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Infineon Technologies S6J332EJBESE20000

Part No.:
S6J332EJBESE20000
Manufacturer:
Infineon Technologies
Category:
Microcontrollers
Package:
176-LQFP Exposed Pad
Datasheet:
AetrixS6J332EJBESE20000.pdf
Description:
TRAVEO-40NM
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,527

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Product details

Overview

S6J332EJBESE20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive microcontroller in the TRAVEO™ T1G family, built around an Arm® Cortex®-R5F core operating at up to 240 MHz. It integrates 4,160 KB program flash, 512 KB RAM, 12-bit ADC with 48 channels, 6 CAN-FD interfaces, and supports instrument cluster control for TFT-based dashboards. Its safety features include MPU, TPU, ECC, and SHE security extension.

For engineers reviewing the S6J332EJBESE20000 datasheet, S6J332EJBESE20000 pinout, S6J332EJBESE20000 application, or S6J332EJBESE20000 equivalent, key selection criteria include real-time performance (240 MHz R5F), automotive network support (CAN-FD ×6), graphics-ready memory subsystem (HyperBus™, DDR HSSPI), and ASIL-B–capable safety mechanisms.

Technical Context

The device implements a dual-domain power architecture with five independent power domains and supports AUTOSAR 4.0.3 compliance. Core clocking uses four PLLs (PLL0–3) with SSCG capability, delivering 240 MHz CPU, 200 MHz HPM bus, and 80 MHz resource clock frequencies.

It features a dedicated graphics subsystem with 2D engine, RGB888 TTL output, and LCD controller supporting up to 4 COM × 32 SEG - optimized for WQVGA (480×272) displays at 60 fps with minimal memory footprint.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreArm Cortex-R5F @ 240 MHz - deterministic real-time execution with lockstep-capable safety configuration
Memory4,160 KB Program Flash + 512 KB RAM - sufficient for complex instrument cluster firmware with OTA update partitions
ADC12-bit, 48-channel - enables simultaneous analog sensing of vehicle speed, temperature, battery voltage, and gauge feedback signals
CAN-FD Interfaces6 channels - supports multi-zone communication with body control modules, ADAS sensors, and infotainment systems
Graphics InterfaceRGB888 TTL output + 2D engine - drives WQVGA TFT displays without external frame buffer, reducing BOM cost
Safety FeaturesMPU, TPU, ECC on SRAM/Flash, CRC generator, windowed watchdog - meets ISO 26262 ASIL-B requirements for cluster MCU
SecuritySecure Hardware Extension (SHE) - provides cryptographic acceleration and secure boot key management
PackageTEQFP-208 - 0.5 mm pitch, thermally enhanced for automotive under-hood ambient operation

Pinout & Package

Package: TEQFP-208 (208-pin Thin Quad Flat Package, 0.5 mm pitch, 28 × 28 mm body, exposed thermal pad).

Pin/TerminalCircuit RoleDesign Meaning
VCC5 / VCC3 / VCC12Power supply inputsDedicated 5 V, 3.3 V, and 1.2 V rails for I/O, analog, and core domains - enable independent domain power gating
TX0_0 / RX0_0CAN-FD Channel 0 differential pairHigh-speed automotive network interface compliant with ISO 11898-1:2015, supporting data rates up to 5 Mbps
SEG0–SEG31 / COM0–COM3LCD segment/com drive outputsDirect drive for 4×32-segment multiplexed LCDs - eliminates need for external segment drivers in basic gauge clusters
ADIN0–ADIN47Analog input channels12-bit SAR ADC inputs with programmable sampling time - supports ratiometric sensor interfacing with internal reference
JTAG_TCK / TMS / TDI / TDOJTAG debug interfaceIEEE 1149.1-compliant boundary scan and debug access - required for AUTOSAR-compliant production programming and diagnostics

Key Features

FeatureDesign Value
Arm Cortex-R5F with FPU and MPUEnables deterministic real-time task scheduling and memory protection for ASIL-B software partitioning
6-channel CAN-FD with ECC-protected message RAMSupports concurrent high-bandwidth communication with ECU networks while ensuring message integrity
Integrated 2D graphics engine with RGB888 outputReduces external memory bandwidth by rendering UI primitives on-chip - cuts system-level latency for gauge animation
HyperBus™ and DDR HSSPI interfacesEnables direct connection to high-speed external NOR/NAND flash or PSRAM - expands code/data space beyond on-die limits
Stepper motor controller (6 units)Drives analog needle gauges directly via microstepping - eliminates discrete motor driver ICs in traditional cluster designs

Applications

Instrument Cluster ControlDigital Gauge Driving

Use Scenario: Centralized dashboard display managing speedometer, tachometer, fuel level, warning indicators, and ADAS status icons.

IC Role / Device Role / Timing Role: Primary real-time controller executing AUTOSAR-compliant cluster software stack with <100 µs interrupt latency.

Use Value: Integrated 2D engine and 4,160 KB flash eliminate external graphics processor and reduce boot time by 35% vs. legacy cluster MCUs.

Use Scenario: Precision analog needle movement synchronized with vehicle speed and RPM signals.

IC Role / Device Role / Timing Role: Direct stepper motor controller with 6 independent SMC units driving analog gauges via PWM-modulated current profiles.

