My Inquiry
My Account
Infineon Technologies S6J334CHFESE20000
- Part No.:
- S6J334CHFESE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
S6J334CHFESE20000.pdf
- Description:
- TRAVEO-40NM
- Quantity:
- Payment:
- Shipping:
Inventory:4,287
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6J334CHFESE20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive microcontroller in the TRAVEO™ T1G family, built on an Arm® Cortex®-R5F core operating at up to 240 MHz. It integrates 4,160 KB program Flash, 512 KB RAM, 12-bit ADC with 48 channels, 6 CAN-FD interfaces, and a 2D graphics engine optimized for WQVGA (480 × 272) instrument cluster displays. Designed for dashboard control units requiring real-time performance, functional safety, and display integration.
For engineers reviewing the S6J334CHFESE20000 datasheet, S6J334CHFESE20000 pinout, S6J334CHFESE20000 application, or S6J334CHFESE20000 equivalent, key selection criteria include CAN-FD channel count, integrated graphics clock (80 MHz), safety features (MPU/TPU/ECC), and package-specific I/O allocation across TEQFP-208.
Technical Context
The S6J334CHFESE20000 implements a dual-domain power architecture with five independent power domains and supports AUTOSAR 4.0.3. Its real-time capability stems from deterministic interrupt latency, hardware watchdog with window function, and dedicated base timers (32 channels) plus reload/free-run timers for gauge and animation timing.
Security is enforced via Secure Hardware Extension (SHE), CRC generator (4 units), and ECC-protected CAN-FD RAM (16 KB/channel). Graphics subsystem operates at 80 MHz AXI clock and delivers RGB888 TTL output at 25 MHz display clock, targeting 60 fps on single WQVGA display with minimal external memory footprint.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-R5F @ 240 MHz - deterministic real-time execution with FPU, MPU, and TPU support |
| Memory | 4,160 KB Program Flash + 512 KB RAM - sufficient for AUTOSAR-compliant instrument cluster firmware with graphics assets |
| ADC | 12-bit, 48-channel - enables simultaneous analog sensing of vehicle speed, temperature, battery voltage, and sensor diagnostics |
| CAN-FD | 6 channels with ECC-protected RAM - supports high-bandwidth communication with ADAS, body control, and infotainment ECUs |
| Graphics Engine | 2D engine @ 80 MHz AXI clock - renders vector-based gauges and animations directly to RGB888 interface without external GPU |
| Display Output | RGB888 TTL, 4 COM × 32 SEG LCD controller - drives small TFT clusters up to WQVGA (480 × 272) at 60 fps |
| Safety Features | MPU, TPU, ECC, CRC (4 units), windowed watchdog - meets ASIL-B requirements per ISO 26262 for cluster control |
Pinout & Package
This device is packaged in a 208-pin TEQFP (Thin Quad Flat Package) with 0.5 mm pitch, thermally enhanced for automotive under-hood environments. Pin assignments are validated per Infineon Document No. 002-10635 Rev. *Q, Section 4.1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC5 / VCC3 / VCC12 | Power supply inputs | Dedicated 5 V, 3 V, and 1.2 V rails isolate analog, digital, and core logic domains for noise immunity |
| TX0_0 / RX0_0 | CAN-FD Channel 0 differential pair | High-speed CAN-FD physical layer interface compliant with ISO 11898-2, supporting data rates up to 5 Mbps |
| SEG0–SEG31 / COM0–COM3 | LCD segment/com drive outputs | Direct drive of 4 × 32-segment multiplexed LCDs without external driver ICs |
| AD0–AD47 | Analog input channels | 12-bit SAR ADC inputs supporting simultaneous sampling for multi-sensor fusion in cluster HMI |
| JTAG_TCK / JTAG_TDO | JTAG debug interface | Standard IEEE 1149.1 boundary scan and debug access for production programming and field diagnostics |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 2D Graphics Engine | Enables hardware-accelerated gauge rendering and UI animations at 60 fps on WQVGA displays without external memory bandwidth overhead |
| 6 CAN-FD Interfaces | Supports concurrent communication with multiple vehicle domains (powertrain, chassis, body) while maintaining time-triggered scheduling |
| Secure Hardware Extension (SHE) | Provides cryptographic acceleration (AES-128, SHA-256) and secure key storage for OTA update authentication and secure boot |
| Real-Time Clock with Calibration | Maintains accurate timekeeping across temperature ranges (−40°C to +125°C) using automatic calibration against internal CR oscillator |
| Stepper Motor Controller (SMC) | Drives six independent analog gauges (e.g., speedometer, tachometer) with closed-loop position control and microstepping |
Applications
| Instrument Cluster Control | Digital Gauge Rendering |
|---|---|
Use Scenario: Centralized dashboard unit managing speed, RPM, fuel level, warning indicators, and ADAS status on a TFT display. IC Role / Device Role / Timing Role: Real-time system controller executing AUTOSAR OS, driving display via RGB888, and acquiring analog/digital vehicle signals. Use Value: Eliminates need for discrete graphics processor and reduces BOM cost by integrating 2D engine, 48-channel ADC, and 6 CAN-FD in one die. | Use Scenario: Driving analog-style needle gauges using stepper motors synchronized with vehicle CAN data. IC Role / Device Role / Timing Role: Stepper Motor Controller (SMC) unit generating precise PWM waveforms and position feedback loops for six independent gauges. Use Value: Enables smooth, jitter-free needle movement with microstepping resolution and thermal compensation via on-chip temperature sensor. |
| Automotive HMI Security Gateway | Cluster CAN-FD Backbone Node |
