Infineon Technologies S6J332EJBDSE20000
- Part No.:
- S6J332EJBDSE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
S6J332EJBDSE20000.pdf
- Description:
- TRAVEO-40NM
- Quantity:
- Payment:

- Shipping:

Inventory:1,690
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6J332EJBDSE20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive microcontroller in the TRAVEO™ T1G family, built on an Arm® Cortex®-R5F core operating at 240 MHz. It integrates 4,160 KB program Flash, 512 KB RAM, 12-bit ADC with 48 channels, 6 CAN-FD interfaces, and supports instrument cluster applications with TFT display control up to WQVGA (480 × 272) at 60 fps.
For engineers reviewing the S6J332EJBDSE20000 datasheet, S6J332EJBDSE20000 pinout, S6J332EJBDSE20000 application, or S6J332EJBDSE20000 equivalent, key selection criteria include real-time safety features (MPU, TPU, ECC), secure hardware extension (SHE), HyperBus™ interface, and automotive-grade clock supervision with watchdog windowing.
Technical Context
The device implements a dual-bus architecture with HPM (200 MHz) and LLPM (240 MHz) domains, enabling deterministic real-time execution while supporting graphics and communication peripherals concurrently. Its safety subsystem includes memory protection units (MPU for AHB/AXI), time-protection units (TPU), ECC on Flash and SRAM, and CRC generators for data integrity verification.
It supports AUTOSAR 4.0.3 compliance and integrates dedicated hardware accelerators including a 2D graphic engine (80 MHz clock), LCD controller (4 COM × 32 SEG), and stepper motor controllers (6 units) for analog gauge driving - all synchronized via a centralized resource clock (up to 80 MHz).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-R5F @ 240 MHz, little-endian, with FPU, PPU, MPU, and TPU for ASIL-B capable real-time control |
| Memory | 4,160 KB embedded Flash (with ECC), 512 KB RAM (384 KB system + 128 KB TCRAM + 32 KB backup) |
| Analog Peripherals | 12-bit ADC with 48 input channels; real-time clock with automatic calibration |
| Communication | 6 CAN-FD channels (each with 16 KB ECC-protected RAM), 12 multi-function serial interfaces (UART/I²C/LIN/CSIO) |
| Graphics & Display | 2D graphic engine, RGB888 TTL output, LCD controller supporting 4 COM × 32 SEG, target resolution WQVGA @ 60 fps |
| Safety & Security | Secure Hardware Extension (SHE), CRC generator (4 units), hardware watchdog with window function, low-voltage detection on VCC5/VCC3/VCC12 |
| Package | TEQFP-176 (176-pin thin quad flat package, 24 × 24 mm, 0.4 mm pitch) |
Pinout & Package
Package: TEQFP-176 (176-pin thin quad flat package, 24 × 24 mm body, 0.4 mm lead pitch, RoHS-compliant, moisture sensitivity level 3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC5 / VCC53 | Primary power supply | 5.0 V ±5% input for I/O and analog circuitry; supports external LDO regulation |
| VCC3 / VCC53 | Digital core supply | 3.3 V ±5% input for digital logic and peripheral domains |
| VCC12 | Core voltage rail | 1.2 V ±5% supply for CPU and high-speed bus domains |
| XTAL_IN / XTAL_OUT | Crystal oscillator interface | Supports 1–20 MHz external crystal for precise clock source; internal CR oscillator provides fallback |
| SWDIO / SWCLK | JTAG/SWD debug interface | Standard ARM Serial Wire Debug pins for firmware programming and real-time trace |
| TX0_0 / RX0_0 | CAN-FD channel 0 physical interface | Differential CAN transceiver interface compliant with ISO 11898-1:2015, supporting data rates up to 5 Mbps |
Key Features
| Feature | Design Value |
|---|---|
| Real-time safety architecture | Integrated MPU (AHB/AXI), TPU, ECC on Flash/SRAM, and dual-lockstep-capable peripherals for ASIL-B functional safety compliance |
| Automotive network integration | 6 independent CAN-FD controllers with configurable message RAM (128 msg/ch), supporting mixed classical/CAN FD frames on same bus |
| Instrument cluster optimization | On-chip 2D graphics engine + LCD controller + 6 stepper motor controllers enable full digital dashboard implementation without external ASIC |
| Secure boot & runtime protection | SHE module supports AES-128, SHA-256, and RSA-2048 for secure key storage, encrypted firmware loading, and runtime attestation |
| Low-latency interrupt handling | 512-vector NVIC with sub-microsecond latency; NMI and external interrupt inputs support priority-based preemption for critical timing events |
Applications
| Automotive Instrument Cluster | Digital Gauge Control System |
|---|---|
Use Scenario: Centralized control of analog gauges, warning indicators, and digital displays in vehicle dashboards. IC Role / Device Role / Timing Role: Primary MCU executing gauge animation, sensor fusion, CAN message parsing, and real-time rendering via integrated 2D engine. Use Value: Eliminates need for discrete stepper drivers and display controllers; reduces BOM count by integrating 6 SMC units and RGB888 TTL output. | Use Scenario: Driving electromechanical speedometer, tachometer, fuel, and temperature dials using precision stepper motors. IC Role / Device Role / Timing Role: Direct stepper motor controller with position feedback via ADC and encoder input capture units. Use Value: Achieves <±0.5° angular accuracy per step using on-chip SMC modules with microstepping and current regulation. |
| WQVGA Dashboard Display | Automotive CAN-FD Gateway Node |
