Stepper Motor Controller (SMC) with 6 independent units, each supporting microstepping and current profiling. Use Value: Eliminates external motor driver ICs; SMC units operate autonomously using internal timers and PWM, freeing CPU cycles for UI logic. |
| Vehicle Network Gateway | Secure Boot & OTA Management |
Use Scenario: Aggregating and routing messages between CAN-FD domains (e.g., infotainment ↔ powertrain ↔ chassis) with protocol translation and filtering. IC Role / Device Role / Timing Role: High-throughput CAN-FD hub with 6 independent channels, DMA-accelerated message buffering, and configurable mailbox arbitration. Use Value: 16 KB ECC-protected RAM per channel ensures reliable message queuing under bus load spikes; hardware CRC offloads checksum computation. | Use Scenario: Enabling authenticated firmware updates and secure boot verification in connected automotive ECUs. IC Role / Device Role / Timing Role: SHE-based cryptographic engine performing AES-128 decryption and SHA-256 signature validation prior to code execution. Use Value: Prevents unauthorized firmware injection; secure key storage isolates root-of-trust from main Flash, meeting UNECE R155 cybersecurity management system (CSMS) requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RH850/U2A | 32-bit RH850 core @ 400 MHz; no integrated 2D graphics engine; supports GbE but not CAN-FD natively. | Targeted at higher-end ADAS domain controllers rather than instrument clusters; requires external graphics IP or FPGA for display rendering. | Select when GbE and higher CPU throughput outweigh graphics integration needs; verify CAN-FD implementation via external transceivers. |
| S32K344 | Arm Cortex-M7 @ 320 MHz; 4 MB Flash; includes HSE security module but lacks SHE; no native LCD controller or RGB888 output. | Focused on chassis/safety applications; display support limited to LVDS or MIPI-DSI with external bridge ICs. | Prefer for safety-critical brake or steering control where SHE is not required and graphics are handled externally. |
Compared with RH850/U2A and S32K344, the S6J332CKSESE20000 uniquely combines real-time Arm Cortex-R5F performance, integrated 2D graphics, CAN-FD, and SHE in a single package - making it purpose-built for cost-optimized, graphics-rich automotive instrument clusters requiring ASIL-B compliance and secure OTA capability.
Availability
S6J332CKSESE20000 is available at Aetrix Electronics and suitable for automotive instrument cluster development, digital gauge systems, vehicle network gateways, and secure OTA firmware update platforms requiring stable component supply across extended product lifecycles.
Supply support for S6J332CKSESE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power management, automotive, and security solutions with deep expertise in automotive-grade MCUs and functional safety.
The TRAVEO™ T1G family was designed specifically for automotive instrument clusters and digital cockpit applications, emphasizing real-time responsiveness, graphics acceleration, and integrated safety/security features aligned with ISO 26262 and UNECE R155 standards.
FAQ
What is the maximum operating temperature range for S6J332CKSESE20000?
The S6J332CKSESE20000 is qualified for automotive Grade 2 operation, with a junction temperature range of −40 °C to +125 °C. This rating is validated per AEC-Q100 Rev. G and supports under-dash mounting in passenger compartments and near-engine locations with appropriate thermal design.
Does S6J332CKSESE20000 support AUTOSAR OS and MCAL drivers?
Yes - Infineon provides certified AUTOSAR 4.0.3-compliant MCAL drivers and OS configuration tools for the TRAVEO™ T1G family. These include CAN, ADC, DIO, GPT, ICU, and ETH modules, with full integration support for leading AUTOSAR toolchains including Vector DaVinci and ETAS ISOLAR.
Can the integrated 2D graphics engine render vector-based UI elements?
No - the 2D graphics engine supports only raster-based operations (bitblt, alpha blending, color keying) and does not perform vector path rendering or font rasterization. UI frameworks must pre-render vector assets into bitmaps before loading them into frame buffer memory.
Is external Flash memory required for booting S6J332CKSESE20000?
No - the device boots directly from its internal 4,160 KB program Flash. Boot-ROM (16 KB) handles initial vector fetch and secure boot sequence; no external memory is needed for primary startup, though HyperBus™ interface supports optional external Flash expansion for OTA staging partitions.
S6J332CKSESE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 208-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 150
- Program Memory Size:
- 2.0625MB (2.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 112K x 8
- RAM Size:
- 544K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.5V ~ 5.2V
- Data Converters:
- A/D 48x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J332CKSESE20000 FAQ
1.How can I place an order for S6J332CKSESE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J332CKSESE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J332CKSESE20000 reliable?
The price and inventory of S6J332CKSESE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J332CKSESE20000 is usually 5 days.
3.What payment methods are accepted for S6J332CKSESE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J332CKSESE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J332CKSESE20000?
S6J332CKSESE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J332CKSESE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J332CKSESE20000?
For technical support, including S6J332CKSESE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J332CKSESE20000 requirements.
6.How does Aetrix verify that S6J332CKSESE20000 is sourced from the original manufacturer or authorized distributors?
All S6J332CKSESE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J332CKSESE20000 meets industry standards.
7.What is the process for return or replacement of S6J332CKSESE20000?
All S6J332CKSESE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J332CKSESE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J332CKSESE20000 part is unused and in its original packaging.
Return procedure for S6J332CKSESE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6J332CKSESE20000 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

