My Inquiry
My Account
Infineon Technologies S6J334DJTESE20000
- Part No.:
- S6J334DJTESE20000
- Manufacturer:
- Infineon Technologies
- Category:
- Microcontrollers
- Package:
- 176-LQFP Exposed Pad
- Datasheet:
-
S6J334DJTESE20000.pdf
- Description:
- TRAVEO-40NM
- Quantity:
- Payment:
- Shipping:
Inventory:4,295
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S6J334DJTESE20000 from Infineon Technologies (formerly Cypress) is a 32-bit automotive microcontroller in the TRAVEO™ T1G family, built around an Arm® Cortex®-R5F core operating at up to 240 MHz. It integrates 4,160 KB program Flash, 512 KB SRAM, 6-channel CAN-FD, 48-channel 12-bit ADC, and a 2D graphics engine optimized for WQVGA (480 × 272) instrument cluster displays with RGB888 TTL output.
For engineers reviewing the S6J334DJTESE20000 datasheet, S6J334DJTESE20000 pinout, S6J334DJTESE20000 application, or S6J334DJTESE20000 equivalent, key selection considerations include real-time safety features (MPU, TPU, ECC), automotive network support (CAN-FD, optional MediaLB/ARH), secure hardware extension (SHE), and TFT display timing control with 60 fps frame rate capability.
Technical Context
The S6J334DJTESE20000 implements a dual-domain power architecture with five independent power domains and supports AUTOSAR 4.0.3. Its Arm Cortex-R5F core runs in lockstep-capable single-core mode with 16 KB instruction and 16 KB data caches, and includes a dedicated Safety Island with TPU, MPU, and ECC-protected memory subsystems.
It delivers deterministic real-time performance via 32 base timers, 6 reload timers, 8 free-run timers, and 12-channel input capture/output compare units. Graphics rendering is handled by a dedicated 2D engine clocked at up to 80 MHz, synchronized to a 25 MHz display clock with programmable RGB888 output timing for direct TFT interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Arm Cortex-R5F @ 240 MHz - hard real-time execution with TPU-assisted interrupt latency control |
| Memory | 4,160 KB Program Flash + 512 KB SRAM - sufficient for AUTOSAR BSW + complex cluster GUI firmware |
| ADC | 48-channel 12-bit SAR ADC - supports analog sensor inputs for speed, temperature, and warning indicators |
| CAN-FD | 6 independent channels with 16 KB ECC-protected RAM per channel - enables high-bandwidth dashboard telemetry and ECU coordination |
| Graphics | 2D engine + RGB888 TTL output @ 25 MHz - drives WQVGA (480×272) TFTs at 60 fps without external frame buffer |
| Security | Secure Hardware Extension (SHE) + CRC generator + watchdog with window function - meets ISO 26262 ASIL-B requirements |
| Package | TEQFP-208 - 208-pin thermally enhanced quad flat package with 0.5 mm pitch for automotive PCB routing |
Pinout & Package
Package: TEQFP-208 (208-pin Thin Quad Flat Package, 0.5 mm pitch, 28 mm × 28 mm body, 1.0 mm max height). Pin assignments are validated per Infineon Document No. 002-10635 Rev. *Q, Sections 4.1–4.2 and Table 2-2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC5 / VCC3 / VCC12 | Power supply inputs | Dedicated 5 V, 3 V, and 1.2 V rails - enable domain-isolated power sequencing for safety-critical peripherals |
| TX0_0 / RX0_0 … TX5_1 / RX5_1 | CAN-FD transceiver I/O | 6 independent differential CAN-FD bus interfaces - support concurrent communication with ADAS, body control, and powertrain ECUs |
| SEG0–SEG31 / COM0–COM3 | LCD segment/com drive outputs | Direct 4 COM × 32 SEG LCD controller - eliminates external segment drivers for monochrome gauge overlays |
| RGB[23:0] | Parallel RGB888 video output | 24-bit TTL-level pixel data bus - interfaces directly to TFT source driver ICs without timing bridge logic |
| TCK / TMS / TDI / TDO | JTAG debug interface | IEEE 1149.1-compliant boundary scan and debug - enables production test and in-system firmware update |
Key Features
| Feature | Design Value |
|---|---|
| Real-time safety architecture | TPU + MPU + ECC on Flash/SRAM - enables ASIL-B compliance without software overhead |
| Dual-clock domain operation | HPM bus @ 200 MHz / LLPM bus @ 240 MHz - decouples graphics rendering from control-loop timing |
| Stepper motor control | 6 integrated SMC units - drive analog gauges (fuel, speed, temp) with closed-loop position feedback |
| Low-latency interrupt handling | 512-vector NVIC with <1 µs response - ensures deterministic reaction to CAN-FD message arrival or fault events |
| HyperBus™ interface | External NOR/NAND Flash expansion up to 2 GB - supports over-the-air (OTA) update storage separate from main firmware |
Applications
| Digital Instrument Cluster | Automotive Gauge Control Unit |
|---|---|
|
Use Scenario: Centralized dashboard display unit rendering speedometer, tachometer, fuel level, and warning icons on a 480×272 TFT. IC Role / Device Role / Timing Role: Primary graphics controller and real-time gauge actuation processor with synchronized PWM and stepper motor outputs. Use Value: Eliminates need for external GPU or display controller; 60 fps refresh and 25 MHz RGB clock ensure flicker-free analog needle animation. |
Use Scenario: Analog gauge module driving electromechanical speedometer and fuel needle using precision stepper motors. IC Role / Device Role / Timing Role: Dedicated stepper motor controller (SMC) with current regulation and microstepping resolution. Use Value: 6 integrated SMC units drive up to six gauges with closed-loop position correction, reducing BOM count by 6 discrete motor drivers. |
| CAN-FD Telemetry Aggregator | Automotive Safety Monitor Node |
|
Use Scenario: In-vehicle data concentrator collecting and preprocessing CAN-FD messages from engine, transmission, and chassis ECUs. IC Role / Device Role / Timing Role: High-throughput CAN-FD message filtering, timestamping, and local decision-making before forwarding to head unit. Use Value: 6 independent CAN-FD channels with 128-message buffers each enable concurrent logging of 10+ vehicle signals at 5 Mbps without host CPU intervention. |