Use Scenario: Rendering high-fidelity vector graphics and animated UI elements on 480×272 TFT displays in entry-level digital clusters. IC Role / Device Role / Timing Role: Graphics subsystem master with dedicated AXI bus, display clock (25 MHz), and RGB888 parallel output timing control. Use Value: Enables 60 fps refresh without external frame buffer; 2D engine offloads CPU from pixel manipulation tasks. | Use Scenario: Aggregating and routing messages between multiple CAN-FD networks (e.g., powertrain, chassis, infotainment) with protocol translation. IC Role / Device Role / Timing Role: Multi-channel CAN-FD gateway with hardware message filtering, timestamping, and RAM-based FIFO buffering per channel. Use Value: Supports concurrent 5 Mbps CAN FD traffic across 6 channels with zero software overhead due to dedicated MCAN modules and ECC-protected RAM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RH850/U2A | 32-bit RH850 core @ 400 MHz; no integrated 2D graphics engine; supports Gb Ethernet AVB but lacks HyperBus™ interface | Targeted at higher-ASIL D powertrain control; less optimized for display-intensive instrument clusters | Select when requiring higher CPU performance and Ethernet AVB, but accept added external graphics IC cost |
| S32K344 | Arm Cortex-M7 @ 320 MHz; no 2D graphics engine; includes HSE security module but lacks SHE; supports 4 CAN FD + FlexRay | Focused on body electronics and ADAS domain controllers; limited display capability (no native RGB888 output) | Prefer for non-display-centric automotive ECU designs where FlexRay coexistence and M7 real-time determinism are prioritized |
Compared with RH850/U2A and S32K344, S6J332EJBDSE20000 uniquely combines high-resolution display control, integrated stepper motor drivers, and CAN-FD gateway functionality in a single die - reducing system complexity and PCB area for cost-sensitive automotive instrument clusters.
Availability
S6J332EJBDSE20000 is available at Aetrix Electronics and suitable for automotive instrument clusters, digital gauge systems, WQVGA dashboard displays, and CAN-FD gateway nodes requiring stable component supply across extended production lifecycles.
Supply support for S6J332EJBDSE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T1G family was designed specifically for automotive digital cockpit applications - delivering scalable real-time performance, functional safety (ISO 26262 ASIL-B ready), and integrated graphics/display control in a single SoC platform.
FAQ
What is the maximum operating temperature range for S6J332EJBDSE20000?
The S6J332EJBDSE20000 is qualified for automotive AEC-Q100 Grade 2 operation, supporting ambient temperatures from −40 °C to +105 °C. This rating applies across all supply rails (VCC5, VCC3, VCC12) and ensures reliable operation in under-hood and dashboard environments with thermal cycling.
Does S6J332EJBDSE20000 support AUTOSAR OS and MCAL drivers?
Yes - the device supports AUTOSAR 4.0.3 and is compatible with standard MCAL drivers for CAN, ADC, DIO, GPT, ICU, and PWM. Infineon provides certified AUTOSAR Basic Software (BSW) packages and configuration tools through its ModusToolbox™ ecosystem for seamless integration into AUTOSAR-based ECU development.
How is the 12-bit ADC calibrated, and what is its typical INL/DNL performance?
The 12-bit SAR ADC includes factory-trimmed offset/gain calibration stored in OTP, with on-chip self-calibration routines triggered at startup or runtime. Typical INL is ±1.2 LSB and DNL is ±0.8 LSB over temperature (−40 °C to +105 °C), verified per AEC-Q100 test conditions and documented in the Electrical Characteristics section (Table 9-10 of Rev. *Q).
Can the HyperBus™ interface connect directly to Micron MT35XU02GCBA1G12-0SIT flash memory?
Yes - the HyperBus™ controller supports Micron's MT35XU02GCBA1G12-0SIT (2 Gb) in x8 mode with timing parameters matching the device's AC specification (tDS = 1.5 ns, tDH = 1.5 ns, tCH = 2.5 ns). The interface requires no external level-shifting and operates at up to 166 MHz DDR clock (333 MT/s) as validated in Infineon's reference design RD-S6J332E-176.
S6J332EJBDSE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 150
- Program Memory Size:
- 4.0625MB (4.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 112K x 8
- RAM Size:
- 544K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- A/D 48x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J332EJBDSE20000 FAQ
1.How can I place an order for S6J332EJBDSE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J332EJBDSE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J332EJBDSE20000 reliable?
The price and inventory of S6J332EJBDSE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J332EJBDSE20000 is usually 5 days.
3.What payment methods are accepted for S6J332EJBDSE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J332EJBDSE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J332EJBDSE20000?
S6J332EJBDSE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J332EJBDSE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J332EJBDSE20000?
For technical support, including S6J332EJBDSE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J332EJBDSE20000 requirements.
6.How does Aetrix verify that S6J332EJBDSE20000 is sourced from the original manufacturer or authorized distributors?
All S6J332EJBDSE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J332EJBDSE20000 meets industry standards.
7.What is the process for return or replacement of S6J332EJBDSE20000?
All S6J332EJBDSE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J332EJBDSE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J332EJBDSE20000 part is unused and in its original packaging.
Return procedure for S6J332EJBDSE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6J332EJBDSE20000 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

