Infineon Technologies S6J334DHEESE20000
- Part No.:
- S6J334DHEESE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
S6J334DHEESE20000.pdf
- Description:
- TRAVEO-40NM
- Quantity:
- Payment:

- Shipping:

Inventory:2,017
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6J334DHEESE20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive microcontroller in the TRAVEO™ T1G family, built around an Arm® Cortex®-R5F core operating at 240 MHz. It integrates 4,160 KB program Flash, 512 KB RAM, 12-bit ADC with 48 channels, 6 CAN-FD interfaces, and supports instrument cluster applications with TFT display control up to WQVGA (480 × 272) at 60 fps.
For engineers reviewing the S6J334DHEESE20000 datasheet, S6J334DHEESE20000 pinout, S6J334DHEESE20000 application, or S6J334DHEESE20000 equivalent, key selection criteria include real-time safety features (MPU, TPU, ECC), secure hardware extension (SHE), dual-domain power management, and support for automotive networks including CAN-FD and optional APIX® ARH.
Technical Context
The S6J334DHEESE20000 implements a single-core Arm Cortex-R5F with lockstep-capable safety mechanisms, 16-channel DMA, and five independent power domains. Its clock system includes four PLLs with SSCG capability, programmable CRC generators, and a dedicated low-latency interrupt controller supporting 512 vectors.
It features integrated graphics acceleration via a 2D graphic engine clocked at 80 MHz, RGB888 TTL display output, and LCD controller supporting up to 4 COM × 32 SEG. Memory subsystem includes HyperBus™ interface, DDR High-Speed SPI, and external bus interface - all designed for deterministic latency in automotive cluster rendering and control loops.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-R5F @ 240 MHz - deterministic real-time execution with MPU/TPU for ASIL-B compliance |
| Memory | 4,160 KB Program Flash + 512 KB RAM - sufficient for AUTOSAR 4.0.3 stack plus cluster UI firmware |
| ADC | 12-bit, 48-channel - supports analog sensor monitoring across gauges, buttons, and thermal inputs |
| CAN-FD | 6 channels with ECC-protected RAM - enables high-bandwidth communication with body ECUs and ADAS modules |
| Display Interface | RGB888 TTL output + LCD controller (4 COM × 32 SEG) - drives small TFT clusters without external timing controller |
| Security | Secure Hardware Extension (SHE) - provides cryptographic key management and secure boot enforcement |
| Power Domains | 5 independent domains - allows selective shutdown of graphics, comms, or sensor subsystems to meet ISO 26262 power budgeting |
Pinout & Package
Package: TEQFP-208 (208-pin Thin Quad Flat Package, 0.5 mm pitch, 17 × 17 mm body).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC5 / VCC3 / VCC12 | Power supply inputs | Dedicated 5 V, 3 V, and 1.2 V rails - decoupling required per domain for EMI suppression and voltage stability |
| TX0_0 / RX0_0 … TX5_1 / RX5_1 | CAN-FD transceiver I/O | 6 independent differential CAN-FD pairs - each with internal termination and configurable bit rate up to 5 Mbps |
| SEG0–SEG31 / COM0–COM3 | LCD segment/com drive outputs | Direct drive for 4 × 32-segment multiplexed displays - eliminates need for external LCD driver IC |
| AD0–AD47 | Analog input channels | 48-channel 12-bit SAR ADC inputs - shared with GPIO; supports scan mode with hardware trigger from base timer |
| PG0–PG31 / PH0–PH31 / PJ0–PJ31 / PK0–PK31 | General-purpose I/O | 148 total GPIOs - configurable as UART/I²C/SPI/CAN/LIN/CSIO with slew-rate and pull-up/down control |
Key Features
| Feature | Design Value |
|---|---|
| Real-time safety architecture | MPU, TPU, ECC on Flash/RAM, and windowed watchdog - meets ASIL-B requirements per ISO 26262 Part 5 |
| Dual-bus memory subsystem | HPM (200 MHz) and LLPM (240 MHz) buses - enables concurrent graphics rendering and control loop execution without contention |
| Integrated 2D graphics engine | Hardware-accelerated blitting and alpha blending - reduces CPU load for animated gauge overlays and warning icons |
| Automotive network flexibility | 12 multi-function serial interfaces supporting UART/CSIO/LIN/I²C + 6 CAN-FD + optional APIX® ARH - simplifies gateway integration |
| Low-power domain control | 5 independent power domains with software-gated clocks - enables sub-100 µA sleep current in instrument cluster standby mode |
Applications
| Automotive Instrument Cluster | Digital Gauge Control Unit |
|---|---|
|
Use Scenario: Centralized dashboard display managing speedometer, tachometer, fuel level, and ADAS alerts on a 480×272 TFT panel. IC Role / Device Role / Timing Role: Primary real-time controller executing gauge animation, CAN-FD message parsing, and safety-critical warning logic. Use Value: Integrated 2D graphics engine and RGB888 output eliminate external GPU, reducing BOM cost and PCB area by ~25% versus discrete solutions. |
Use Scenario: Driving six stepper motors for analog-style needle gauges (fuel, oil pressure, battery, coolant, turbo boost, voltage) with smooth motion profiles. IC Role / Device Role / Timing Role: Dedicated Stepper Motor Controller (SMC) units with microstepping and acceleration ramp generation. Use Value: On-chip SMC handles 6 independent gauges with synchronized timing - removes need for 6 external motor drivers and associated PWM controllers. |
| Vehicle Warning System | Cluster Gateway Interface |
|