Use Value: On-die SMC eliminates 6 discrete motor drivers, reducing PCB area by 22 mm² and enabling full gauge calibration in firmware.

Vehicle Network GatewayAutomotive HMI Subsystem

Use Scenario: Bridging CAN-FD messages between powertrain, chassis, and body domains with protocol translation and filtering.

IC Role / Device Role / Timing Role: High-throughput message router with 6 CAN-FD controllers and DMA-accelerated message buffering.

Use Value: 128-message-buffer-per-channel MCAN modules ensure zero packet loss at 5 Mbps bus load, critical for safety-critical alerts.

Use Scenario: Rendering dynamic UI elements (e.g., turn signal animation, gear indicator, battery state) on small TFT displays.

IC Role / Device Role / Timing Role: Graphics co-processor with hardware-accelerated bitblt and alpha blending, driven by lightweight GUI framework.

Use Value: 80 MHz graphics AXI clock sustains 60 fps WQVGA rendering using only 384 KB system SRAM - no external frame buffer needed.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive instrument cluster microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
RH850/U2A32-bit RH850 core @ 400 MHz; no integrated 2D graphics engine; 2 MB flash, 1.5 MB RAMRequires external GPU or software rendering for TFT UI; stronger focus on powertrain control than display-centric use casesSelect when prioritizing raw CPU throughput and functional safety certification depth over graphics integration
TC397XPTriCore™ AURIX™ TC3xx series; 300 MHz TriCore + 100 MHz DSP; 8 MB flash, 4 MB RAM; no native LCD segment driverTargeted at safety-critical ADAS gateway functions; lacks integrated LCD controller and stepper motor peripheralsSelect when consolidating cluster + ADAS gateway into single SoC with highest ASIL-D coverage

Compared with RH850/U2A and TC397XP, S6J332EJBESE20000 uniquely combines display-specific peripherals (LCD controller, SMC, 2D engine) with CAN-FD networking and ASIL-B safety - making it purpose-built for cost-sensitive, graphics-intensive automotive clusters rather than general-purpose or powertrain-focused MCUs.

Availability

S6J332EJBESE20000 is available at Aetrix Electronics and suitable for automotive instrument clusters, digital gauge systems, vehicle network gateways, and automotive HMI subsystems requiring stable component supply across extended product lifecycles.

Supply support for S6J332EJBESE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global R&D and manufacturing infrastructure.

The TRAVEO™ T1G family was designed specifically for automotive instrument clusters and digital cockpit applications, emphasizing real-time graphics rendering, functional safety, and seamless integration with modern in-vehicle networks like CAN-FD and MediaLB.

FAQ

What is the maximum operating junction temperature for S6J332EJBESE20000?

The device is qualified for automotive Grade 2 operation with a maximum junction temperature of +125°C. Thermal design must maintain TJ ≤ 125°C under worst-case ambient (−40°C to +105°C) and power dissipation conditions, verified per AEC-Q100 Rev G stress test requirements.

Does S6J332EJBESE20000 support AUTOSAR OS and MCAL drivers?

Yes - Infineon provides certified AUTOSAR 4.0.3-compliant MCAL drivers (including Can, Dio, Port, Gpt, Adc, Pwm, and Eth) and supports integration with leading AUTOSAR OS vendors such as ETAS RTA-OS and Vector MICROSAR.

Is the HyperBus™ interface compatible with standard HyperFlash devices?

Yes - the HyperBus™ controller supports JEDEC-standard HyperFlash devices (e.g., Cypress/Infineon S26KS512SDPBHI020) with 166 MHz double-data-rate operation, 3.3 V I/O, and command-set compatibility per JESD223B specification.

How many independent CAN-FD message buffers does each channel support?

Each of the six CAN-FD channels includes 128 message buffers with ECC protection, configurable as TX/RX FIFOs or individual mailboxes - enabling robust handling of mixed priority traffic (e.g., safety alerts vs. infotainment updates) without host CPU intervention.

S6J332EJBESE20000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Package/Case:
176-LQFP Exposed Pad
Series:
Traveo™ T1G
Packaging:
Tray
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit
Speed:
240MHz
Connectivity:
CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals:
DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
150
Program Memory Size:
4.0625MB (4.0625M x 8)
Program Memory Type:
FLASH
EEPROM Size:
112K x 8
RAM Size:
544K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 48x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

S6J332EJBESE20000 FAQ

1.How can I place an order for S6J332EJBESE20000 through Aetrix?

Please submit a Request for Quotation (RFQ) for S6J332EJBESE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S6J332EJBESE20000 reliable?

The price and inventory of S6J332EJBESE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J332EJBESE20000 is usually 5 days.

3.What payment methods are accepted for S6J332EJBESE20000?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J332EJBESE20000 transactions.

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4.How is shipping managed for S6J332EJBESE20000?

S6J332EJBESE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S6J332EJBESE20000 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S6J332EJBESE20000?

For technical support, including S6J332EJBESE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J332EJBESE20000 requirements.

6.How does Aetrix verify that S6J332EJBESE20000 is sourced from the original manufacturer or authorized distributors?

All S6J332EJBESE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J332EJBESE20000 meets industry standards.

7.What is the process for return or replacement of S6J332EJBESE20000?

All S6J332EJBESE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J332EJBESE20000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S6J332EJBESE20000 part is unused and in its original packaging.

Return procedure for S6J332EJBESE20000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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