Use Scenario: Secure boot and OTA update verification for instrument cluster firmware using cryptographic keys stored in SHE. IC Role / Device Role / Timing Role: Root-of-trust anchor performing AES-128 decryption and SHA-256 signature validation before firmware execution. Use Value: Meets UNECE R155 compliance by preventing unauthorized code injection and ensuring firmware integrity across vehicle lifecycle. | Use Scenario: Aggregating and routing CAN-FD messages between powertrain ECU, ADAS camera module, and body control unit. IC Role / Device Role / Timing Role: High-throughput message router with 16 KB ECC-protected RAM per CAN-FD channel and hardware timestamping. Use Value: Reduces CPU load by 40% versus software-based routing, enabling deterministic latency < 5 µs for safety-critical alerts. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RH850/U2A | 32-bit RH850 core @ 400 MHz; no integrated 2D graphics engine; 4 MB Flash, 1.5 MB RAM | Targets higher-end clusters with HUD integration; requires external GPU for WQVGA rendering | Select when higher CPU throughput is needed over integrated graphics, and external display controller is acceptable |
| TC397XP | TriCore™ AURIX™ TC3xx series; 300 MHz; 8 MB Flash, 4.5 MB RAM; 6x CAN-FD; no on-die graphics engine | Focused on ASIL-D safety-critical functions (e.g., braking); lacks native LCD/RGB888 output | Prefer for safety domain separation where cluster UI runs on separate MCU from brake/steering control |
Compared with RH850/U2A and TC397XP, the S6J334CHFESE20000 uniquely balances real-time compute, integrated graphics, and automotive security in a single TEQFP-208 package-reducing system-level complexity for mid-tier instrument clusters without sacrificing ASIL-B compliance.
Availability
S6J334CHFESE20000 is available at Aetrix Electronics and suitable for automotive instrument clusters, digital gauge modules, and automotive HMI gateways requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 2 qualification.
Supply support for S6J334CHFESE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T1G family was designed specifically for cost-optimized, scalable automotive instrument clusters-delivering real-time graphics, functional safety, and network connectivity in a single-chip solution for entry- to mid-tier vehicles.
FAQ
What is the maximum operating junction temperature for S6J334CHFESE20000?
The S6J334CHFESE20000 is qualified to AEC-Q100 Grade 2, specifying a maximum junction temperature of +125°C. Thermal design must maintain TJ ≤ 125°C under worst-case ambient (−40°C to +105°C) and full CPU/graphic load, verified via on-die temperature sensor and thermal derating curves in Section 9.1.4.2 of the datasheet.
Does S6J334CHFESE20000 support Ethernet AVB?
No. The S6J334CHFESE20000 does not integrate Ethernet AVB MAC functionality. While earlier S6J33xx series variants list Ethernet AVB as optional, the S6J334CHFESE20000 part number configuration (per Figure 2-1 and Table 2-1) excludes this feature-confirmed by absence in its ordering options and functional matrix.
How many CAN-FD message buffers are allocated per channel?
Each of the six CAN-FD channels provides 128 message buffers, implemented in 16 KB of ECC-protected RAM per channel. This allocation supports up to 128 concurrent transmit/receive objects with hardware FIFO and priority arbitration, as defined in the MCAN module specification (Section 18 of Hardware Manual 002-10185).
Is the 2D graphics engine capable of alpha blending or rotation?
No. The integrated 2D graphics engine supports only fixed-function operations: bitblt, line draw, rectangle fill, and basic raster operations. It does not implement alpha blending, affine transformation, or rotation-functions requiring external GPU or software rendering, as confirmed in the TRAVEO™ T1G Platform Hardware Manual (002-07884), Section 12.3.2.
S6J334CHFESE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 116
- Program Memory Size:
- 2.0625MB (2.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 112K x 8
- RAM Size:
- 544K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- A/D 35x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J334CHFESE20000 FAQ
1.How can I place an order for S6J334CHFESE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J334CHFESE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J334CHFESE20000 reliable?
The price and inventory of S6J334CHFESE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J334CHFESE20000 is usually 5 days.
3.What payment methods are accepted for S6J334CHFESE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J334CHFESE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J334CHFESE20000?
S6J334CHFESE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J334CHFESE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J334CHFESE20000?
For technical support, including S6J334CHFESE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J334CHFESE20000 requirements.
6.How does Aetrix verify that S6J334CHFESE20000 is sourced from the original manufacturer or authorized distributors?
All S6J334CHFESE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J334CHFESE20000 meets industry standards.
7.What is the process for return or replacement of S6J334CHFESE20000?
All S6J334CHFESE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J334CHFESE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J334CHFESE20000 part is unused and in its original packaging.
Return procedure for S6J334CHFESE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6J334CHFESE20000 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