Use Scenario: Redundant monitoring node validating voltage, temperature, and clock integrity across critical subsystems. IC Role / Device Role / Timing Role: Independent safety island executing watchdog supervision, LVD detection, and clock supervisor checks. Use Value: Hardware-enforced separation between safety monitor and application core ensures fail-safe shutdown even during firmware corruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive instrument cluster microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NXP S32K344 | Arm Cortex-M7 core @ 320 MHz; no integrated 2D graphics engine; supports Ethernet TSN but lacks RGB888 TTL output | Targeted at central gateway or domain controller roles - requires external display controller for TFT clusters | Select when system-level integration favors multi-core M7 + Linux RTOS over R5F + bare-metal GUI stack |
| Renesas RH850/U2A | 32-bit proprietary core @ 400 MHz; 128 KB on-chip RAM; no CAN-FD native support - requires external transceivers and protocol stacks | Focused on powertrain and chassis control - limited graphics capability and no dedicated LCD/RGB interface | Select for high-reliability engine management where display functionality is delegated to a companion MCU |
Compared with NXP S32K344 and Renesas RH850/U2A, the S6J334DJTESE20000 uniquely integrates real-time graphics rendering, CAN-FD, and stepper motor control in a single die - reducing inter-IC latency and board space for compact instrument cluster designs.
Availability
S6J334DJTESE20000 is available at Aetrix Electronics and suitable for automotive digital instrument clusters, CAN-FD telemetry aggregators, and electromechanical gauge control units requiring stable component supply across extended vehicle lifecycles.
Supply support for S6J334DJTESE20000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power management, automotive MCUs, and security solutions, with global R&D and manufacturing infrastructure.
The TRAVEO™ T1G family was designed specifically for automotive instrument clusters and digital cockpit systems, emphasizing real-time determinism, functional safety (ISO 26262), and integrated graphics to minimize external components.
FAQ
What is the maximum supported display resolution and refresh rate for S6J334DJTESE20000?
The S6J334DJTESE20000 supports WQVGA resolution (480 × 272 pixels) at 60 fps via its RGB888 TTL interface, with a fixed 25 MHz pixel clock. The 2D graphics engine is optimized for this target; higher resolutions require external frame buffer or scaling logic not integrated in this device.
Does S6J334DJTESE20000 include hardware support for AUTOSAR OS and MCAL?
Yes - the device is certified for AUTOSAR 4.0.3 and includes hardware features required by MCAL drivers: memory protection unit (MPU), interrupt controller with vector table, ECC on Flash/SRAM, and CAN-FD peripheral registers compliant with AUTOSAR CAN Driver specifications.
How many CAN-FD channels are implemented, and what is their memory allocation?
Six CAN-FD channels are implemented, each with 16 KB of dedicated ECC-protected RAM - equivalent to 128 message buffers per channel. This allows concurrent reception/transmission of up to 768 CAN-FD messages without host CPU polling or DMA intervention.
Is the S6J334DJTESE20000 pin-compatible with other S6J33xx series devices?
No - S6J334DJTESE20000 uses the TEQFP-208 package, while S6J3310/3320/3330 variants use TEQFP-144 or TEQFP-176 packages. Pin mapping differs across packages; migration requires PCB redesign and signal reassignment per Infineon's Package Comparison Tables (Doc 002-10635, Section 2.2.3).
S6J334DJTESE20000 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 176-LQFP Exposed Pad
- Series:
- Traveo™ T1G
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit
- Speed:
- 240MHz
- Connectivity:
- CANbus, CSIO, I2C, LINbus, UART/USART
- Peripherals:
- DMA, I2S, LVD, POR, PWM, WDT
- Number of I/O:
- 150
- Program Memory Size:
- 3.0625MB (3.0625M x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- 112K x 8
- RAM Size:
- 544K x 8
- Voltage - Supply (Vcc/Vdd):
- 3.5V ~ 5.5V
- Data Converters:
- A/D 48x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
S6J334DJTESE20000 FAQ
1.How can I place an order for S6J334DJTESE20000 through Aetrix?
Please submit a Request for Quotation (RFQ) for S6J334DJTESE20000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S6J334DJTESE20000 reliable?
The price and inventory of S6J334DJTESE20000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S6J334DJTESE20000 is usually 5 days.
3.What payment methods are accepted for S6J334DJTESE20000?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S6J334DJTESE20000 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S6J334DJTESE20000?
S6J334DJTESE20000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S6J334DJTESE20000 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S6J334DJTESE20000?
For technical support, including S6J334DJTESE20000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S6J334DJTESE20000 requirements.
6.How does Aetrix verify that S6J334DJTESE20000 is sourced from the original manufacturer or authorized distributors?
All S6J334DJTESE20000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S6J334DJTESE20000 meets industry standards.
7.What is the process for return or replacement of S6J334DJTESE20000?
All S6J334DJTESE20000 units undergo pre-shipment inspection (PSI). If there is an issue with S6J334DJTESE20000, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S6J334DJTESE20000 part is unused and in its original packaging.
Return procedure for S6J334DJTESE20000:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S6J334DJTESE20000 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