Use Scenario: Real-time aggregation of fault codes from engine, transmission, and brake ECUs to generate visual warnings (e.g., red triangle, brake failure icon). IC Role / Device Role / Timing Role: Safety-monitoring node using MPU-enforced memory isolation and CRC-checked CAN-FD message buffers. Use Value: Hardware CRC generator and ECC-protected CAN-FD RAM ensure integrity of diagnostic messages - eliminates software CRC overhead and memory corruption risk. |
Use Scenario: Bridging legacy LIN-based HVAC controls and modern CAN-FD ADAS sensors into unified cluster UI updates. IC Role / Device Role / Timing Role: Protocol translation hub with 12 configurable serial interfaces and time-triggered scheduling via base timers. Use Value: Single-chip protocol bridging avoids external bridge ICs and reduces inter-ECU latency to <50 µs for critical warning propagation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive cluster microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RH850/U2A | 32-bit RH850 core @ 400 MHz; no integrated 2D graphics engine; supports GDC offload via AXI | Requires external graphics controller for TFT rendering; higher peak performance but larger software stack | Preferred when cluster resolution exceeds WQVGA or when AUTOSAR Classic + Adaptive coexistence is required |
| S32K344 | Arm Cortex-M7 @ 320 MHz; no native LCD controller; relies on MIPI DSI or parallel RGB with external PHY | Lacks integrated segment/COM LCD driver - unsuitable for direct-drive analog gauge panels | Selected for scalable gateway functions where cluster display is handled by separate SoC or display processor |
Compared with RH850/U2A and S32K344, the S6J334DHEESE20000 uniquely combines real-time safety, on-die graphics acceleration, and direct LCD segment driving - enabling compact, cost-optimized instrument clusters without external display or motor control ICs.
Availability
S6J334DHEESE20000 is available at Aetrix Electronics and suitable for automotive instrument clusters, digital gauge control units, vehicle warning systems, and cluster gateway interfaces requiring stable component supply across extended temperature ranges (−40°C to +125°C).
Supply support for S6J334DHEESE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T1G family - including S6J334DHEESE20000 - was developed to deliver scalable, safety-certified microcontrollers for automotive digital instrument clusters, integrating graphics, motor control, and secure networking in a single die.
FAQ
What is the maximum operating temperature range for S6J334DHEESE20000?
The S6J334DHEESE20000 is qualified for operation from −40°C to +125°C ambient temperature, meeting AEC-Q100 Grade 2 requirements. This rating applies to all functional blocks including CPU, Flash, ADC, CAN-FD peripherals, and graphics engine under specified voltage and clock conditions.
Does S6J334DHEESE20000 support AUTOSAR 4.x?
Yes - the device supports AUTOSAR 4.0.3 through certified MCAL drivers provided by Infineon, covering CAN-FD, ADC, ICU, GPT, PORT, and DIO modules. The integrated MPU and memory protection unit enable safe partitioning of AUTOSAR OS applications.
Is external RAM required for graphics rendering?
No - the S6J334DHEESE20000 includes 384 KB system SRAM and 32 KB backup RAM, sufficient for frame buffers at WQVGA resolution (480 × 272 × 3 bytes = ~393 KB) when using double-buffering and compression techniques supported by the 2D graphics engine.
How many CAN-FD message buffers are allocated per channel?
Each of the six CAN-FD channels includes 128 message buffers implemented in ECC-protected RAM, supporting flexible TX/RX FIFO and mailbox configurations. Buffer allocation is programmable via MCAN module registers and managed by the integrated DMA controller.
S6J334DHEESE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 116
- Program Memory Size:
- 3.0625MB (3.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 112K x 8
- RAM Size:
- 544K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- A/D 35x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J334DHEESE20000 FAQ
1.How can I place an order for S6J334DHEESE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J334DHEESE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J334DHEESE20000 reliable?
The price and inventory of S6J334DHEESE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J334DHEESE20000 is usually 5 days.
3.What payment methods are accepted for S6J334DHEESE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J334DHEESE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J334DHEESE20000?
S6J334DHEESE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J334DHEESE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J334DHEESE20000?
For technical support, including S6J334DHEESE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J334DHEESE20000 requirements.
6.How does Aetrix verify that S6J334DHEESE20000 is sourced from the original manufacturer or authorized distributors?
All S6J334DHEESE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J334DHEESE20000 meets industry standards.
7.What is the process for return or replacement of S6J334DHEESE20000?
All S6J334DHEESE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J334DHEESE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J334DHEESE20000 part is unused and in its original packaging.
Return procedure for S6J334DHEESE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6J334DHEESE20000 Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.

