My Inquiry
My Account
Infineon Technologies S6J334DHFESE20000
- Part No.:
- S6J334DHFESE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 144-LQFP Exposed Pad
- Datasheet:
-
S6J334DHFESE20000.pdf
- Description:
- TRAVEO-40NM
- Quantity:
- Payment:
- Shipping:
Inventory:1,611
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6J334DHFESE20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive microcontroller in the TRAVEO™ T1G family, built around an Arm® Cortex®-R5F core operating at up to 240 MHz. It integrates 4,160 KB program Flash, 512 KB SRAM, 6-channel CAN-FD, 48-channel 12-bit ADC, and real-time graphics acceleration for instrument cluster control with TFT displays up to WQVGA (480 × 272) at 60 fps.
For engineers reviewing the S6J334DHFESE20000 datasheet, S6J334DHFESE20000 pinout, S6J334DHFESE20000 application, or S6J334DHFESE20000 equivalent, key selection criteria include deterministic real-time performance via R5F lockstep-ready architecture, integrated SHE security module, AUTOSAR 4.0.3 compliance, and support for LCD controller (4 COM × 32 SEG) and 2D graphic engine with RGB888 output.
Technical Context
The S6J334DHFESE20000 implements a dual-core Arm Cortex-R5F configuration with split-lock capability, supporting functional safety per ISO 26262 ASIL-B. Its clock system includes four independent PLLs (PLL0–3) with SSCG, programmable CRC generators (4 units), and hardware watchdog with window function - all managed under five isolated power domains.
It features a dedicated graphics AXI bus running at 80 MHz, display clock source selectable between internal graphic engine clock or external reference, and integrated HyperBus™ interface for high-speed off-chip memory expansion. Safety mechanisms include MPU for AHB/AXI, TPU, ECC on CAN-FD RAM (16 KB/ch), and low-voltage detection on both VCC5 and internal LDO outputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-R5F @ 240 MHz, little-endian, with FPU, PPU, MPU, and TPU for ASIL-B runtime safety enforcement |
| Memory | 4,160 KB embedded Flash, 512 KB SRAM (384 KB system + 128 KB TCRAM + 32 KB backup), 16 KB Boot-ROM |
| ADC | 12-bit SAR ADC with 48 input channels, supporting simultaneous sampling for gauge and sensor signal acquisition |
| CAN-FD | 6 independent CAN-FD controllers with ECC-protected 16 KB message RAM per channel, enabling multi-domain vehicle network communication |
| Graphics Interface | RGB888 TTL output driving single WQVGA (480×272) display at 60 fps; 2D graphic engine clocked at 80 MHz |
| Security | Secure Hardware Extension (SHE) module for cryptographic key management and secure boot; CRC generator (4 units) for data integrity verification |
| Package | TEQFP-208 with 0.5 mm pitch, qualified per AEC-Q100 Grade 2 (−40°C to +105°C) |
Pinout & Package
Package: TEQFP-208 (208-pin Thin Quad Flat Package, 0.5 mm pitch, body size 17 mm × 17 mm, 1.0 mm height), AEC-Q100 Grade 2 qualified.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC5 / VCC53 | Primary analog/digital supply | 5.0 V ±5% input for I/O banks and internal LDO regulation; supports dual-rail operation with 3.3 V domain |
| VCC12 | Core power supply | 1.2 V ±5% supply for CPU, memory, and logic blocks; monitored by internal LDO supervisor |
| XTAL_IN / XTAL_OUT | Crystal oscillator interface | Supports 1–20 MHz external crystal for precise clock generation; used for RTC and system stabilization |
| SWDIO / SWCLK | JTAG/SWD debug interface | Standard ARM Serial Wire Debug pins enabling non-intrusive real-time debugging and flash programming |
| TX0_0 / RX0_0 | CAN-FD Channel 0 transceiver | Differential CAN FD physical layer interface compliant with ISO 11898-1:2015; supports data rates up to 5 Mbps |
| SEG0–SEG31 / COM0–COM3 | LCD segment/com drive outputs | Direct-drive capability for 4 COM × 32 SEG passive-matrix LCDs used in analog-style gauge clusters |
Key Features
| Feature | Design Value |
|---|---|
| Real-time graphics pipeline | Integrated 2D graphic engine with RGB888 output and display clock source selection enables deterministic frame rendering without external GPU |
| Dual-core safety architecture | Arm Cortex-R5F cores configurable in lockstep or split mode, with dedicated TPU and MPU enforcing ASIL-B timing and memory isolation |
| Automotive network integration | 6 CAN-FD channels with ECC-protected message RAM and hardware timestamping support multi-domain ECU communication and diagnostics |
| Low-latency peripheral control | Stepper motor controller (6 units), base timer (32 channels), and input capture/output compare (12 channels each) enable direct analog gauge actuation |
| Secure boot & runtime protection | SHE module provides AES-128 encryption, SHA-256 hashing, and secure key storage; CRC generators (4 units) validate firmware and data integrity |
Applications
| Instrument Cluster Control | Digital Gauge Actuation |
|---|---|
Use Scenario: Central MCU in automotive digital instrument clusters driving TFT-LCDs and electromechanical gauges. IC Role / Device Role / Timing Role: Real-time graphics rendering engine and stepper motor controller coordinating visual and analog output updates at 60 Hz. Use Value: Eliminates need for separate display controller and motor driver ICs; reduces BOM count while maintaining ASIL-B compliance. | Use Scenario: Direct control of analog speedometer, tachometer, fuel, and temperature needles using stepper motors. IC Role / Device Role / Timing Role: On-chip SMC (6 units) generates precise phase-current waveforms synchronized to CAN-FD received vehicle speed and RPM signals. Use Value: Enables sub-degree needle positioning accuracy and smooth motion profiles without external motor drivers or timing ICs. |
| Vehicle Network Gateway | Secure Dashboard Telematics |
Use Scenario: Aggregation and translation of CAN-FD messages across multiple vehicle domains (powertrain, chassis, body). IC Role / Device Role / Timing Role: High-throughput message routing engine with hardware timestamping and buffer management across six independent CAN-FD channels. Use Value: Supports deterministic latency <100 µs per message and concurrent handling of >128 active CAN IDs without software overhead. | Use Scenario: Secure dashboard subsystem managing OTA update verification, driver authentication, and encrypted UI state persistence. IC Role / Device Role / Timing Role: SHE-based secure boot loader and runtime key vault protecting critical UI assets and user preferences. Use Value: Meets UNECE R155 cybersecurity management system (CSMS) requirements for production vehicle dashboards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive instrument cluster microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RH850/U2A | 32-bit RH850 core @ 400 MHz; no integrated 2D graphics engine; requires external display controller | Targeted at high-performance cluster systems with larger displays (>HD resolution); lacks native LCD segment drive | Select when higher CPU throughput is needed and display subsystem is implemented externally |
| TC397 | TriCore™ AURIX™ TC3xx series; triple-lockstep TriCore cores; integrated HSM for EVITA-Medium security | Focused on ADAS and central gateway applications; less optimized for graphics-intensive cluster UI rendering | Select when ASIL-D functional safety and hardware security module (HSM) are mandatory beyond SHE-level protection |
Compared with RH850/U2A and TC397, the S6J334DHFESE20000 uniquely balances real-time graphics acceleration, integrated LCD segment drive, and SHE-based security in a single AEC-Q100 Grade 2 package - making it optimal for cost-sensitive, WQVGA-class instrument clusters requiring minimal external components.
Availability
S6J334DHFESE20000 is available at Aetrix Electronics and suitable for automotive instrument cluster development, digital gauge control, and vehicle network gateway designs requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualification.
Supply support for S6J334DHFESE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T1G family - including S6J334DHFESE20000 - was designed specifically for automotive digital instrument clusters, combining real-time graphics, safety-critical control, and automotive network interfaces in a single scalable platform.
FAQ
What is the maximum operating temperature range for S6J334DHFESE20000?
The S6J334DHFESE20000 is qualified per AEC-Q100 Grade 2, supporting continuous operation from −40°C to +105°C ambient temperature. Internal thermal monitoring includes low-voltage detection on VCC5 and VCC12 rails, and the on-chip temperature sensor provides real-time die temperature feedback via ADC channel AN0.
Does S6J334DHFESE20000 support AUTOSAR OS and MCAL drivers?
Yes - the S6J334DHFESE20000 is certified for AUTOSAR 4.0.3 compliance. Infineon provides full MCAL driver stack (including CAN, ADC, DIO, GPT, ICU, PWM, and ETH) and compatible AUTOSAR OS configurations validated for this part number, with support for both single-core and lockstep R5F modes.
Can the integrated 2D graphic engine drive displays other than RGB888?
No - the 2D graphic engine outputs only RGB888 TTL format at up to 25 MHz pixel clock. It does not support LVDS, MIPI DSI, or parallel RGB666/565 formats. Display interface is fixed to single-output TTL; external bridge ICs are required for alternative physical layer standards.
Is external Flash memory required for S6J334DHFESE20000 operation?
No - the device contains 4,160 KB of embedded program Flash and 512 KB of SRAM, sufficient for full instrument cluster firmware including graphics assets, AUTOSAR stack, and application logic. External HyperBus™ memory is optional and used only for extended asset storage (e.g., high-res icons or animation frames), not for code execution.
S6J334DHFESE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 144-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 116
- Program Memory Size:
- 3.0625MB (3.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 112K x 8
- RAM Size:
- 544K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- A/D 35x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J334DHFESE20000 FAQ
1.How can I place an order for S6J334DHFESE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J334DHFESE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J334DHFESE20000 reliable?
The price and inventory of S6J334DHFESE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J334DHFESE20000 is usually 5 days.
3.What payment methods are accepted for S6J334DHFESE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J334DHFESE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J334DHFESE20000?
S6J334DHFESE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J334DHFESE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J334DHFESE20000?
For technical support, including S6J334DHFESE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J334DHFESE20000 requirements.
6.How does Aetrix verify that S6J334DHFESE20000 is sourced from the original manufacturer or authorized distributors?
All S6J334DHFESE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J334DHFESE20000 meets industry standards.
7.What is the process for return or replacement of S6J334DHFESE20000?
All S6J334DHFESE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J334DHFESE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J334DHFESE20000 part is unused and in its original packaging.
Return procedure for S6J334DHFESE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6J334DHFESE20000 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
